32nm and beyond Multi-VT Ultra-Thin Body and BOX FDSOI: From device to circuit - Olivier Thomas; Jean-Philippe Noel; Claire Fenouillet-Béranger; Marie-Anne Jaud; J. Dura; P. Perreau; Frédéric Boeuf; François Andrieu; D. Delprat; F. Boedt; Konstantin Bourdelle; Bich-Yen Nguyen; et al. (International Symposium on Circuits and Systems (ISCAS 2010), May 30 - June 2, 2010, Paris, France, 2010)

Impact of a 10nm Ultra-Thin BOX (UTBOX) and Ground Plane on FDSOI devices for 32nm node and below - Claire Fenouillet-Béranger; P. Perreau; S. Denorme; L. Tosti; François Andrieu; Olivier Weber; S. Barnola; C. Arvet; Y. Campidelli; Sébastien Haendler; R. Beneyton; C. Perrot; et al. (35th European Solid-State Circuits Conference, ESSCIRC 2009, Athens, Greece, 14-18 September 2009, 2009)