"Using Existing Reconfigurable Logic in 3D Die Stacks for Test."

Fanchen Zhang et al. (2016)

> Home

Details and statistics

DOI: 10.1109/NATW.2016.15

access: closed

type: Conference or Workshop Paper

metadata version: 2024-02-05

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/natw/ZhangSSNDMGBCP16
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/natw/ZhangSSNDMGBCP16
Fanchen Zhang, Yi Sun, Xi Shen, Kundan Nepal, Jennifer Dworak, Theodore W. Manikas, Ping Gui, R. Iris Bahar, Al Crouch, John C. Potter:
Using Existing Reconfigurable Logic in 3D Die Stacks for Test. NATW 2016: 46-52

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.