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Pascal Vivet
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- affiliation: CEA-LETI, Grenoble, France
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2020 – today
- 2023
- [c84]Thomas Mesquida, Manon Dampfhoffer, Thomas Dalgaty, Pascal Vivet, Amos Sironi, Christoph Posch:
G2N2: Lightweight Event Stream Classification with GRU Graph Neural Networks. BMVC 2023: 660-663 - [c83]Thomas Dalgaty, Thomas Mesquida, Damien Joubert, Amos Sironi, Pascal Vivet
, Christoph Posch:
HUGNet: Hemi-Spherical Update Graph Neural Network applied to low-latency event-based optical flow. CVPR Workshops 2023: 3953-3962 - [c82]Thomas Dalgaty, Thomas Mesquida, Damien Joubert, Amos Sironi, Cyrille Soubeyrat, Pascal Vivet
, Christoph Posch:
The CNN vs. SNN Event-camera Dichotomy and Perspectives For Event-Graph Neural Networks. DATE 2023: 1-6 - 2022
- [j16]Aditya Narayan
, Yvain Thonnart
, Pascal Vivet
, Ayse K. Coskun
, Ajay Joshi
:
Architecting Optically Controlled Phase Change Memory. ACM Trans. Archit. Code Optim. 19(4): 48:1-48:26 (2022) - 2021
- [j15]Pascal Vivet
, Eric Guthmuller
, Yvain Thonnart
, Gaël Pillonnet
, César Fuguet Tortolero
, Ivan Miro-Panades
, Guillaume Moritz, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes
, Sébastien Thuries, David Coriat, Michel Harrand
, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier
, Perceval Coudrain
, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier
, Alexis Farcy, Alexandre Arriordaz
, Séverine Cheramy
, Fabien Clermidy:
IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management. IEEE J. Solid State Circuits 56(1): 79-97 (2021) - [j14]Aditya Narayan
, Yvain Thonnart
, Pascal Vivet
, Ayse K. Coskun
:
PROWAVES: Proactive Runtime Wavelength Selection for Energy-Efficient Photonic NoCs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 40(10): 2156-2169 (2021) - [i1]Aditya Narayan, Yvain Thonnart, Pascal Vivet, Ayse K. Coskun, Ajay Joshi:
Architecting Optically-Controlled Phase Change Memory. CoRR abs/2107.11516 (2021) - 2020
- [c81]Jean-Philippe Noël, Valentin Egloff, Maha Kooli, Roman Gauchi
, Jean-Michel Portal, Henri-Pierre Charles
, Pascal Vivet, Bastien Giraud:
Computational SRAM Design Automation using Pushed-Rule Bitcells for Energy-Efficient Vector Processing. DATE 2020: 1187-1192 - [c80]Aditya Narayan
, Yvain Thonnart
, Pascal Vivet
, Ajay Joshi, Ayse K. Coskun:
System-level Evaluation of Chip-Scale Silicon Photonic Networks for Emerging Data-Intensive Applications. DATE 2020: 1444-1449 - [c79]Yvain Thonnart
, Stéphane Bernabé, Jean Charbonnier, Christian Bernard, David Coriat, César Fuguet Tortolero
, Pierre Tissier, Benoît Charbonnier, Stéphane Malhouitre, Damien Saint-Patrice, Myriam Assous, Aditya Narayan
, Ayse K. Coskun
, Denis Dutoit, Pascal Vivet:
POPSTAR: a Robust Modular Optical NoC Architecture for Chiplet-based 3D Integrated Systems. DATE 2020: 1456-1461 - [c78]Sébastien Thuries, Olivier Billoint, Sylvain Choisnet, Romain Lemaire, Pascal Vivet, Perrine Batude, Didier Lattard:
