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1.
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Production and characterization of SLID interconnected n-in-p pixel modules with 75 micron thin silicon sensors
/ Andricek, L (MPG-MPP) ; Beimforde, M (MPG-MPP) ; Macchiolo, A (MPG-MPP) ; Moser, H.G (MPG-MPP) ; Nisius, R (MPG-MPP) ; Richter, R.H (MPG-MPP) ; Terzo, S (MPG-MPP) ; Weigell, P (MPG-MPP)
The performance of pixel modules built from 75 micrometer thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer EMFT, is a possible alternative to the standard bump-bonding. [...]
AIDA-PUB-2014-028.-
Geneva : CERN, 2014
- Published in : Nucl. Instrum. Methods Phys. Res., A 758 (2014) 30-43
Fulltext: PDF;
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2.
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Production and characterisation of SLID interconnected n-in-p pixel modules with 75 μm thin silicon sensors
/ Andricek, L (MPG-MPP) ; Beimforde, M (MPG-MPP) ; Macchiolo, A (MPG-MPP) ; Moser, H.G (MPG-MPP) ; Nisius, R (MPG-MPP) ; Richter, R.H (MPG-MPP) ; Terzo, S (MPG-MPP) ; Weigell, P (MPG-MPP)
The performance of pixel modules built from 75 μm thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer EMFT, is a possible alternative to the standard bump-bonding. [...]
AIDA-PUB-2014-013.-
Geneva : CERN, 2014
- Published in : Nucl. Instrum. Methods Phys. Res., A 758 (2014) 30-43
Fulltext: PDF;
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3.
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SLID-ICV Vertical Integration Technology for the ATLAS Pixel Upgrades
/ Macchiolo, A. (Munich, Max Planck Inst.) ; Andricek, L. (Munich, Max Planck Inst. ; Munich, Max Planck Inst. HLL) ; Moser, H.G. (Munich, Max Planck Inst. ; Munich, Max Planck Inst. HLL) ; Nisius, R. (Munich, Max Planck Inst.) ; Richter, R.H. (Munich, Max Planck Inst. ; Munich, Max Planck Inst. HLL) ; Weigell, P. (Munich, Max Planck Inst.)
We present the results of the characterization of pixel modules composed of 75 μm thick n-in-p sensors and ATLAS FE-I3 chips, interconnected with the SLID (Solid Liquid Inter-Diffusion) technology. This technique, developed at Fraunhofer-EMFT, is explored as an alternative to the bump-bonding process. [...]
arXiv:1202.6497; AIDA-CONF-2014-015; AIDA-CONF-2014-015.-
Geneva : CERN, 2012-02 - 7 p.
- Published in :
Elsevier Open Access article: PDF; Fulltext: AIDA-CONF-2014-015 - PDF; 10.1016_j.phpro.2012.02.444 - PDF; Preprint: PDF; External link: Preprint
In : 2nd International Conference on Technology and Instrumentation in Particle Physics, Chicago, IL, USA, 9 - 14 Jun 2011, pp.1009-1015
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4.
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Characterization of Thin Pixel Sensor Modules Interconnected with SLID Technology Irradiated to a Fluence of 2⋅10 15 $n_{eq}$ /cm 2
/ Weigell, P (MPI) ; Andricek, L (MPI) ; Beimforde, M (MPI) ; Macchiolo, A (MPI) ; Moser, H G (MPI) ; Nisius, R (MPI) ; Richter, R H (MPI)
A new module concept for future ATLAS pixel detector upgrades is presented, where thin n-in-p silicon sensors are connected to the front-end chip exploiting the novel Solid Liquid Interdiffusion technique (SLID) and the signals are read out via Inter Chip Vias (ICV) etched through the front-end. This should serve as a proof of principle for future four-side buttable pixel assemblies for the ATLAS upgrades, without the cantilever presently needed in the chip for the wire bonding. [...]
AIDA-PUB-2011-011.-
Geneva : CERN, 2011
- Published in : JINST 6 (2011) C12049
Fulltext: PDF;
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5.
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Production and Characterisation of SLID Interconnected n-in-p Pixel Modules with 75 Micrometer Thin Silicon Sensors
/ Andricek, L. (Munich, Max Planck Inst. HLL) ; Beimforde, M. (Munich, Max Planck Inst.) ; Macchiolo, A. (Munich, Max Planck Inst.) ; Moser, H.-G. (Munich, Max Planck Inst.) ; Nisius, R. (Munich, Max Planck Inst.) ; Richter, R.H. (Munich, Max Planck Inst. HLL) ; Terzo, S. (Munich, Max Planck Inst.) ; Weigell, P. (Munich, Max Planck Inst.)
The performance of pixel modules built from 75 micrometer thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer EMFT, is a possible alternative to the standard bump-bonding. [...]
arXiv:1310.5854.-
Geneva : CERN, 2014 - 14 p.
- Published in : Nucl. Instrum. Methods Phys. Res., A 758 (2014) 30-43
Fulltext: AIDA-PUB-2014-005 - PDF; arXiv:1310.5854 - PDF; External link: Preprint
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6.
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Thin n-in-p pixel sensors and the SLID-ICV vertical integration technology for the ATLAS upgrade at the HL-LHC
/ Macchiolo,A (MPI) ; Andricek,L (MPI) ; Ellenburg,M (MPI) ; Nisius,R (MPI) ; Richter,R.H (MPI) ; Terzo,S (MPI) ; Weigell,P (MPI)
The R&D; activity presented is focused on the development of new modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The performance after irradiation of n-in-p pixel sensors of different active thicknesses is studied, together with an investigation of a novel interconnection technique offered by the Fraunhofer Institute EMFT in Munich, the Solid-Liquid-InterDiffusion (SLID), which is an alternative to the standard solder bump-bonding. [...]
