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Karlheinz Bock
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2020 – today
- 2023
- [c8]Viktor Dudash, Kashi Vishwanath Machani, Bjoern Boehme, Simone Capecchi, Jungtae Ok, Karsten Meier, Frank Kuechenmeister, Marcel Wieland, Karlheinz Bock:
Wafer Level Chip Scale Package Failure Mode Prediction using Finite Element Modeling. IRPS 2023: 1-6 - [c7]Marco Liess, Julian Demicoli, Tobias Tiedje, Matthias Lohrmann, Matthias Nickel, M. Luniak, Dimitrios A. Prousalis, Thomas Wild, Ronald Tetzlaff, Diana Göhringer, Christian Mayr, Karlheinz Bock, Sebastian Steinhorst, Andreas Herkersdorf:
X-MAPE: Extending 6G-Connected Self-Adaptive Systems with Reflexive Actions. NFV-SDN 2023: 163-167
2010 – 2019
- 2019
- [j7]Gerhard P. Fettweis, Meik Dorpinghaus, Jerónimo Castrillón, Akash Kumar, Christel Baier, Karlheinz Bock, Frank Ellinger, Andreas Fery, Frank H. P. Fitzek, Hermann Härtig, Kambiz Jamshidi, Thomas Kissinger, Wolfgang Lehner, Michael Mertig, Wolfgang E. Nagel, Giang T. Nguyen, Dirk Plettemeier, Michael Schröter, Thorsten Strufe:
Architecture and Advanced Electronics Pathways Toward Highly Adaptive Energy- Efficient Computing. Proc. IEEE 107(1): 204-231 (2019) - 2018
- [j6]Krzysztof Nieweglowski, Lukas Lorenz, Sebastian Lüngen, Tobias Tiedje, Klaus-Jürgen Wolter, Karlheinz Bock:
Optical coupling with flexible polymer waveguides for chip-to-chip interconnects in electronic systems. Microelectron. Reliab. 84: 121-126 (2018) - [j5]Karsten M. Decker, René M. Rehmann, Mike Roellig, Karlheinz Bock:
Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly. Microelectron. Reliab. 87: 125-132 (2018) - [c6]Christian Maleck, Gottfried Nieke, Karlheinz Bock, Detlef Pabst, Marcel Stehli:
A Comparison of an CP and MIP Approach for Scheduling jobs in production areas with Time Constraints and uncertainties. WSC 2018: 3526-3537 - [c5]Gottfried Nieke, Christian Maleck, Karlheinz Bock, Marcel Stehli, Steffen Kalisch:
A Mathematical Model for the External Scheduling of a Cluster Tool Workstation. WSC 2018: 3538-3549 - [c4]Dirk Doleschal, Karlheinz Bock:
A CP Model for a Scheduling Problem with Limited secondary Resources compared to a des Model. WSC 2018: 3684-3695 - 2017
- [c3]Mircea Catuneanu, Ronny Henker, R. Hosseini, M. Jazayerifar, H. Aminpour, David Schoeniger, Alexandru Giuglea, Krzysztof Nieweglowski, Frank Ellinger, Karlheinz Bock, Kambiz Jamshidi:
Design considerations and constraints in silicon based optical on-board interconnects for short range communications. ICTON 2017: 1-4 - 2015
- [c2]Tetiana Voitsekhivska, Felix Zorgiebel, Eike Suthau, Klaus-Jürgen Wolter, Karlheinz Bock, Gianaurelio Cuniberti:
pH measurements of FET-based (bio)chemical sensors using portable measurement system. EMBC 2015: 6445-6448 - [c1]Michael Jenning, Bernhard Klein, Ronny Hahnel, Dirk Plettemeier, David Fritsche, Gregor Tretter, Corrado Carta, Frank Ellinger, Tobias Nardmann, Michael Schröter, Krzysztof Nieweglowski, Karlheinz Bock, Johannes Israel, Andreas Fischer, Najeeb ul Hassan, Lukas Landau, Meik Dorpinghaus, Gerhard P. Fettweis:
Energy-Efficient Transceivers for Ultra-Highspeed Computer Board-to-Board Communication. ICUWB 2015: 1-5 - 2014
- [j4]Indranil Bose, Kornelius Tetzner, Kathrin Borner, Karlheinz Bock:
Air-stable, high current density, solution-processable, amorphous organic rectifying diodes (ORDs) for low-cost fabrication of flexible passive low frequency RFID tags. Microelectron. Reliab. 54(9-10): 1643-1647 (2014)
2000 – 2009
- 2007
- [j3]Stephan Schoenfelder, Matthias Ebert, Christof Landesberger, Karlheinz Bock, Jörg Bagdahn:
Investigations of the influence of dicing techniques on the strength properties of thin silicon. Microelectron. Reliab. 47(2-3): 168-178 (2007) - [p1]Karlheinz Bock:
Polytronik und das Internet der Dinge. Internet der Dinge 2007: 203-218 - 2005
- [j2]Karlheinz Bock:
Polymer Electronics Systems - Polytronics. Proc. IEEE 93(8): 1400-1406 (2005) - 2001
- [j1]Karlheinz Bock, Bart Keppens, Vincent De Heyn, Guido Groeseneken, L. Y. Ching, A. Naem:
Influence of gate length on ESD-performance for deep submicron CMOS technology. Microelectron. Reliab. 41(3): 375-383 (2001)
Coauthor Index
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