Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development - Emilie Bourjot; Paul Stewart; Christophe Dubarry; E. Lagoutte; E. Rolland; Nicolas Bresson; G. Romano; D. Scevola; Viorel Balan; Jérôme Dechamp; Marc Zussy; Gaëlle Mauguen; et al. (2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019, 2019)

Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability - Lucile Arnaud; Stéphane Moreau; Amadine Jouve; Imed Jani; Didier Lattard; F. Fournel; C. Euvrard; Y. Exbrayat; Viorel Balan; Nicolas Bresson; S. Lhostis; J. Jourdon; et al. (IEEE International Reliability Physics Symposium, IRPS 2018, Burlingame, CA, USA, March 11-15, 2018, 2018)

Guidelines for intermediate back end of line (BEOL) for 3D sequential integration - Claire Fenouillet-Béranger; S. Beaurepaire; Fabien Deprat; Alexandre Ayres De Sousa; Laurent Brunet; Perrine Batude; Olivier Rozeau; François Andrieu; Paul Besombes; M.-P. Samson; Bernard Previtali; F. Nemouchi; et al. (47th European Solid-State Device Research Conference, ESSDERC 2017, Leuven, Belgium, September 11-14, 2017, 2017)