M3D-ADTCO: Monolithic 3D Architecture, Design and Technology Co-Optimization for High Energy Efficient 3D IC. DATE 2020: 1740-1745 - [c77]Roman Gauchi
, Valentin Egloff, Maha Kooli, Jean-Philippe Noël, Bastien Giraud, Pascal Vivet
, Subhasish Mitra
, Henri-Pierre Charles
:
Reconfigurable tiles of computing-in-memory SRAM architecture for scalable vectorization. ISLPED 2020: 121-126 - [c76]Pascal Vivet
, Eric Guthmuller
, Yvain Thonnart
, Gaël Pillonnet
, Guillaume Moritz, Ivan Miro-Panades, César Fuguet Tortolero
, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes, Sébastien Thuries, David Coriat, Michel Harrand, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier, Perceval Coudrain
, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier, Alexis Farcy, Alexandre Arriordaz, Séverine Cheramy, Fabien Clermidy:
2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm2 Inter-Chiplet Interconnects and 156mW/mm2@ 82%-Peak-Efficiency DC-DC Converters. ISSCC 2020: 46-48
2010 – 2019
- 2019
- [c75]Olivier Billoint, Karim Azizi-Mourier, Gerald Cibrario, Didier Lattard, Mehdi Mouhdach, Sébastien Thuries, Pascal Vivet
:
Merging PDKs to Build a Design Environment for 3D Circuits: Methodology, Challenges and Limitations. 3DIC 2019: 1-5 - [c74]Imed Jani, Didier Lattard, Pascal Vivet, Lucile Arnaud, Edith Beigné:
Misalignment Analysis and Electrical Performance of High Density 3D-IC interconnects. 3DIC 2019: 1-4 - [c73]Yvain Thonnart, Pascal Vivet
, Shikhanshu Agarwal, Ramesh Chauhan:
Latency Improvement of an Industrial SoC System Interconnect using an Asynchronous NoC Backbone. ASYNC 2019: 46-47 - [c72]Aditya Narayan
, Yvain Thonnart
, Pascal Vivet, César Fuguet Tortolero
, Ayse K. Coskun:
WAVES: Wavelength Selection for Power-Efficient 2.5D-Integrated Photonic NoCs. DATE 2019: 516-521 - [c71]Pascal Vivet
, Gilles Sicard, Laurent Millet, Stéphane Chevobbe
, Karim Ben Chehida, Luis Angel Cubero, Monte Alegre, Maxence Bouvier, Alexandre Valentian, Maria Lepecq
, Thomas Dombek, Olivier Bichler, Sébastien Thuries, Didier Lattard, Séverine Cheramy, Perrine Batude, Fabien Clermidy:
Advanced 3D Technologies and Architectures for 3D Smart Image Sensors. DATE 2019: 674-679 - [c70]Imed Jani, Didier Lattard, Pascal Vivet
, Jean Durupt, Sébastien Thuries, Edith Beigné:
Test Solutions for High Density 3D-IC Interconnects - Focus on SRAM-on-Logic Partitioning. ETS 2019: 1-2 - [c69]Tony F. Wu, Binh Q. Le, Robert M. Radway
, Andrew Bartolo, William Hwang, Seungbin Jeong, Haitong Li, Pulkit Tandon, Elisa Vianello, Pascal Vivet
, Etienne Nowak, Mary Wootters, H.-S. Philip Wong, Mohamed M. Sabry Aly, Edith Beigné, Subhasish Mitra
:
A 43pJ/Cycle Non-Volatile Microcontroller with 4.7μs Shutdown/Wake-up Integrating 2.3-bit/Cell Resistive RAM and Resilience Techniques. ISSCC 2019: 226-228 - [c68]Deepak M. Mathew, André Lucas Chinazzo, Christian Weis, Matthias Jung, Bastien Giraud, Pascal Vivet
, Alexandre Levisse, Norbert Wehn
:
RRAMSpec: A Design Space Exploration Framework for High Density Resistive RAM. SAMOS 2019: 34-47 - [c67]Roman Gauchi
