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2020 – today
- 2024
[j57]Zhengfeng Huang, Zishuai Li
, Liting Sun, Huaguo Liang, Tianming Ni, Aibin Yan:
A Quadruple-Node Upsets Hardened Latch Design Based on Cross-Coupled Elements. J. Electron. Test. 40(1): 19-30 (2024)- [j56]Zhengfeng Huang, Yan Zhang, Lei Ai, Huaguo Liang, Tianming Ni, Tai Song, Aibin Yan:
Designs of High-Speed Triple-Node-Upset Hardened Latch Based on Dual-Modular-Redundancy. J. Circuits Syst. Comput. 33(5): 2450092:1-2450092:25 (2024) - [j55]Jingchang Bian, Zhengfeng Huang, Yankun Lin, Zhao Yang, Huaguo Liang, Tianming Ni:
Reliability analysis and comparison of ring-PUF based on probabilistic models. Microelectron. J. 144: 106072 (2024) - [j54]Tianming Ni, Kejie Xu, Hao Wu, Senling Wang, Mu Nie:
A demultiplexer-based dual-path switching true random number generator. Microelectron. J. 151: 106363 (2024) - [j53]Hui Xu, Lin Tang, Ruijun Ma, Huaguo Liang, Zhengfeng Huang, Tianming Ni, Jiuqi Li, Xiaodong Ai:
A cost-effective and highly robust triple-node-upset self-recoverable latch design based on dual-output C-elements. Microelectron. J. 153: 106422 (2024) - [j52]Zhengfeng Huang, Xin Chen, Xinyu Jiang, Lei Ai, Huaguo Liang, Yiming Ouyang, Tianming Ni:
Design of radiation hardened latch with low delay and tolerance of quadruple-node-upset in 32 nm process. Microelectron. J. 153: 106428 (2024) - [j51]Zhengfeng Huang, Jingchang Bian, Yankun Lin, Huaguo Liang, Tianming Ni:
Design Guidelines and Feedback Structure of Ring Oscillator PUF for Performance Improvement. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 43(1): 71-84 (2024) - [j50]Aibin Yan, Zhixing Li, Zhongyu Gao, Jing Zhang, Zhengfeng Huang, Tianming Ni, Jie Cui, Xiaolei Wang, Patrick Girard, Xiaoqing Wen:
MURLAV: A Multiple-Node-Upset Recovery Latch and Algorithm-Based Verification Method. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 43(7): 2205-2214 (2024) - [j49]Aibin Yan, Yu Chen, Zhongyu Gao, Tianming Ni, Zhengfeng Huang, Jie Cui, Patrick Girard, Xiaoqing Wen:
FeMPIM: A FeFET-Based Multifunctional Processing-in-Memory Cell. IEEE Trans. Circuits Syst. II Express Briefs 71(4): 2299-2303 (2024) - [j48]Tianming Ni, Xiaoqing Wen, Hussam Amrouch, Cheng Zhuo, Peilin Song:
Introduction to the Special Issue on Design for Testability and Reliability of Security-aware Hardware. ACM Trans. Design Autom. Electr. Syst. 29(1): 1:1-1:3 (2024) - [j47]Aibin Yan, Litao Wang, Jie Cui, Zhengfeng Huang, Tianming Ni, Patrick Girard, Xiaoqing Wen:
Nonvolatile Latch Designs With Node-Upset Tolerance and Recovery Using Magnetic Tunnel Junctions and CMOS. IEEE Trans. Very Large Scale Integr. Syst. 32(1): 116-127 (2024) - [c31]Aibin Yan, Chen Dong, Xing Guo, Jie Song, Jie Cui, Tianming Ni, Patrick Girard, Xiaoqing Wen:
