Salvador de la Puente

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

◀ ▶ joint publications with Zhi Jin

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Publications

2024
[e3]
- view
  authority control:
- export record
  dblp key:
  - conf/qsw/2024
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/qsw/2024
Rong N. Chang, Carl K. Chang, Jingwei Yang, Zhi Jin, Michael Sheng, Jing Fan, Kenneth Fletcher, Qiang He, Ismael Faro, Frank Leymann, Johanna Barzen, Salvador de la Puente, Sebastian Feld, Manuel Wimmer, Nimanthi Atukorala, Hongyue Wu, David Elkouss, José García-Alonso, Aritra Sarkar:
IEEE International Conference on Quantum Software, QSW 2024, Shenzhen, China, July 7-13, 2024. IEEE 2024, ISBN 979-8-3503-6847-5 [contents]
2023
[e2]
- view
  authority control:
- export record
  dblp key:
  - conf/jva/2023
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/jva/2023
Shaukat Ali, Claudio A. Ardagna, Nimanthi L. Atukorala, Johanna Barzen, Carl K. Chang, Rong Chang, Jing Fan, Ismael Faro, Sebastian Feld, Geoffrey Fox, Zhi Jin, Frank Leymann, Florian Neukart, Salvador de la Puente, Manuel Wimmer:
IEEE John Vincent Atanasoff International Symposium on Modern Computing, JVA 2023, Chicago, IL, USA, July 5-6, 2023. IEEE 2023, ISBN 979-8-3503-2889-9 [contents]
[e1]
- view
  authority control:
- export record
  dblp key:
  - conf/qsw/2023
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/qsw/2023
Shaukat Ali, Claudio Agostino Ardagna, Nimanthi L. Atukorala, Johanna Barzen, Carl K. Chang, Rong N. Chang, Jing Fan, Ismael Faro, Sebastian Feld, Geoffrey Fox, Zhi Jin, Frank Leymann, Florian Neukart, Salvador de la Puente, Manuel Wimmer:
IEEE International Conference on Quantum Software, QSW 2023, Chicago, IL, USA, July 2-8, 2023. IEEE 2023, ISBN 979-8-3503-0479-4 [contents]

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