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C. Weintraub

Chad Weintraub – Chad E. Weintraub

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2010 – 2019

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2018
[c4]
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  - conf/essderc/ChangCJHZPZHSYZ18
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  - https://dblp.org/rec/conf/essderc/ChangCJHZPZHSYZ18
Mingcheng Chang, Nigel Chan, Vivek Joshi, Sandra Hecker, Udo Ziller, Petra Poth, Alban Zaka, Tom Herrmann, Seunghwan Seo, Hongsik Yoon, Xin Zou, Zhen Xu, Hema Ramamurthy, Torsten Klick, Gabriele Congedo, Youmean Lee, Elke Erben, Gerd Zschaetzsch, Juergen Faul, Jon Kluth, Joerg Schmid, Ralf Van Bentum, Chad Weintraub:
Novel Back Gate Doping Ultra Low Retention Power 22nm FDSOl SRAM for IOT Application. ESSDERC 2018: 78-81
2017
[j2]
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Randy W. Mann, William McMahon, Yoann Mamy Randriamihaja, Yuncheng Song, Ajay Anand Kallianpur, Sheng Xie, Akhilesh Gautam, Joseph Versaggi, Biju Parameshwaran, Chad E. Weintraub:
Bias-Induced Healing of $V_{\text {min}}$ Failures in Advanced SRAM Arrays. IEEE Trans. Very Large Scale Integr. Syst. 25(2): 660-669 (2017)
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Randy W. Mann, Sandeep Puri, Sheng Xie, Daniel Marienfeld, Joseph Versaggi, Bianzhu Fu, Michael Gribelyuk, Ratheesh R. Thankalekshmi, Xiaoqiang Zhang, Hui Zang, Chad E. Weintraub:
Array Termination Impacts in Advanced SRAM. IEEE Trans. Very Large Scale Integr. Syst. 25(9): 2449-2457 (2017)
2016
[c3]
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  - conf/isqed/Balasubramanian16
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Sriram Balasubramanian, Ninad Pimparkar, Mangesh Kushare, Vinayak Mahajan, Juhi Bansal, Takashi Shimizu, Vivek Joshi, Kun Qian, Arunima Dasgupta, Karthik Chandrasekaran, Chad Weintraub, Ali Icel:
Near-threshold circuit variability in 14nm FinFETs for ultra-low power applications. ISQED 2016: 258-262
2015
[c2]
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  - conf/irps/BurnettBJPHW15
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David Burnett, Sriram Balasubramanian, Vivek Joshi, Sanjay Parihar, Jack M. Higman, C. Weintraub:
SRAM Vmax stability considerations. IRPS 2015: 6
2014
[c1]
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  - conf/cicc/BalasubramanianJKMVGWKKKPN14
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S. Balasubramanian, Vivek Joshi, Torsten Klick, Randy W. Mann, Joseph Versaggi, Akhilesh Gautam, C. Weintraub, G. Kurz, G. Krause, Andreas Kerber, Biju Parameshwaran, Tanya Nigam:
HTOL SRAM Vmin shift considerations in scaled HKMG technologies. CICC 2014: 1-4

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