, Maha Kooli, Pascal Vivet
, Jean-Philippe Noël, Edith Beigné, Subhasish Mitra
, Henri-Pierre Charles
:
Memory Sizing of a Scalable SRAM In-Memory Computing Tile Based Architecture. VLSI-SoC 2019: 166-171 - 2018
- [c66]Eric Guthmuller
, César Fuguet Tortolero
, Pascal Vivet
, Christian Bernard, Ivan Miro Panades, Jean Durupt, E. Beignc, Didier Lattard, Séverine Cheramy, Alain Greiner, Quentin L. Meunier, Pirouz Bazargan-Sabet:
A 29 Gops/Watt 3D-Ready 16-Core Computing Fabric with Scalable Cache Coherent Architecture Using Distributed L2 and Adaptive L3 Caches. ESSCIRC 2018: 318-321 - [c65]Imed Jani, Didier Lattard, Pascal Vivet
, Lucile Arnaud, Edith Beigné:
BISTs for post-bond test and electrical analysis of high density 3D interconnect defects. ETS 2018: 1-6 - [c64]Pascal Vivet
, Sébastien Thuries, Olivier Billoint, Sylvain Choisnet, Didier Lattard, Edith Beigné, Perrine Batude:
Monolithic 3D: an alternative to advanced CMOS scaling, technology perspectives and associated design methodology challenges. ICECS 2018: 157-160 - 2017
- [j13]Pascal Vivet
, Yvain Thonnart
, Romain Lemaire, Cristiano Santos, Edith Beigné, Christian Bernard, Florian Darve, Didier Lattard, Ivan Miro Panades, Denis Dutoit, Fabien Clermidy, Séverine Cheramy, Abbas Sheibanyrad, Frédéric Pétrot, Eric Flamand, Jean Michailos, Alexandre Arriordaz, Lee Wang, Juergen Schloeffel:
A 4 × 4 × 2 Homogeneous Scalable 3D Network-on-Chip Circuit With 326 MFlit/s 0.66 pJ/b Robust and Fault Tolerant Asynchronous 3D Links. IEEE J. Solid State Circuits 52(1): 33-49 (2017) - [c63]Imed Jani, Didier Lattard, Pascal Vivet
, Edith Beigné
:
Innovative structures to test bonding alignment and characterize high density interconnects in 3D-IC. NEWCAS 2017: 153-156 - 2016
- [j12]S. Saqib Khursheed, Pascal Vivet
, Fabian Hopsch, Erik Jan Marinissen
:
Guest Editors' Introduction: Robust 3-D Stacked ICs. IEEE Des. Test 33(3): 6-7 (2016) - [j11]Perceval Coudrain
, Papa Momar Souare, Rafael Prieto, Vincent Fiori, Alexis Farcy, Laurent Le Pailleur, Jean-Philippe Colonna, Cristiano Santos, Pascal Vivet
, M. Haykel Ben Jamaa, Denis Dutoit, François de Crecy, Sylvain Dumas, Christian Chancel, Didier Lattard, Séverine Cheramy:
Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits. IEEE Des. Test 33(3): 21-36 (2016) - [j10]Francesco Beneventi, Andrea Bartolini
, Pascal Vivet
, Luca Benini
:
Thermal Analysis and Interpolation Techniques for a Logic + WideIO Stacked DRAM Test Chip. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 35(4): 623-636 (2016) - [c62]Didier Lattard, Lucile Arnaud, Arnaud Garnier, Nicolas Bresson, Franck Bana, R. Segaud, Amadine Jouve, H. Jacquinot, Stéphane Moreau
, Karim Azizi-Mourier, C. Chantre, Pascal Vivet, Gaël Pillonnet
, F. Casset, F. Ponthenier, Alexis Farcy, S. Lhostis, Jean Michailos, Alexandre Arriordaz, Séverine Cheramy:
ITAC: A complete 3D integration test platform. 3DIC 2016: 1-4 - [c61]Cristiano Santos, Pascal Vivet
, Sébastien Thuries, Olivier Billoint, Jean-Philippe Colonna, Perceval Coudrain
