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Christof Landesberger

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2010 – 2019

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2019
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Peter Ramm, Armin Klumpp, Christof Landesberger, Josef Weber, Andy Heinig, Peter Schneider, Günter Elst, Manfred Engelhardt:
Fraunhofer's Initial and Ongoing Contributions in 3D IC Integration. 3DIC 2019: 1-5
2018
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Indranil Bose, Nagarajan Palavesam, Christian Hochreiter, Christof Landesberger, Christoph Kutter:
Low Profile Open MEMS and ASIC Packages manufactured by Flexible Hybrid Integration in a Roll-to-Roll compatible process. ESSDERC 2018: 102-106

2000 – 2009

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2007
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Stephan Schoenfelder, Matthias Ebert, Christof Landesberger, Karlheinz Bock, Jörg Bagdahn:
Investigations of the influence of dicing techniques on the strength properties of thin silicon. Microelectron. Reliab. 47(2-3): 168-178 (2007)

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