![](https://dblp.dagstuhl.de/img/logo.320x120.png)
![search dblp search dblp](https://dblp.dagstuhl.de/img/search.dark.16x16.png)
![search dblp](https://fanyv88.com/img/search.dark.16x16.png)
default search action
"Voltage Surges by Backside ESD Impacts on IC Chip in Flip Chip Packaging."
Takuya Wadatsumi et al. (2022)
- Takuya Wadatsumi, Kohei Kawai, Rikuu Hasegawa, Takuji Miki
, Makoto Nagata, Kikuo Muramatsu, Hiromu Hasegawa, Takuya Sawada, Takahito Fukushima, Hisashi Kondo:
Voltage Surges by Backside ESD Impacts on IC Chip in Flip Chip Packaging. IRPS 2022: 14-1
![](https://dblp.dagstuhl.de/img/cog.dark.24x24.png)
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.
![](https://fanyv88.com/img/new-feature-top-right.156x64.png)