"Design, packaging, and architectural policy co-optimization for DC power ..."

Yarui Peng et al. (2015)

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DOI: 10.1145/2744769.2744819

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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Yarui Peng, Bon Woong Ku, Youn-Sik Park, Kwang-Il Park, Seong-Jin Jang, Joo-Sun Choi, Sung Kyu Lim:
Design, packaging, and architectural policy co-optimization for DC power integrity in 3D DRAM. DAC 2015: 91:1-91:6

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