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RD53 Pixel Readout Integrated Circuits for ATLAS and CMS HL-LHC Upgrades / Christiansen, Jorgen (CERN) /RD53 collaboration
The RD53 collaboration has since 2013 developed new hybrid pixel detector chips with 50x50um$^2$ pixels for the HL-LHC upgrades of the ATLAS and CMS experiments at CERN. A common architecture, design and verification framework has been developed to enable final pixel chips with different chip sizes to be designed, verified and tested to handle extreme hit rates of 3GHz/cm$^2$ (12GHz per chip) together with significantly increased trigger rate of 1MHz and efficient readout of up to 5.12Gbits/s per pixel chip. [...]
CERN-RD53-PUB-24-002.- Geneva : CERN, 2024 - 64. JINST second submission after review: PDF; Latex source folder zipped: ZIP;

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(91)

RD53B Manual / Garcia-Sciveres, Maurice (Lawrence Berkeley National Lab. (US)) ; Loddo, Flavio (Universita e INFN, Bari (IT)) ; Christiansen, Jorgen (CERN) /RD53 collaboration
Detalied description ifthe RD53B design applicable to both ATLAS and CMS submissions. Also GDS files of top metal of submitted chips
CERN-RD53-PUB-19-002.- Geneva : CERN, 2019 - 100. - Published in : 1) Detailed_ATLAS_Manual_pdf_from_gitlab
- Published in : 2) Detailed_CMS_Manual_pdf_from_gitlab
- Published in : 3) General_introductory_guide RD53B_ATLAS_top_metal_Final: GZ; RD53B_CMS_top_metal_V1: ZIP;

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(48)

Test results of RD53B chips for ATLAS and CMS phase-2 pixel upgrades / Koukola, Dominik (speaker) (CERN)
Following the RD53A demonstrator, the ItkPix (ATLAS) and CROC (CMS) pixel readout chips are being developed within the RD53 collaboration for the HL-LHC pixel detector upgrades of the two experiments. The two chips are based on a common design, called RD53B, in 65nm CMOS technology and are optimized for very high rate (3GHz/cm2) and radiation levels (>500Mrad). [...]
2021 - 1197. Conferences; TWEPP 2021 Topical Workshop on Electronics for Particle Physics External links: Talk details; Event details In : TWEPP 2021 Topical Workshop on Electronics for Particle Physics

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(39)

Design and optimisation of low power hybrid pixel array logic for the extreme hit and trigger rates of the Large Hadron Collider upgrade / Marconi, Sara
Digital design of integrated circuits in nanometer technology requires to address several design challenges [...]
CERN-THESIS-2017-400 -

Fulltext

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(38)

Characterisation of the first digital modules with RD53B-CMS readout chips for the Phase-2 Upgrade of the CMS Inner Tracker / Missiroli, Marino (PSI, Villigen) /CMS Collaboration
To cope with the challenges posed by the High-Luminosity LHC, the CMS experiment will feature a new silicon tracker. The modules of the upgraded inner tracker are hybrid silicon pixel modules based on a new readout chip, developed by the RD53 Collaboration. [...]
CMS-CR-2022-196.- Geneva : CERN, 2023 - 7 p. - Published in : JINST 18 (2023) C01027 Fulltext: PDF;
In : Topical Workshop on Electronics for Particle Physics 2022 (TWEPP 2022), Bergen, Norway, 19 - 23 Sep 2022, pp.C01027

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(35)

Extension of RD53 for 3 years to finalize pixel chips for the ATLAS and CMS pixel detector upgrades / Christiansen, J (CERN) ; Garcia-Sciveres, M (LBNL)
The RD53 collaboration was established in 2013 to develop next generation radiation hard pixel readout chips for the High Luminosity LHC detector upgrades. [...]
CERN-LHCC-2021-011 ; LHCC-SR-009. - 2021.
Fulltext - Original Document (LHCC-P-006)

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(34)

Radiation-induced Effects on Data Integrity and Link Stability of the RD53A Pixel Readout Chip / Vogt, M. (Bonn U.) /RD53 Collaboration
The phase-2 upgrade of the LHC will require novel pixel readout chips, which deliver hit information at drastically increased data rates and tolerate unprecedented radiation levels. The large-scale prototype chip RD53A has been designed by the RD53 collaboration and manufactured in a 65 nm CMOS process, suitable for the innermost layers of both the ATLAS and the CMS experiment. [...]
arXiv:1903.08010.- 2019-05-23 - 9 p. - Published in : JINST 14 (2019) C05018 Fulltext: PDF;
In : International Workshop on Semiconductor Pixel Detectors for Particles and Imaging (PIXEL2018), Taipei, Taiwan, 10 - 14 Dec 2018, pp.C05018

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(34)

First results from the RD53 ATLAS pixel production readout ASIC (ITkPixV2) for HL-LHC / Mironova, Maria (LBNL, Berkeley) /RD53 Collaboration
The Phase-2 upgrades of ATLAS and CMS for the High-Luminosity LHC (HL-LHC), require a new tracker with robust readout electronics capable of withstanding extreme radiation (1 Grad), a high hit rate (3 GHz/cm2), and a high data rate readout (5 Gb/s). In a joint effort between ATLAS and CMS, pixel detector readout chips have been designed by the RD53 collaboration in 65 nm CMOS technology. [...]
2024 - 4 p. - Published in : Nucl. Instrum. Methods Phys. Res., A 1068 (2024) 169671
In : PSD13: The 13th International Conference on Position Sensitive Detectors, Oxford, United Kingdom, 3 - 9 Sep 2023, pp.169671

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(33)

RD53 (Development of pixel readout integrated circuits for extreme rate and radiation) / CHRISTIANSEN, Jorgen (speaker) (CERN)
2014 - 1095. SLHC; ACES 2014 - Fourth Common ATLAS CMS Electronics Workshop for LHC Upgrades External links: Talk details; Event details In : ACES 2014 - Fourth Common ATLAS CMS Electronics Workshop for LHC Upgrades

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Upgrade of the YARR DAQ system for the ATLAS Phase-II pixel detector readout chip / Whallon, Nikola Lazar (U. Washington, Seattle (main)) ; Heim, Timon (LBNL, Berkeley) ; Garcia-Sciveres, Maurice (LBNL, Berkeley) ; Sautaux, Arnaud (LBNL, Berkeley) ; Oide, Hideyuki (INFN, Genoa) ; Potamianos, Karolos (DESY) ; Hsu, Shih-Chieh (U. Washington, Seattle (main))
Yet Another Rapid Readout (YARR) is a DAQ system based on a software driven architecture using PCIe FPGA boards. It was designed for the readout of current generation ATLAS Pixel detector readout chips, which have a readout bandwidth of 160 Mb/s. [...]
SISSA, 2018 - 5 p. - Published in : PoS TWEPP-17 (2018) 076 Fulltext: PDF; External link: PoS server
In : Topical Workshop on Electronics for Particle Physics, Santa Cruz, Ca, United States Of America, 11 - 15 Sep 2017, pp.076

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