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2010 – 2019
- 2019
[c6]Peter Ramm, Armin Klumpp, Christof Landesberger, Josef Weber, Andy Heinig, Peter Schneider, Günter Elst, Manfred Engelhardt:
Fraunhofer's Initial and Ongoing Contributions in 3D IC Integration. 3DIC 2019: 1-5- [i3]Abhishek Singh Dahiya, Jerome Thireau, Jamila Boudaden, Swatchith Lal, Umair Gulzar, Yan Zhang, Thierry Gil, Nadine Azémard, Peter Ramm, Tim Kiessling, Cian O'Murchu, Fredrik Sebelius, Jonas Tilly, Colm Glynn, Shane Geary, Colm O'Dwyer, Kafil Razeeb, Alain Lacampagne
, Benoît Charlot, Aida Todri-Sanial:
Energy Autonomous Wearable Sensors for Smart Healthcare: A Review. CoRR abs/1912.02596 (2019) - 2016
- [c5]Montserrat Fernandez-Bolaños, Wolfgang A. Vitale, Mariazel Maqueda Lopez, Adrian M. Ionescu, Armin Klumpp, Karl-Reinhard Merkel, Josef Weber, Peter Ramm, Ilja Ocket, Walter De Raedt, Amin Enayati:
3D TSV based high frequency components for RF IC and RF MEMS applications. 3DIC 2016: 1-4 - 2015
- [c4]Andy Heinig, Muhammad Waqas Chaudhary, Peter Schneider, Peter Ramm, Josef Weber:
Current and future 3D activities at Fraunhofer. 3DIC 2015: FS4.1-FS4.3 - 2010
- [c3]Harry Hedler, Thomas Scheiter, Markus Schieber, Armin Klumpp, Peter Ramm:
High performance 3D interconnects based on electrochemical etch and liquid metal fill. 3DIC 2010: 1-7 - [c2]Armin Klumpp, Peter Ramm, Robert Wieland:
3D-integration of silicon devices: A key technology for sophisticated products. DATE 2010: 1678-1683 - [c1]Peter Ramm, Armin Klumpp, Josef Weber, Nicolas Lietaer, Maaike Taklo, Walter De Raedt, Thomas Fritzsch, Pascal Couderc:
3D Integration technology: Status and application development. ESSCIRC 2010: 9-16
2000 – 2009
- 2008
- [i2]Jürgen Wolf, Peter Ramm, Armin Klumpp, Herbert Reichl:
Technologies for 3D Heterogeneous Integration. CoRR abs/0805.0917 (2008) - [i1]E. Jung, Andreas Ostmann, Peter Ramm, Jürgen Wolf, Michael Toepper, Maik Wiemer:
Through Silicon Vias as Enablers for 3D Systems. CoRR abs/0805.0918 (2008)
Coauthor Index
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