AIDA-PUB-2013-008.-
Geneva : CERN, 2013
- Published in : Nucl. Instrum. Methods Phys. Res., A 731 (2013) 210-215
Fulltext: PDF;
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7.
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Novel Silicon n-in-p Pixel Sensors for the future ATLAS Upgrades
/ La Rosa, A. (Geneva U.) ; Gallrapp, C. (CERN) ; Macchiolo, A. (Munich, Max Planck Inst.) ; Nisius, R. (Munich, Max Planck Inst.) ; Pernegger, H. (CERN) ; Richter, R.H. (Munich, Max Planck Inst.) ; Weigell, P. (Munich, Max Planck Inst.)
In view of the LHC upgrade phases towards HL-LHC the ATLAS experiment plans to upgrade the Inner Detector with an all silicon system. The n-in-p silicon technology is a promising candidate for the pixel upgrade thanks to its radiation hardness and cost effectiveness, that allow for enlarging the area instrumented with pixel detectors. [...]
arXiv:1205.5305; AIDA-PUB-2013-005.-
Geneva : CERN, 2013 - 2 p.
- Published in : Nucl. Instrum. Methods Phys. Res., A 718 (2013) 329-330
Fulltext: PDF; Preprint: PDF; External link: Preprint
In : 12th Pisa Meeting on Advanced Detectors: Frontier Detector for Frontier Physics, La Biodola, Isola d'Elba, Italy, 20 - 26 May 2012, pp.329-330
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8.
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Heavily Irradiated N-in-p Thin Planar Pixel Sensors with and without Active Edges
/ Terzo, Stefano (Munich, Max Planck Inst.) ; Andricek, L. (Munich, Max Planck Inst. HLL) ; Macchiolo, A. (Munich, Max Planck Inst.) ; Moser, H.G. (Munich, Max Planck Inst. ; Munich, Max Planck Inst. HLL) ; Nisius, R. (Munich, Max Planck Inst.) ; Richter, R.H. (Munich, Max Planck Inst. HLL) ; Weigell, P. (Munich, Max Planck Inst.)
We present the results of the characterization of silicon pixel modules employing n-in-p planar sensors with an active thickness of 150 $\mathrm{\mu}$m, produced at MPP/HLL, and 100-200 $\mathrm{\mu}$m thin active edge sensor devices, produced at VTT in Finland. These thin sensors are designed as candidates for the ATLAS pixel detector upgrade to be operated at the HL-LHC, as they ensure radiation hardness at high fluences. [...]
arXiv:1401.2887.-
2014-05-15 - 10 p.
- Published in : JINST 9 (2014) C05023
Preprint: PDF; External link: Preprint
In : 15th International Workshop on Radiation Imaging Detectors, Paris, France, 23 - 27 Jun 2013, pp.C05023
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9.
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Development of active edge pixel sensors and four-side buttable modules using vertical integration technologies
/ Macchiolo, A. (Munich, Max Planck Inst.) ; Andricek, L. (Munich, Max Planck Inst. HLL) ; Moser, H.-G. (Munich, Max Planck Inst.) ; Nisius, R. (Munich, Max Planck Inst.) ; Richter, R.H. (Munich, Max Planck Inst. HLL) ; Terzo, S. (Munich, Max Planck Inst.) ; Weigell, P. (Munich, Max Planck Inst.)
We present an R&D; activity focused on the development of novel modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The modules consist of n-in-p pixel sensors, 100 or 200 $\mu$m thick, produced at VTT (Finland) with an active edge technology, which considerably reduces the dead area at the periphery of the device. [...]
arXiv:1310.4984; AIDA-CONF-2015-042.-
2014-11-21 - 6 p.
- Published in : Nucl. Instrum. Methods Phys. Res., A 765 (2014) 53-58
Fulltext: PDF; Preprint: PDF; External link: Preprint
In : 9th International "Hiroshima" Symposium on the Development and Application of Semiconductor Tracking Detectors, Hiroshima, Japan, 2 - 6 Sep 2013, pp.53-58
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10.
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Thin n-in-p pixel sensors and the SLID-ICV vertical integration technology for the ATLAS upgrade at the HL-LHC
/ Macchiolo, A. (Munich, Max Planck Inst.) ; Andricek, L. (Munich, Max Planck Inst. ; Munich, Max Planck Inst. HLL) ; Ellenburg, M. (Munich, Max Planck Inst.) ; Moser, H.G. (Munich, Max Planck Inst. ; Munich, Max Planck Inst. HLL) ; Nisius, R. (Munich, Max Planck Inst.) ; Richter, R.H. (Munich, Max Planck Inst. ; Munich, Max Planck Inst. HLL) ; Terzo, S. (Munich, Max Planck Inst.) ; Weigell, P. (Munich, Max Planck Inst.)
The R&D; activity presented is focused on the development of new modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The performance after irradiation of n-in-p pixel sensors of different active thicknesses is studied, together with an investigation of a novel interconnection technique offered by the Fraunhofer Institute EMFT in Munich, the Solid-Liquid-InterDiffusion (SLID), which is an alternative to the standard solder bump-bonding. [...]
arXiv:1210.7933.-
2013 - 6 p.
- Published in : Nucl. Instrum. Methods Phys. Res., A 731 (2013) 210-215
External link: Preprint
In : 6th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging, Inawashiro, Japan, 3 - 7 Sep 2012, pp.210-215
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