"First Heterogeneous and Monolithic 3D (HM3D) Integration of InGaAs HEMTs ..."

Nahyun Rheem et al. (2024)

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DOI: 10.1109/VLSITECHNOLOGYANDCIR46783.2024.10631404

access: closed

type: Conference or Workshop Paper

metadata version: 2025-05-01

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Nahyun Rheem, Jaeyong Jeong, Yoon-Je Suh, Chan Jik Lee, Bong Ho Kim, Joon Pyo Kim, Seong Kwang Kim, Hyeongrak Lim, Jongmin Kim, Dae-Hwan Ahn, Jae-Hoon Han, Jongwon Lee, Sanghyeon Kim:
First Heterogeneous and Monolithic 3D (HM3D) Integration of InGaAs HEMTs and InP/InGaAs DHBTs on Si CMOS for Next-Generation Wireless Communication. VLSI Technology and Circuits 2024: 1-2

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