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Yong-huan Guo

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2010 – 2019

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2014
[j2]
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  - https://dblp.org/rec/journals/mr/ZhangHGH14
Liang Zhang, Ji-guang Han, Yong-huan Guo, Cheng-wen He:
Anand model and FEM analysis of SnAgCuZn lead-free solder joints in wafer level chip scale packaging devices. Microelectron. Reliab. 54(1): 281-286 (2014)
2012
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Liang Zhang, Cheng-wen He, Yong-huan Guo, Ji-guang Han, Yong-wei Zhang, Xu-yan Wang:
Development of SnAg-based lead free solders in electronics packaging. Microelectron. Reliab. 52(3): 559-578 (2012)

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