, Lee Wang:
Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes. 3DIC 2016: 1-5 - [c60]Jean Durupt, Pascal Vivet
, Juergen Schloeffel:
IJTAG supported 3D DFT using chiplet-footprints for testing multi-chips active interposer system. ETS 2016: 1-6 - [c59]Pascal Vivet
, Yvain Thonnart
, Romain Lemaire, Edith Beigné
, Christian Bernard, Florian Darve, Didier Lattard, Ivan Miro Panades, Cristiano Santos, Fabien Clermidy, Séverine Cheramy, Frédéric Pétrot, Eric Flamand, Jean Michailos:
8.1 A 4×4×2 homogeneous scalable 3D network-on-chip circuit with 326MFlit/s 0.66pJ/b robust and fault-tolerant asynchronous 3D links. ISSCC 2016: 146-147 - 2015
- [c58]Pascal Vivet, Christian Bernard, Fabien Clermidy, Denis Dutoit, Eric Guthmuller
, Ivan Miro Panades, Gaël Pillonnet
, Yvain Thonnart
, Arnaud Garnier, Didier Lattard, Amandine Jouve, Franck Bana, Thierry Mourier, Séverine Cheramy:
3D advanced integration technology for heterogeneous systems. 3DIC 2015: FS6.1-FS6.3 - [c57]Cristiano Santos, Rafael Prieto, Pascal Vivet
, Jean-Philippe Colonna, Perceval Coudrain
, Ricardo Reis
:
Graphite-based heat spreaders for hotspot mitigation in 3D ICs. 3DIC 2015: TS10.4.1-TS10.4.4 - [c56]Gaël Pillonnet
, Nicolas Jeanniot, Pascal Vivet:
3D ICs: An opportunity for fully-integrated, dense and efficient power supplies. 3DIC 2015: TS6.4.1-TS6.4.8 - [c55]Julian J. H. Pontes, Pascal Vivet
, Yvain Thonnart
:
Two-phase protocol converters for 3D asynchronous 1-of-n data links. ASP-DAC 2015: 154-159 - [c54]Christian Weis, Matthias Jung, Peter Ehses, Cristiano Santos, Pascal Vivet, Sven Goossens, Martijn Koedam, Norbert Wehn:
Retention time measurements and modelling of bit error rates of WIDE I/O DRAM in MPSoCs. DATE 2015: 495-500 - [c53]Edith Beigné
, Fabien Clermidy, Didier Lattard, Ivan Miro Panades, Yvain Thonnart
, Pascal Vivet
:
Fine-grain DVFS and AVFS techniques for complex SoC design: An overview of architectural solutions through technology nodes. ISCAS 2015: 1550-1553 - [c52]Tanguy Sassolas, Chiara Sandionigi, Alexandre Guerre, Julien Mottin, Pascal Vivet
, Hela Boussetta, Nicolas Peltier:
A simulation framework for rapid prototyping and evaluation of thermal mitigation techniques in many-core architectures. ISLPED 2015: 25-30 - [c51]Yassine Fkih, Pascal Vivet, Marie-Lise Flottes, Bruno Rouzeyre, Giorgio Di Natale, Juergen Schloeffel:
3D DFT Challenges and Solutions. ISVLSI 2015: 603-608 - [c50]Christian Weis, Matthias Jung
, Omar Naji, Norbert Wehn, Cristiano Santos, Pascal Vivet
, Andreas Hansson:
Thermal Aspects and High-Level Explorations of 3D Stacked DRAMs. ISVLSI 2015: 609-614 - [c49]Pascal Vivet, Christian Bernard, Eric Guthmuller
, Ivan Miro Panades, Yvain Thonnart
, Fabien Clermidy:
Interconnect Challenges for 3D Multi-cores: From 3D Network-on-Chip to Cache Interconnects. ISVLSI 2015: 615-620 - [c48]Florent Berthier, Edith Beigné
, Pascal Vivet
, Olivier Sentieys:
Power gain estimation of an event-driven wake-up controller dedicated to WSN's microcontroller. NEWCAS 2015: 1-4 - 2014
