Review and comparison of shearography and pulsed thermography for adhesive bond evaluation

Y.Y. Hung; Nelson Ng; Rolly Ng; Steven M. Shepard; YuLin Hou; James R. Lhota

doi:10.1117/1.2741277

1 May 2007 Review and comparison of shearography and pulsed thermography for adhesive bond evaluation

Y.Y. Hung, Nelson Ng, Rolly Ng, Steven M. Shepard, YuLin Hou, James R. Lhota

Author Affiliations +

Optical Engineering, Vol. 46, Issue 5, 051007 (May 2007). https://doi.org/10.1117/1.2741277

Abstract

To reduce costs and facilitate automation in the automotive industry, adhesive bonding has gained popularity as a replacement for conventional mechanical fasteners such as bolts, screws, rivets, and welding. Adhesive bonding is particularly useful for bonding parts made of plastics and polymer composites, which are playing an increasing role in reducing vehicle weight. However, the adhesive bonding process is more susceptible to quality variations during manufacturing than traditional joining and fastening methods. Shearography and pulsed thermography are full-field, noncontact, nondestructive testing methods that are widely used in the aerospace industry, offering significant potential as practical tools for in-process inspection of adhesive bond quality. The two techniques are often used to address a common set of aerospace applications, e.g., delaminations or skin-to-core disbonds in composite structures. However, they are fundamentally different, based on different flaw detection mechanisms: Shearography measures the sample's mechanical response to mechanical stresses, while pulsed thermography measures the sample's thermal response to an instantaneous thermal excitation. For the convenience of potential users and readers, the authors review shearography and pulsed thermography. The potential of these techniques for inspecting adhesive bonding is demonstrated and compared.

©(2007) Society of Photo-Optical Instrumentation Engineers (SPIE)

Citation Download Citation

Y.Y. Hung, Nelson Ng, Rolly Ng, Steven M. Shepard, YuLin Hou, and James R. Lhota "Review and comparison of shearography and pulsed thermography for adhesive bond evaluation," Optical Engineering 46(5), 051007 (1 May 2007). https://doi.org/10.1117/1.2741277

Published: 1 May 2007

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available