Investigations of silicon wafer bonding using thin Al and Sn films for heterogeneous integration. - Zhu, Zhiyuan; Wang, Shaonan; Xu, Yichao; Wang, Guanjiang; Pi, Yudan; Wang, Peiquan; Zhu, Yunhui; Sun, Xin; Yu, Min; Chen, Jing; Miao, Min; Jin, Yufeng (2013)

In-line testing of blind TSVs for 3D IC integration and M/NEMS packaging. - Xu, Yichao; Wang, Guanjiang; Sun, Xin; Fang, Runiu; Miao, Min; Jin, Yufeng (2013)