- [j9]Ivan Miro Panades, Edith Beigné
, Yvain Thonnart
, Laurent Alacoque, Pascal Vivet
, Suzanne Lesecq, Diego Puschini, Anca Molnos, Farhat Thabet, Benoît Tain
, Karim Ben Chehida, Sylvain Engels, Robin Wilson, Didier Fuin:
A Fine-Grain Variation-Aware Dynamic Vdd-Hopping AVFS Architecture on a 32 nm GALS MPSoC. IEEE J. Solid State Circuits 49(7): 1475-1486 (2014) - [c47]Cristiano Santos, Papa Momar Souare, François de Crecy, Perceval Coudrain
, Jean-Philippe Colonna, Pascal Vivet, Andras Borbely, Ricardo Reis
, M. Haykel Ben Jamaa, Vincent Fiori, Alexis Farcy:
Using TSVs for thermal mitigation in 3D circuits: Wish and truth. 3DIC 2014: 1-8 - [c46]Cristiano Santos, Pascal Vivet
, Jean-Philippe Colonna, Perceval Coudrain
, Ricardo Augusto da Luz Reis
:
Thermal performance of 3D ICs: Analysis and alternatives. 3DIC 2014: 1-7 - [c45]Bilel Belhadj, Alexandre Valentian, Pascal Vivet
, Marc Duranton, Liqiang He, Olivier Temam:
The improbable but highly appropriate marriage of 3D stacking and neuromorphic accelerators. CASES 2014: 1:1-1:9 - [c44]Cristiano Santos, Pascal Vivet
, Gene Matter, Nicolas Peltier, Sylvian Kaiser, Ricardo Augusto da Luz Reis
:
Thermal modeling methodology for efficient system-level thermal analysis. CICC 2014: 1-4 - [c43]Francesco Beneventi, Andrea Bartolini, Pascal Vivet, Denis Dutoit, Luca Benini:
Thermal analysis and model identification techniques for a logic + WIDEIO stacked DRAM test chip. DATE 2014: 1-4 - [c42]Tanguy Sassolas, Chiara Sandionigi, Alexandre Guerre, Alexandre Aminot, Pascal Vivet, Hela Boussetta, Luca Ferro, Nicolas Peltier:
Early design stage thermal evaluation and mitigation: The locomotiv architectural case. DATE 2014: 1-2 - [c41]Cristiano Santos, Pascal Vivet
, Ricardo Augusto da Luz Reis
:
Thermal impact of 3D stacking and die thickness: Analysis and characterization of a memory-on-logic 3D circuit. ICECS 2014: 718-721 - [c40]Yassine Fkih, Pascal Vivet, Bruno Rouzeyre, Marie-Lise Flottes, Giorgio Di Natale, Juergen Schloeffel:
2D to 3D Test Pattern Retargeting Using IEEE P1687 Based 3D DFT Architectures. ISVLSI 2014: 386-391 - [e2]Giorgos Dimitrakopoulos, Sören Sonntag, José Flich, Pascal Vivet:
Proceedings of the 8th International Workshop on Interconnection Network Architecture - On-Chip, Multi-Chip, INA-OCMC 2014, Vienna, Austria, January 22, 2014. ACM 2014, ISBN 978-1-4503-2639-1 [contents] - 2013
- [c39]Cristiano Santos, Pascal Vivet
, Denis Dutoit, Philippe Garrault, Nicolas Peltier, Ricardo Reis
:
System-level thermal modeling for 3D circuits: Characterization with a 65nm memory-on-logic circuit. 3DIC 2013: 1-6 - [c38]Claude Helmstetter, Sylvain Basset, Romain Lemaire, Fabien Clermidy, Pascal Vivet
, Michel Langevin, Chuck Pilkington, Pierre G. Paulin, Didier Fuin:
A dynamic stream link for efficient data flow control in NoC based heterogeneous MPSoC. ASP-DAC 2013: 41-46 - [c37]Claude Helmstetter
, Jérôme Cornet, Bruno Galilée, Matthieu Moy, Pascal Vivet
:
Fast and accurate TLM simulations using temporal decoupling for FIFO-based communications. DATE 2013: 1185-1188 - [c36]Alex Yakovlev, Pascal Vivet, Marc Renaudin:
Advances in asynchronous logic: from principles to GALS & NoC, recent industry applications, and commercial CAD tools. DATE 2013: 1715-1724 - [c35]Edith Beigné
, Ivan Miro-Panades, Yvain Thonnart
, Laurent Alacoque, Pascal Vivet
, Suzanne Lesecq, Diego Puschini, Farhat Thabet, Benoît Tain
, K. Benchehida, Sylvain Engels, Robin Wilson, Didier Fuin:
A fine grain variation-aware dynamic Vdd-hopping AVFS architecture on a 32nm GALS MPSoC. ESSCIRC 2013: 57-60 - [c34]Carolina Metzler, Aida Todri-Sanial
, Alberto Bosio, Luigi Dilillo, Patrick Girard, Arnaud Virazel
, Pascal Vivet
, Marc Belleville:
Computing detection probability of delay defects in signal line tsvs. ETS 2013: 1-6 - [c33]Julian J. H. Pontes, Ney Calazans
, Pascal Vivet
:
Parity check for m-of-n delay insensitive codes. IOLTS 2013: 157-162 - [c32]Fabien Clermidy, Denis Dutoit, Eric Guthmuller
, Ivan Miro Panades, Pascal Vivet
:
3D stacking for multi-core architectures: From WIDEIO to distributed caches. ISCAS 2013: 537-540 - [c31]Yuanqing Cheng, Aida Todri-Sanial
, Alberto Bosio, Luigi Dillio, Patrick Girard, Arnaud Virazel
, Pascal Vivet, Marc Belleville:
A novel method to mitigate TSV electromigration for 3D ICs. ISVLSI 2013: 121-126 - [c30]Yassine Fkih, Pascal Vivet
, Bruno Rouzeyre, Marie-Lise Flottes, Giorgio Di Natale:
A 3D IC BIST for pre-bond test of TSVs using ring oscillators. NEWCAS 2013: 1-4 - [c29]Thomas Ducroux, Germain Haugou, Vincent Risson, Pascal Vivet
:
Fast and accurate power annotated simulation: Application to a many-core architecture. PATMOS 2013: 191-198 - [c28]Julian J. H. Pontes, Ney Calazans
, Pascal Vivet
:
H2A: A hardened asynchronous network on chip. SBCCI 2013: 1-6 - 2012
- [c27]Yvain Thonnart
, Edith Beigné
, Pascal Vivet:
A Pseudo-Synchronous Implementation Flow for WCHB QDI Asynchronous Circuits. ASYNC 2012: 73-80 - [c26]Julian J. H. Pontes, Ney Calazans
, Pascal Vivet
:
Adding Temporal Redundancy to Delay Insensitive Codes to Mitigate Single Event Effects. ASYNC 2012: 142-149 - [c25]Julian J. H. Pontes, Ney Calazans, Pascal Vivet:
An accurate Single Event Effect digital design flow for reliable system level design. DATE 2012: 224-229 - [e1]Jens Sparsø, Montek Singh, Pascal Vivet:
18th IEEE International Symposium on Asynchronous Circuits and Systems, ASYNC 2012, Kgs. Lyngby, Denmark, May 7-9, 2012. IEEE Computer Society 2012, ISBN 978-1-4673-1360-5 [contents] - 2011
- [j8]Jean-Frédéric Christmann, Edith Beigné
, Cyril Condemine, Pascal Vivet
, Jérôme Willemin
, Nicolas Leblond, Christian Piguet:
Bringing Robustness and Power Efficiency to Autonomous Energy-Harvesting Microsystems. IEEE Des. Test Comput. 28(5): 84-94 (2011) - [j7]Pascal Vivet
, Edith Beigné
, Hugo Lebreton, Nacer-Eddine Zergainoh:
On-line Power Optimization of Data Flow Multi-Core Architecture Based on Vdd-Hopping for Local Dynamic Voltage and Frequency Scaling. J. Low Power Electron. 7(2): 265-273 (2011) - [j6]Carolina Albea
