BibTeX record conf/vlsit/ZhaoWJSJMBZCSVH24

• > Home > conf/vlsit/ZhaoWJSJMBZCSVH24

@inproceedings{DBLP:conf/vlsit/ZhaoWJSJMBZCSVH24,
  author       = {P. Zhao and
                  Liesbeth Witters and
                  Anne Jourdain and
                  Michele Stucchi and
                  Nicolas Jourdan and
                  J. W. Maes and
                  H. Bana and
                  C. Zhu and
                  R. Chukka and
                  F. Sebaai and
                  Kevin Vandersmissen and
                  N. Heylen and
                  D. Montero and
                  S. Wang and
                  K. D'Have and
                  F. Schleicher and
                  J. De Vos and
                  Gerald Beyer and
                  A. Miller and
                  Eric Beyne},
  title        = {Backside Power Delivery with relaxed overlay for backside patterning
                  using extreme wafer thinning and Molybdenum-filled slit nano Through
                  Silicon Vias},
  booktitle    = {{IEEE} Symposium on {VLSI} Technology and Circuits 2024, Honolulu,
                  HI, USA, June 16-20, 2024},
  pages        = {1--2},
  publisher    = {{IEEE}},
  year         = {2024},
  url          = {https://doi.org/10.1109/VLSITechnologyandCir46783.2024.10631441},
  doi          = {10.1109/VLSITECHNOLOGYANDCIR46783.2024.10631441},
  timestamp    = {Wed, 23 Oct 2024 22:44:16 +0200},
  biburl       = {https://dblp.org/rec/conf/vlsit/ZhaoWJSJMBZCSVH24.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}