"Nano-scale Cu direct bonding using ultra-high density Cu nano-pillar (CNP) ..."

Kang Wook Lee et al. (2016)

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DOI: 10.1109/3DIC.2016.7970027

access: closed

type: Conference or Workshop Paper

metadata version: 2021-02-16

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Kang Wook Lee, Ai Nakamura, Jicheol Bea, Takafumi Fukushima, Suresh Ramalingam, Xin Wu, Tanaka Tanaka, Mitsumasa Koyanagi:
Nano-scale Cu direct bonding using ultra-high density Cu nano-pillar (CNP) for high yield exascale 2.5/3D integration applications. 3DIC 2016: 1-5

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