Alexis Farcy

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

◀ ▶ joint publications with Nicolas Sillon

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Publications

2011
[c6]
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  dblp key:
  - conf/3dic/DruaisAACCCCCCCCDDFGHHLLMOPPRRSS11
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  persistent URL:
  - https://dblp.org/rec/conf/3dic/DruaisAACCCCCCCCDDFGHHLLMOPPRRSS11
G. Druais, Pascal Ancey, C. Aumont, V. Caubet, Laurent-Luc Chapelon, C. Chaton, Séverine Cheramy, S. Cordova, E. Cirot, Jean-Philippe Colonna, Perceval Coudrain, T. Divel, Y. Dodo, Alexis Farcy, N. Guitard, K. Haxaire, Nicolas Hotellier, F. Leverd, R. Liou, Jean Michailos, A. Ostrovsky, Sebastien Petitdidier, J. Pruvost, D. Riquet, O. Robin, E. Saugier, Nicolas Sillon:
3D integration demonstration of a wireless product with design partitioning. 3DIC 2011: 1-5
2009
[c5]
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  - conf/3dic/CadixFBFLRAVRESFA09
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Lionel Cadix, Alexis Farcy, Cédric Bermond, Christine Fuchs, Patrick Leduc, Maxime Rousseau, Myriam Assous, Alexandre Valentian, Julie Roullard, Elie Eid, Nicolas Sillon, Bernard Fléchet, Pascal Ancey:
Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits. 3DIC 2009: 1-7
[c3]
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  - conf/3dic/LeducACZSRRVBBCFS09
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Patrick Leduc, Myriam Assous, Léa Di Cioccio, Marc Zussy, Thomas Signamarcheix, Antonio Roman, Maxime Rousseau, Sophie Verrun, Laurent Bally, David Bouchu, Lionel Cadix, Alexis Farcy, Nicolas Sillon:
First integration of Cu TSV using die-to-wafer direct bonding and planarization. 3DIC 2009: 1-5

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