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F. Lorut

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2013
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Thomas Frank, Stéphane Moreau, Cédrick Chappaz, Patrick Leduc, Lucile Arnaud, Aurélie Thuaire, Emmanuel Chery, F. Lorut, Lorena Anghel, Gilles Poupon:
Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric. Microelectron. Reliab. 53(1): 17-29 (2013)

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