"Fast convolution based thermal model for 3D-ICs: Methodology, accuracy ..."

F. L. T. Maggioni et al. (2014)

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DOI: 10.1016/J.MEJO.2014.04.044

access: closed

type: Journal Article

metadata version: 2021-10-14

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F. L. T. Maggioni, Herman Oprins, Eric Beyne, Ingrid De Wolf, Martine Baelmans:
Fast convolution based thermal model for 3D-ICs: Methodology, accuracy analysis and package impact. Microelectron. J. 45(12): 1746-1752 (2014)

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