BibTeX records: Viorel Balan

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@inproceedings{DBLP:conf/3dic/BourjotSDLRBRSB19,
  author       = {Emilie Bourjot and
                  Paul Stewart and
                  Christophe Dubarry and
                  E. Lagoutte and
                  E. Rolland and
                  Nicolas Bresson and
                  G. Romano and
                  D. Scevola and
                  Viorel Balan and
                  J{\'{e}}r{\^{o}}me Dechamp and
                  Marc Zussy and
                  Ga{\"{e}}lle Mauguen and
                  Cl{\'{e}}ment Castan and
                  Lo{\"{\i}}c Sanchez and
                  Amadine Jouve and
                  Frank Fournel and
                  S{\'{e}}verine Cheramy},
  title        = {Towards a Complete Direct Hybrid Bonding {D2W} Integration Flow: Known-Good-Dies
                  and Die Planarization Modules Development},
  booktitle    = {2019 International 3D Systems Integration Conference (3DIC), Sendai,
                  Japan, October 8-10, 2019},
  pages        = {1--5},
  publisher    = {{IEEE}},
  year         = {2019},
  url          = {https://doi.org/10.1109/3DIC48104.2019.9058783},
  doi          = {10.1109/3DIC48104.2019.9058783},
  timestamp    = {Mon, 03 Mar 2025 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/BourjotSDLRBRSB19.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/irps/ArnaudMJJLFEEBB18,
  author       = {Lucile Arnaud and
                  St{\'{e}}phane Moreau and
                  Amadine Jouve and
                  Imed Jani and
                  Didier Lattard and
                  F. Fournel and
                  C. Euvrard and
                  Y. Exbrayat and
                  Viorel Balan and
                  Nicolas Bresson and
                  S. Lhostis and
                  J. Jourdon and
                  E. Deloffre and
                  S. Guillaumet and
                  Alexis Farcy and
                  Simon Gousseau and
                  M. Arnoux},
  title        = {Fine pitch 3D interconnections with hybrid bonding technology: From
                  process robustness to reliability},
  booktitle    = {{IEEE} International Reliability Physics Symposium, {IRPS} 2018, Burlingame,
                  CA, USA, March 11-15, 2018},
  pages        = {4},
  publisher    = {{IEEE}},
  year         = {2018},
  url          = {https://doi.org/10.1109/IRPS.2018.8353591},
  doi          = {10.1109/IRPS.2018.8353591},
  timestamp    = {Mon, 03 Mar 2025 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/irps/ArnaudMJJLFEEBB18.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/essderc/Fenouillet-Beranger17,
  author       = {Claire Fenouillet{-}B{\'{e}}ranger and
                  S. Beaurepaire and
                  Fabien Deprat and
                  Alexandre Ayres De Sousa and
                  Laurent Brunet and
                  Perrine Batude and
                  Olivier Rozeau and
                  Fran{\c{c}}ois Andrieu and
                  Paul Besombes and
                  M.{-}P. Samson and
                  Bernard Previtali and
                  F. Nemouchi and
                  G. Rodriguez and
                  Philippe Rodriguez and
                  R. Famulok and
                  Nils Rambal and
                  Viorel Balan and
                  Z. Saghi and
                  V. Jousseaume and
                  Charles{-}Antoine Gu{\'{e}}rin and
                  F. Ibars and
                  F. Proud and
                  D. Nouguier and
                  David Ney and
                  V. Delaye and
                  H. Dansas and
                  X. Federspiel and
                  Maud Vinet},
  title        = {Guidelines for intermediate back end of line {(BEOL)} for 3D sequential
                  integration},
  booktitle    = {47th European Solid-State Device Research Conference, {ESSDERC} 2017,
                  Leuven, Belgium, September 11-14, 2017},
  pages        = {252--255},
  publisher    = {{IEEE}},
  year         = {2017},
  url          = {https://doi.org/10.1109/ESSDERC.2017.8066639},
  doi          = {10.1109/ESSDERC.2017.8066639},
  timestamp    = {Fri, 09 Sep 2022 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/essderc/Fenouillet-Beranger17.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}