"Co-modeling, Experimental Verification, and Analysis of Chip-Package ..."

Hyunjeong Park et al. (2008)

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DOI: 10.1093/IETELE/E91-C.4.595

access: closed

type: Journal Article

metadata version: 2020-04-11

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Hyunjeong Park, Hyungsoo Kim, Junso Pak, Changwook Yoon, Kyoungchoul Koo, Joungho Kim:
Co-modeling, Experimental Verification, and Analysis of Chip-Package Hierarchical Power Distribution Network. IEICE Trans. Electron. 91-C(4): 595-606 (2008)

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