IDLD: Interlocked Dual-Circle Latch Design with Low Cost and Triple-Node-Upset-Recovery for Aerospace Applications. ACM Great Lakes Symposium on VLSI 2024: 19-24 - [c30]Zhengfeng Huang, Yankun Lin, Fansheng Zeng, Jingchang Bian, Zhao Yang, Huaguo Liang, Yingchun Lu, Liang Yao, Xiaoqing Wen, Tianming Ni:
PFO PUF: A Lightweight Parallel Feed Obfuscation PUF Resistant to Machine Learning Attacks. ITC-Asia 2024: 1-6 - [c29]Senling Wang, Shaoqi Wei, Hisashi Okamoto, Tatusya Nishikawa, Hiroshi Kai, Yoshinobu Higami, Hiroyuki Yotsuyanagi, Ruijun Ma, Tianming Ni, Hiroshi Takahashi, Xiaoqing Wen:
Test Point Selection for Multi-Cycle Logic BIST using Multivariate Temporal-Spatial GCNs. ITC-Asia 2024: 1-6 - 2023
- [j46]Aibin Yan, Yuting He, Xiaoxiao Niu, Jie Cui, Tianming Ni, Zhengfeng Huang, Patrick Girard, Xiaoqing Wen:
A Highly Robust and Low-Power Flip-Flop Cell With Complete Double-Node-Upset Tolerance for Aerospace Applications. IEEE Des. Test 40(4): 34-41 (2023) - [j45]Zhengfeng Huang, Zhouyu Gong, Dongxing Ma, Xiaolei Wang, Yingchun Lu, Wenfa Zhan, Huaguo Liang, Tianming Ni:
Fault-avoidance C-element based low overhead and TNU-resilient latch. Microelectron. J. 131: 105650 (2023) - [j44]Zhengfeng Huang, Lanxi Duan, Yan Zhang, Tianming Ni, Aibin Yan:
A Soft-Error-Immune Quadruple-Node-Upset Tolerant Latch. IEEE Trans. Aerosp. Electron. Syst. 59(3): 2621-2632 (2023) - [j43]Aibin Yan, Zhixing Li, Jie Cui, Zhengfeng Huang, Tianming Ni, Patrick Girard, Xiaoqing Wen:
Designs of Two Quadruple-Node-Upset Self-Recoverable Latches for Highly Robust Computing in Harsh Radiation Environments. IEEE Trans. Aerosp. Electron. Syst. 59(3): 2885-2897 (2023) - [j42]Zhengfeng Huang, Dongxing Ma, Runwu Ji, Huaguo Liang, Aibin Yan, Tai Song, Tianming Ni:
Overhead Optimized and Quadruple-Node-Upset Self-Recoverable Latch Design Based on Looped C-Element Matrix. IEEE Trans. Aerosp. Electron. Syst. 59(6): 9357-9367 (2023) - [j41]Aibin Yan, Zhixing Li, Jie Cui, Zhengfeng Huang, Tianming Ni, Patrick Girard, Xiaoqing Wen:
LDAVPM: A Latch Design and Algorithm-Based Verification Protected Against Multiple-Node-Upsets in Harsh Radiation Environments. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42(6): 2069-2073 (2023) - [j40]Tianming Ni, Qingsong Peng, Jingchang Bian, Liang Yao, Zhengfeng Huang, Aibin Yan, Senling Wang, Xiaoqing Wen:
Design of True Random Number Generator Based on Multi-Ring Convergence Oscillator Using Short Pulse Enhanced Randomness. IEEE Trans. Circuits Syst. I Regul. Pap. 70(12): 5074-5085 (2023) - [j39]Aibin Yan, Runqi Liu, Jie Cui, Tianming Ni, Patrick Girard, Xiaoqing Wen, Jiliang Zhang:
Designs of BCD Adder Based on Excess-3 Code in Quantum-Dot Cellular Automata. IEEE Trans. Circuits Syst. II Express Briefs 70(6): 2256-2260 (2023) - [j38]Aibin Yan, Aoran Cao, Zhengfeng Huang, Jie Cui, Tianming Ni, Patrick Girard, Xiaoqing Wen, Jiliang Zhang:
Two Double-Node-Upset-Hardened Flip-Flop Designs for High-Performance Applications. IEEE Trans. Emerg. Top. Comput. 11(4): 1070-1081 (2023) - [j37]Aobo Li, Dongsheng Liu, Cong Zhang, Xiang Li, Shuo Yang, Xingjie Liu, Jiahao Lu, Xuecheng Zou, Ang Hu, Tianming Ni:
A Flexible and High-Performance Lattice-Based Post-Quantum Crypto Secure Coprocessor. IEEE Trans. Ind. Informatics 19(2): 1874-1883 (2023) - [j36]Xiao Dong, Yufei Chen, Jun Chen, Yucheng Wang, Ji Li, Tianming Ni, Zhiguo Shi, Xunzhao Yin, Cheng Zhuo:
Worst-case Power Integrity Prediction Using Convolutional Neural Network. ACM Trans. Design Autom. Electr. Syst. 28(4): 54:1-54:19 (2023) - [c28]Tianming Ni, Fei Li, Qingsong Peng, Senling Wang, Xiaoqing Wen:
A Lightweight and Machine-Learning-Resistant PUF framework based on Nonlinear Structure and Obfuscating Challenges. AsianHOST 2023: 1-6 - [c27]Mu Nie, Wen Jiang, Wankou Yang, Senling Wang, Xiaoqing Wen, Tianming Ni:
Enhancing Defect Diagnosis and Localization in Wafer Map Testing Through Weakly Supervised Learning. ATS 2023: 1-6 - [c26]Aibin Yan, Xuehua Li, Zhongyu Gao, Zhengfeng Huang, Tianming Ni, Xiaoqing Wen:
Advanced DICE Based Triple-Node-Upset Recovery Latch with Optimized Overhead for Space Applications. ATS 2023: 1-5 - [c25]Senling Wang, Shaoqi Wei, Jun Ma, Hiroshi Kai, Yoshinobu Higami, Hiroshi Takahashi, Akihiro Shimizu, Xiaoqing Wen, Tianming Ni:
SASL-JTAG: A Light-Weight Dependable JTAG. DFT 2023: 1-3 - [c24]Aibin Yan, Xuehua Li, Tianming Ni, Zhengfeng Huang, Xiaoqing Wen:
A Robust and High-Performance Flip-Flop with Complete Soft-Error Recovery. DSA 2023: 474-476 - [c23]Aibin Yan, Shaojie Wei, Jinjun Zhang, Jie Cui, Jie Song, Tianming Ni, Patrick Girard, Xiaoqing Wen:
A Low Area and Low Delay Latch Design with Complete Double-Node-Upset-Recovery for Aerospace Applications. ACM Great Lakes Symposium on VLSI 2023: 167-171 - [c22]Aibin Yan, Yang Chang, Jing Xiang, Hao Luo, Jie Cui, Zhengfeng Huang, Tianming Ni, Xiaoqing Wen:
Two Highly Reliable and High-Speed SRAM Cells for Safety-Critical Applications. ACM Great Lakes Symposium on VLSI 2023: 293-298 - [c21]Aibin Yan, Jing Xiang, Zhengfeng Huang, Tianming Ni, Jie Cui, Patrick Girard, Xiaoqing Wen:
Design of A Highly Reliable and Low-Power SRAM With Double-Node Upset Recovery for Safety-critical Applications. ITC-Asia 2023: 1-6 - [c20]Aibin Yan, Fan Xia, Tianming Ni, Jie Cui, Zhengfeng Huang, Patrick Girard, Xiaoqing Wen:
A Low Overhead and Double-Node-Upset Self-Recoverable Latch. ITC-Asia 2023: 1-5 - 2022
- [j35]Tianming Ni, Jingchang Bian, Zhao Yang, Mu Nie, Liang Yao, Zhengfeng Huang, Aibin Yan, Xiaoqing Wen:
Broadcast-TDMA: A Cost-Effective Fault-Tolerance Method for TSV Lifetime Reliability Enhancement. IEEE Des. Test 39(5): 34-42 (2022) - [j34]Tai Song, Tianming Ni, Zhengfeng Huang, Jinlei Wan:
Valid test pattern identification for VLSI adaptive test. Integr. 82: 1-6 (2022) - [j33]Aibin Yan, Kuikui Qian, Tai Song, Zhengfeng Huang, Tianming Ni, Yu Chen, Xiaoqing Wen:
