"Thermal-Aware Incremental Floorplanning for 3D ICs Based on MILP Formulation."

Yuchun Ma et al. (2009)

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DOI: 10.1587/TRANSFUN.E92.A.2979

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type: Journal Article

metadata version: 2024-07-29

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Yuchun Ma, Xin Li, Yu Wang, Xianlong Hong:
Thermal-Aware Incremental Floorplanning for 3D ICs Based on MILP Formulation. IEICE Trans. Fundam. Electron. Commun. Comput. Sci. 92-A(12): 2979-2989 (2009)

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