Thermal-aware mobile SoC design and test in 14nm finfet technology. - Lee, Bong Hyun (2014)

Statistical aging analysis with process variation consideration. - Han, Sangwoo; Choung, Joohee; Kim, Byung-Su; Lee, Bong Hyun; Choi, Hungbok; Kim, Juho (2011)

Supply Switching With Ground Collapse for Low-Leakage Register Files in 65-nm CMOS. - Kim, Hyung-Ock; Lee, Bong Hyun; Kim, Jong-Tae; Choi, Jung Yun; Choi, Kyu-Myung; Shin, Youngsoo (IEEE Trans. Very Large Scale Integr. Syst., 2010)

Level Converting Flip-Flops for High-Speed and Low-Power Applications. - Park, Hyoun Soo; Lee, Bong Hyun; Kim, Young Hwan (IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2006)

An application specific processor-based controller for plasma display panels. - Lee, Jong Suk; Lee, Bong Hyun; Kang, Bong Seok; Kim, Young Hwan (IEEE Trans. Consumer Electron., 2006)

Clock-Free MTCMOS Flip-Flops with High Speed and Low Power. - Lee, Bong Hyun; Kim, Young Hwan; Jeong, Kwang-Ok (IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2005)