A double-node-upset completely tolerant CMOS latch design with extremely low cost for high-performance applications. Integr. 86: 22-29 (2022) - [j32]Qi Xu, Hao Geng, Tianming Ni, Song Chen, Bei Yu, Yi Kang, Xiaoqing Wen:
Fortune: A New Fault-Tolerance TSV Configuration in Router-Based Redundancy Structure. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41(10): 3182-3187 (2022) - [j31]Jianguo Cui, Maoxiang Yi, Di Cao, Liang Yao, Xinyu Wang, Huaguo Liang, Zhengfeng Huang, Haochen Qi, Tianming Ni, Yingchun Lu:
Design of True Random Number Generator Based on Multi-Stage Feedback Ring Oscillator. IEEE Trans. Circuits Syst. II Express Briefs 69(3): 1752-1756 (2022) - [j30]Aibin Yan, Zhelong Xu, Xiangfeng Feng, Jie Cui, Zhili Chen, Tianming Ni, Zhengfeng Huang, Patrick Girard, Xiaoqing Wen:
Novel Quadruple-Node-Upset-Tolerant Latch Designs With Optimized Overhead for Reliable Computing in Harsh Radiation Environments. IEEE Trans. Emerg. Top. Comput. 10(1): 404-413 (2022) - [j29]Kang Yang, Dan Wu, Wengen Gao, Tianming Ni, Qiannian Zhang, Hongwei Zhang, Dengchao Huang:
Calibration of SQUID Magnetometers in Multichannel MCG System Based on Bi-Planar Coil. IEEE Trans. Instrum. Meas. 71: 1-9 (2022) - [c19]Tianming Ni, Qingsong Peng, Jingchang Bian, Liang Yao, Zhengfeng Huang, Aibin Yan, Xiaoqing Wen:
MRCO: A Multi-ring Convergence Oscillator-based High-Efficiency True Random Number Generator. AsianHOST 2022: 1-6 - [c18]Liang Yao, Huaguo Liang, Hong Zhang, Tianming Ni, Maoxiang Yi, Yingchun Lu:
A Lightweight M_TRNG Design based on MUX Cell Entropy using Multiphase Sampling. AsianHOST 2022: 1-4 - [c17]Aibin Yan, Zhixing Li, Shiwei Huang, Zijie Zhai, Xiangyu Cheng, Jie Cui, Tianming Ni, Xiaoqing Wen, Patrick Girard:
SCLCRL: Shuttling C-elements based Low-Cost and Robust Latch Design Protected against Triple Node Upsets in Harsh Radiation Environments. DATE 2022: 1257-1262 - [c16]Aibin Yan, Zhen Zhou, Shaojie Wei, Jie Cui, Yong Zhou, Tianming Ni, Patrick Girard, Xiaoqing Wen:
A Highly Robust, Low Delay and DNU-Recovery Latch Design for Nanoscale CMOS Technology. ACM Great Lakes Symposium on VLSI 2022: 255-260 - [c15]Aibin Yan, Shukai Song, Jixiang Zhang, Jie Cui, Zhengfeng Huang, Tianming Ni, Xiaoqing Wen, Patrick Girard:
Cost-Optimized and Robust Latch Hardened against Quadruple Node Upsets for Nanoscale CMOS. ITC-Asia 2022: 73-78 - 2021
- [j28]Aibin Yan, Aoran Cao, Zhelong Xu, Jie Cui, Tianming Ni, Patrick Girard, Xiaoqing Wen:
Design of Radiation Hardened Latch and Flip-Flop with Cost-Effectiveness for Low-Orbit Aerospace Applications. J. Electron. Test. 37(4): 489-502 (2021) - [j27]Tai Song, Huaguo Liang, Zhengfeng Huang, Tianming Ni, Ying Sun:
Chip test pattern reordering method using adaptive test to reduce cost for testing of ICs. IEICE Electron. Express 18(2): 20200420 (2021) - [j26]Zhengfeng Huang, Zian Su, Tianming Ni, Qi Xu, Haochen Qi, Yingchun Lu, Manzi Eric, Hui Xu:
Cross-Layer Dual Modular Redundancy Hardened Scheme of Flip-Flop Design Based on Sense-Amplifier. J. Circuits Syst. Comput. 30(5): 2120003:1-2120003:16 (2021) - [j25]Aibin Yan, Zhihui He, Jun Zhou, Jie Cui, Tianming Ni, Zhengfeng Huang, Xiaoqing Wen, Patrick Girard:
Dual-modular-redundancy and dual-level error-interception based triple-node-upset tolerant latch designs for safety-critical applications. Microelectron. J. 111: 105034 (2021) - [j24]Zhengfeng Huang, Di Cao, Jianguo Cui, Yingchun Lu, Huaguo Liang, Yiming Ouyang, Tianming Ni, Zhenmin Li:
Design of node separated triple-node-upset self-recoverable latch. Microelectron. J. 114: 105111 (2021) - [j23]Zhengfeng Huang, Xiandong Li, Zhouyu Gong, Huaguo Liang, Yingchun Lu, Yiming Ouyang, Tianming Ni:
Design of MNU-Resilient latches based on input-split C-elements. Microelectron. J. 116: 105243 (2021) - [j22]Zhengfeng Huang, Shangjie Pan, Hao Wang, Huaguo Liang, Tianming Ni:
LC-TSL: A low-cost triple-node-upset self-recovery latch design based on heterogeneous elements for 22 nm CMOS. Microelectron. J. 117: 105281 (2021) - [j21]Zhengfeng Huang, Hao Wang, Yang Ang, Huaguo Liang, Yiming Ouyang, Tianming Ni:
A high-speed and triple-node-upset recovery latch with heterogeneous interconnection. Microelectron. J. 118: 105290 (2021) - [j20]Tianming Ni, Qi Xu, Zhengfeng Huang, Huaguo Liang, Aibin Yan, Xiaoqing Wen:
A Cost-Effective TSV Repair Architecture for Clustered Faults in 3-D IC. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 40(9): 1952-1956 (2021) - [j19]Tianming Ni, Zhao Yang, Hao Chang, Xiaoqiang Zhang, Lin Lu, Aibin Yan, Zhengfeng Huang, Xiaoqing Wen:
A Novel TDMA-Based Fault Tolerance Technique for the TSVs in 3D-ICs Using Honeycomb Topology. IEEE Trans. Emerg. Top. Comput. 9(2): 724-734 (2021) - [c14]Aibin Yan, Aoran Cao, Zhengzheng Fan, Zhelong Xu, Tianming Ni, Patrick Girard, Xiaoqing Wen:
A 4NU-Recoverable and HIS-Insensitive Latch Design for Highly Robust Computing in Harsh Radiation Environments. ACM Great Lakes Symposium on VLSI 2021: 301-306 - [c13]Liang Qi, Tianming Ni, Xinyu Qin, Mingyi Chen, Yongfu Li, Guoxing Wang:
Continuous-time Delta-Sigma Modulators: Single-loop versus MASH. ISOCC 2021: 252-253 - [c12]Chang Hao, Zhengfeng Huang, Tianming Ni:
Kelvin Bridge Structure Based TSV Test for Weak Faults. ITC-Asia 2021: 1-6 - [c11]Huaguo Liang, Danqing Li, Zhao Yang, Tianming Ni, Zhengfeng Huang, Cuiyun Jiang:
A N: 1 Single-Channel TDMA Fault-Tolerant Technique for TSVs in 3D-ICs. ITC-Asia 2021: 1-5 - [c10]Aibin Yan, Zijie Zhai, Lele Wang, Jixiang Zhang, Ningning Cui, Tianming Ni, Xiaoqing Wen:
Parallel DICE Cells and Dual-Level CEs based 3-Node-Upset Tolerant Latch Design for Highly Robust Computing. ITC-Asia 2021: 1-5 - [c9]Aibin Yan, Kuikui Qian, Jie Cui, Ningning Cui, Tianming Ni, Zhengfeng Huang, Xiaoqing Wen:
A Sextuple Cross-Coupled Dual-Interlocked-Storage-Cell based Multiple-Node-Upset Self-Recoverable Latch. NANOARCH 2021: 1-6 - [c8]Chang Hao, Xu Yong, Tianming Ni:
A Test Method for Large-size TSV Considering Resistive Open Fault and Leakage Fault Coexistence. VLSI-DAT 2021: 1-4 - 2020
- [j18]Tai Song, Huaguo Liang, Tianming Ni, Zhengfeng Huang, Yingchun Lu, Jinlei Wan, Aibin Yan:
Pattern Reorder for Test Cost Reduction Through Improved SVMRANK Algorithm. IEEE Access 8: 147965-147972 (2020) - [j17]Xiaoqiang Zhang, Xinggan Zhang, Lan Tang, Xinxing Zheng, Tianming Ni, Ning Wu:
A low critical path delay structure for composite field AES S-box based on constant matrices multiplication merging. IEICE Electron. Express 17(7): 20200035 (2020) - [j16]Tianming Ni, Yue Shu, Hao Chang, Lin Lu, Guangzhen Dai, Shidong Zhu, Chengming Qu, Zhengfeng Huang:
CC-RTSV: Cross-Cellular Based Redundant TSV Design for 3D ICs. J. Circuits Syst. Comput. 29(11): 2050144:1-2050144:19 (2020) - [j15]Aibin Yan, Yuanjie Hu, Jie Cui, Zhili Chen, Zhengfeng Huang, Tianming Ni, Patrick Girard, Xiaoqing Wen:
Information Assurance Through Redundant Design: A Novel TNU Error-Resilient Latch for Harsh Radiation Environment. IEEE Trans. Computers 69(6): 789-799 (2020) - [j14]Tianming Ni, Yao Yao, Hao Chang, Lin Lu, Huaguo Liang, Aibin Yan, Zhengfeng Huang, Xiaoqing Wen:
LCHR-TSV: Novel Low Cost and Highly Repairable Honeycomb-Based TSV Redundancy Architecture for Clustered Faults. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 39(10): 2938-2951 (2020) - [j13]Tianming Ni, Hao Chang, Tai Song, Qi Xu, Zhengfeng Huang, Huaguo Liang, Aibin Yan, Xiaoqing Wen:
Non-Intrusive Online Distributed Pulse Shrinking-Based Interconnect Testing in 2.5D IC. IEEE Trans. Circuits Syst. 67-II(11): 2657-2661 (2020) - [j12]Aibin Yan, Yan Chen, Yuanjie Hu, Jun Zhou, Tianming Ni, Jie Cui, Patrick Girard, Xiaoqing Wen:
Novel Speed-and-Power-Optimized SRAM Cell Designs With Enhanced Self-Recoverability From Single- and Double-Node Upsets. IEEE Trans. Circuits Syst. 67-I(12): 4684-4695 (2020) - [j11]Tianming Ni, Dongsheng Liu, Qi Xu, Zhengfeng Huang, Huaguo Liang, Aibin Yan:
Architecture of Cobweb-Based Redundant TSV for Clustered Faults. IEEE Trans. Very Large Scale Integr. Syst. 28(7): 1736-1739 (2020) - [c7]Aibin Yan, Yan Chen, Jun Zhou, Jie Cui, Tianming Ni, Xiaoqing Wen, Patrick Girard:
A Sextuple Cross-Coupled SRAM Cell Protected against Double-Node Upsets. ATS 2020: 1-5 - [c6]Zhengda Dou, Aibin Yan, Jun Zhou, Yuanjie Hu, Yan Chen, Tianming Ni, Jie Cui, Patrick Girard, Xiaoqing Wen:
Design of a Highly Reliable SRAM Cell with Advanced Self-Recoverability from Soft Errors. ITC-Asia 2020: 35-40 - [c5]Zhengfeng Huang, Xiandong Li, Shangjie Pan, Min Wang, Tianming Ni:
A SEU Immune Flip-Flop with Low Overhead. ML4CS (2) 2020: 56-65
2010 – 2019
- 2019
- [j10]Tianming Ni, Hao Chang, Yao Yao, Xueyun Li, Zhengfeng Huang:
A Novel Built-In Self-Repair Scheme for 3D Memory. IEEE Access 7: 65052-65059 (2019) - [j9]Tianming Ni, Hao Chang, Shidong Zhu, Lin Lu, Xueyun Li, Qi Xu, Huaguo Liang, Zhengfeng Huang:
Temperature-Aware Floorplanning for Fixed-Outline 3D ICs. IEEE Access 7: 139787-139794 (2019) - [j8]Tianming Ni, Hao Chang, Xian Sun, Xia Xiuzhen, Zhengfeng Huang:
An enhanced time-to-digital conversion solution for pre-bond TSV dual faults testing. IEICE Electron. Express 16(3): 20181105 (2019) - [j7]Maoxiang Yi, Jingchang Bian, Tianming Ni, Cuiyun Jiang, Hao Chang, Huaguo Liang:
A Pulse Shrinking-Based Test Solution for Prebond Through Silicon via in 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 38(4): 755-766 (2019) - [c4]Aibin Yan, Jun Zhou, Yuanjie Hu, Yan Chen, Zhen Wu, Tianming Ni:
Design of a Novel Self-Recoverable SRAM Cell Protected Against Soft Errors. DSA 2019: 497-498 - 2018
- [j6]Tianming Ni, Hao Chang, Xiaoqiang Zhang, Hao Xiao, Zhengfeng Huang:
Research on physical unclonable functions circuit based on three dimensional integrated circuit. IEICE Electron. Express 15(23): 20180782 (2018) - [j5]Tianming Ni, Hao Chang, Haochen Qi, Zhengfeng Huang:
A novel in-field TSV repair method for latent faults. IEICE Electron. Express 15(23): 20180873 (2018) - [c3]Xiumin Xu, Huaguo Liang, Kai Zhou, Gaoliang Ma, Zhengfeng Huang, Maoxiang Yi, Tianming Ni, Yingchun Lu:
An All-Digital and Jitter-Quantizing True Random Number Generator in SRAM-Based FPGAs. ATS 2018: 59-62 - [c2]Zhengfeng Huang, Yangyang Zhang, Zian Su, Huaguo Liang, Huijie Yao, Tianming Ni:
A Hybrid DMR Latch to Tolerate MNU Using TDICE and WDICE. ATS 2018: 121-126 - 2017
- [j4]Xiumin Xu, Huaguo Liang, Zhengfeng Huang, Cuiyun Jiang, Yingchun Lu, Aibin Yan, Tianming Ni, Maoxiang Yi:
A single event transient detector in SRAM-based FPGAs. IEICE Electron. Express 14(12): 20170210 (2017) - [j3]Xiumin Xu, Huaguo Liang, Zhengfeng Huang, Cuiyun Jiang, Yiming Ouyang, Xiangsheng Fang, Tianming Ni, Maoxiang Yi:
A highly reliable butterfly PUF in SRAM-based FPGAs. IEICE Electron. Express 14(14): 20170551 (2017) - [j2]Tianming Ni, Mu Nie, Huaguo Liang, Jingchang Bian, Xiumin Xu, Xiangsheng Fang, Zhengfeng Huang, Xiaoqing Wen:
Vernier ring based pre-bond through silicon vias test in 3D ICs. IEICE Electron. Express 14(18): 20170590 (2017) - [j1]Tianming Ni, Huaguo Liang, Mu Nie, Xiumin Xu, Aibin Yan, Zhengfeng Huang:
A Region-Based Through-Silicon via Repair Method for Clustered Faults. IEICE Trans. Electron. 100-C(12): 1108-1117 (2017) - 2016
- [c1]Maoxiang Yi, Xiaohong Liu, Qingwu Wu, Tianming Ni, Zhengfeng Huang, Huaguo Liang:
NBTI mitigation by M-IVC with input duty cycle and randomness constraints. EWDTS 2016: 1-5
Coauthor Index
[j57] [j56] [j55] [j53] [j52] [j51] [j50] [j49] [j47] [c30] [j46] [j45] [j44] [j43] [j42] [j41] [j40] [j38] [c26] [c24] [c22] [c21] [c20] [j35] [j34] [j33] [j31] [j30] [c19] [c15] [j27] [j26] [j25] [j24] [j23] [j22] [j21] [j20] [j19] [c12] [c11] [c9] [j18] [j16] [j15] [j14] [j13] [j11] [c5] [j10] [j9] [j8] [j6] [j5] [c3] [c2] [j4] [j3] [j2] [j1] [c1]
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