"Self-consistent design issues for high frequency Cu interconnect ..."

Ming Yao et al. (2011)

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DOI: 10.1016/J.MICROREL.2010.12.011

access: closed

type: Journal Article

metadata version: 2020-02-22

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Ming Yao, Xuliang Zhang, Chaoyang Zhao, Jianguo Ma:
Self-consistent design issues for high frequency Cu interconnect reliability incorporating skin effect. Microelectron. Reliab. 51(5): 1003-1010 (2011)

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