, Diego Puschini, Pascal Vivet
, Ivan Miro Panades, Edith Beigné
, Suzanne Lesecq:
Architecture and Robust Control of a Digital Frequency-Locked Loop for Fine-Grain Dynamic Voltage and Frequency Scaling in Globally Asynchronous Locally Synchronous Structures. J. Low Power Electron. 7(3): 328-340 (2011) - [c24]Benny Akesson
, Po-Chun Huang, Fabien Clermidy, Denis Dutoit, Kees Goossens, Yuan-Hao Chang
, Tei-Wei Kuo
, Pascal Vivet
, Drew Wingard:
Memory controllers for high-performance and real-time MPSoCs: requirements, architectures, and future trends. CODES+ISSS 2011: 3-12 - [c23]Fabien Clermidy, Florian Darve, Denis Dutoit, Walid Lafi, Pascal Vivet:
3D Embedded multi-core: Some perspectives. DATE 2011: 1327-1332 - [c22]Florian Darve, Abbas Sheibanyrad, Pascal Vivet
, Frédéric Pétrot:
Physical Implementation of an Asynchronous 3D-NoC Router Using Serial Vertical Links. ISVLSI 2011: 25-30 - [c21]Pascal Vivet
, Denis Dutoit, Yvain Thonnart
, Fabien Clermidy:
3D NoC using through silicon Via: An asynchronous implementation. VLSI-SoC 2011: 232-237 - 2010
- [c20]Jean-Frédéric Christmann, Edith Beigné
, Cyril Condemine, Nicolas Leblond, Pascal Vivet, G. Waltisperger, Jérôme Willemin
:
Bringing Robustness and Power Efficiency to Autonomous Energy Harvesting Microsystems. ASYNC 2010: 62-71 - [c19]Yvain Thonnart, Pascal Vivet
, Fabien Clermidy:
A fully-asynchronous low-power framework for GALS NoC integration. DATE 2010: 33-38 - [c18]Fabien Clermidy, Christian Bernard, Romain Lemaire, Jérôme Martin
, Ivan Miro Panades, Yvain Thonnart
, Pascal Vivet
, Norbert Wehn
:
A 477mW NoC-based digital baseband for MIMO 4G SDR. ISSCC 2010: 278-279 - [c17]Pascal Vivet
, Edith Beigné
, Hugo Lebreton, Nacer-Eddine Zergainoh:
On Line Power Optimization of Data Flow Multi-core Architecture Based on Vdd-Hopping for Local DVFS. PATMOS 2010: 94-104
2000 – 2009
- 2009
- [j5]Edith Beigné
, Fabien Clermidy, Hélène Lhermet, Sylvain Miermont, Yvain Thonnart
, Xuan-Tu Tran
, Alexandre Valentian, Didier Varreau, Pascal Vivet
, Xavier Popon, Hugo Lebreton:
An Asynchronous Power Aware and Adaptive NoC Based Circuit. IEEE J. Solid State Circuits 44(4): 1167-1177 (2009) - [j4]Yvain Thonnart
, Edith Beigné
, Alexandre Valentian, Pascal Vivet
:
Power Reduction of Asynchronous Logic Circuits Using Activity Detection. IEEE Trans. Very Large Scale Integr. Syst. 17(7): 893-906 (2009) - [c16]Yvain Thonnart
, Edith Beigné
, Pascal Vivet
:
Design and Implementation of a GALS Adapter for ANoC Based Architectures. ASYNC 2009: 13-22 - [c15]Fabien Clermidy, Romain Lemaire, Yvain Thonnart
, Pascal Vivet
:
A Communication and configuration controller for NoC based reconfigurable data flow architecture. NOCS 2009: 153-162 - 2008
- [j3]Didier Lattard, Edith Beigné
, Fabien Clermidy, Yves Durand, Romain Lemaire, Pascal Vivet
, Friedbert Berens:
A Reconfigurable Baseband Platform Based on an Asynchronous Network-on-Chip. IEEE J. Solid State Circuits 43(1): 223-235 (2008) - [c14]Yvain Thonnart
, Edith Beigné
, Alexandre Valentian, Pascal Vivet
:
