"Solder joint reliability evaluation of chip scale package using a modified ..."

Ikuo Shohji, Hideo Mori, Yasumitsu Orii (2004)

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DOI: 10.1016/J.MICROREL.2003.08.015

access: closed

type: Journal Article

metadata version: 2020-02-22

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Ikuo Shohji, Hideo Mori, Yasumitsu Orii:
Solder joint reliability evaluation of chip scale package using a modified Coffin-Manson equation. Microelectron. Reliab. 44(2): 269-274 (2004)

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