Yintang Yang

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

◀ ▶ joint publications with Fengjuan Wang

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Publications

2015
[j71]
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Fengjuan Wang, Ningmei Yu, Zhangming Zhu, Xiangkun Yin, Yintang Yang:
Effects of coaxial through-silicon via on carrier mobility along [100] and [110] crystal directions of (100) silicon. IEICE Electron. Express 12(14): 20150434 (2015)
2014
[j42]
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Fengjuan Wang, Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Ruixue Ding:
Capacitance characterization of tapered through-silicon-via considering MOS effect. Microelectron. J. 45(2): 205-210 (2014)
2013
[j33]
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  - journals/ieiceee/LiuZYWD13
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Xiaoxian Liu, Zhangming Zhu, Yintang Yang, Fengjuan Wang, Ruixue Ding:
Reduction of signal reflection in high-frequency three-dimensional (3D) integration circuits. IEICE Electron. Express 10(14): 20130449 (2013)
[j30]
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Fengjuan Wang, Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Ruixue Ding:
Analytical models for the thermal strain and stress induced by annular through-silicon-via (TSV). IEICE Electron. Express 10(20): 20130666 (2013)
[j27]
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Fengjuan Wang, Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Ruixue Ding:
Thermo-mechanical performance of Cu and SiO₂ filled coaxial through-silicon-via (TSV). IEICE Electron. Express 10(24): 20130894 (2013)
2011
[c19]
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  - conf/asicon/WangZYW11
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Fengjuan Wang, Zhangming Zhu, Yintang Yang, Ning Wang:
A thermal model for the top layer of 3D integrated circuits considering through silicon vias. ASICON 2011: 618-620

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