Automatic Power Regulation Based on an Asynchronous Activity Detection and its Application to ANOC Node Leakage Reduction. ASYNC 2008: 48-57 - [c13]Edith Beigné
, Fabien Clermidy, Sylvain Miermont, Alexandre Valentian, Pascal Vivet
, S. Barasinski, F. Blisson, N. Kohli, S. Kumar:
A fully integrated power supply unit for fine grain power management application to embedded Low Voltage SRAMs. ESSCIRC 2008: 138-141 - [c12]Hugo Lebreton, Pascal Vivet
:
Power Modeling in SystemC at Transaction Level, Application to a DVFS Architecture. ISVLSI 2008: 463-466 - [c11]Edith Beigné, Fabien Clermidy, Sylvain Miermont, Pascal Vivet:
Dynamic Voltage and Frequency Scaling Architecture for Units Integration within a GALS NoC. NOCS 2008: 129-138 - [c10]Ivan Miro Panades, Fabien Clermidy, Pascal Vivet, Alain Greiner:
Physical Implementation of the DSPIN Network-on-Chip in the FAUST Architecture. NOCS 2008: 139-148 - 2007
- [j2]Milos Krstic
, Eckhard Grass, Frank K. Gürkaynak, Pascal Vivet
:
Globally Asynchronous, Locally Synchronous Circuits: Overview and Outlook. IEEE Des. Test Comput. 24(5): 430-441 (2007) - [c9]Gwen Salaün, Wendelin Serwe, Yvain Thonnart, Pascal Vivet:
Formal Verification of CHP Specifications with CADP Illustration on an Asynchronous Network-on-Chip. ASYNC 2007: 73-82 - [c8]Didier Lattard, Edith Beigné
, Christian Bernard, Catherine Bour, Fabien Clermidy, Yves Durand, Jean Durupt, Didier Varreau, Pascal Vivet
, Pierre Penard, Arnaud Bouttier, Friedbert Berens:
A Telecom Baseband Circuit based on an Asynchronous Network-on-Chip. ISSCC 2007: 258-601 - [c7]Cedric Koch-Hofer, Marc Renaudin, Yvain Thonnart
, Pascal Vivet
:
ASC, a SystemC Extension for Modeling Asynchronous Systems, and Its Application to an Asynchronous NoC. NOCS 2007: 295-306 - [c6]Sylvain Miermont, Pascal Vivet
, Marc Renaudin:
A Power Supply Selector for Energy- and Area-Efficient Local Dynamic Voltage Scaling. PATMOS 2007: 556-565 - [c5]Anh-Vu Dinh-Duc, Pascal Vivet
, Alain Clouard:
A Transaction Level Modeling of Network-on-Chip Architecture for Energy Estimation. RIVF 2007: 58-64 - 2006
- [c4]Edith Beigné
, Pascal Vivet
:
Design of On-chip and Off-chip Interfaces for a GALS NoC Architecture. ASYNC 2006: 172-183 - 2005
- [c3]Edith Beigné
, Fabien Clermidy, Pascal Vivet
, Alain Clouard, Marc Renaudin:
An Asynchronous NOC Architecture Providing Low Latency Service and Its Multi-Level Design Framework. ASYNC 2005: 54-63 - 2001
- [j1]André Abrial, Jacky Bouvier, Marc Renaudin, Patrice Senn, Pascal Vivet
:
A new contactless smart card IC using an on-chip antenna and an asynchronous microcontroller. IEEE J. Solid State Circuits 36(7): 1101-1107 (2001)
1990 – 1999
- 1999
- [c2]Marc Renaudin, Pascal Vivet
, Frédéric Robin:
A Design Framework for Asynchronous/Synchronous Circuits Based on CHP to VHDL Translation. ASYNC 1999: 135-144 - 1998
- [c1]Marc Renaudin, Pascal Vivet
, Frédéric Robin:
ASPRO-216: A Standard-Cell Q.D.I. 16-Bit RISC Asynchronous Microprocessor. ASYNC 1998: 22-31
Coauthor Index
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