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Production and characterization of SLID interconnected n-in-p pixel modules with 75 micron thin silicon sensors
/ Andricek, L (MPG-MPP) ; Beimforde, M (MPG-MPP) ; Macchiolo, A (MPG-MPP) ; Moser, H.G (MPG-MPP) ; Nisius, R (MPG-MPP) ; Richter, R.H (MPG-MPP) ; Terzo, S (MPG-MPP) ; Weigell, P (MPG-MPP)
The performance of pixel modules built from 75 micrometer thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer EMFT, is a possible alternative to the standard bump-bonding. [...]
AIDA-PUB-2014-028.-
Geneva : CERN, 2014
- Published in : Nucl. Instrum. Methods Phys. Res., A 758 (2014) 30-43
Fulltext: PDF;
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2.
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Production and characterisation of SLID interconnected n-in-p pixel modules with 75 μm thin silicon sensors
/ Andricek, L (MPG-MPP) ; Beimforde, M (MPG-MPP) ; Macchiolo, A (MPG-MPP) ; Moser, H.G (MPG-MPP) ; Nisius, R (MPG-MPP) ; Richter, R.H (MPG-MPP) ; Terzo, S (MPG-MPP) ; Weigell, P (MPG-MPP)
The performance of pixel modules built from 75 μm thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer EMFT, is a possible alternative to the standard bump-bonding. [...]
AIDA-PUB-2014-013.-
Geneva : CERN, 2014
- Published in : Nucl. Instrum. Methods Phys. Res., A 758 (2014) 30-43
Fulltext: PDF;
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3.
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SLID-ICV Vertical Integration Technology for the ATLAS Pixel Upgrades
/ Macchiolo, A. (Munich, Max Planck Inst.) ; Andricek, L. (Munich, Max Planck Inst. ; Munich, Max Planck Inst. HLL) ; Moser, H.G. (Munich, Max Planck Inst. ; Munich, Max Planck Inst. HLL) ; Nisius, R. (Munich, Max Planck Inst.) ; Richter, R.H. (Munich, Max Planck Inst. ; Munich, Max Planck Inst. HLL) ; Weigell, P. (Munich, Max Planck Inst.)
We present the results of the characterization of pixel modules composed of 75 μm thick n-in-p sensors and ATLAS FE-I3 chips, interconnected with the SLID (Solid Liquid Inter-Diffusion) technology. This technique, developed at Fraunhofer-EMFT, is explored as an alternative to the bump-bonding process. [...]
arXiv:1202.6497; AIDA-CONF-2014-015; AIDA-CONF-2014-015.-
Geneva : CERN, 2012-02 - 7 p.
- Published in :
Elsevier Open Access article: PDF; Fulltext: AIDA-CONF-2014-015 - PDF; 10.1016_j.phpro.2012.02.444 - PDF; Preprint: PDF; External link: Preprint
In : 2nd International Conference on Technology and Instrumentation in Particle Physics, Chicago, IL, USA, 9 - 14 Jun 2011, pp.1009-1015
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4.
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Characterization of Thin Pixel Sensor Modules Interconnected with SLID Technology Irradiated to a Fluence of 2⋅10 15 neq /cm 2
/ Weigell, P (MPI) ; Andricek, L (MPI) ; Beimforde, M (MPI) ; Macchiolo, A (MPI) ; Moser, H G (MPI) ; Nisius, R (MPI) ; Richter, R H (MPI)
A new module concept for future ATLAS pixel detector upgrades is presented, where thin n-in-p silicon sensors are connected to the front-end chip exploiting the novel Solid Liquid Interdiffusion technique (SLID) and the signals are read out via Inter Chip Vias (ICV) etched through the front-end. This should serve as a proof of principle for future four-side buttable pixel assemblies for the ATLAS upgrades, without the cantilever presently needed in the chip for the wire bonding. [...]
AIDA-PUB-2011-011.-
Geneva : CERN, 2011
- Published in : JINST 6 (2011) C12049
Fulltext: PDF;
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5.
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Production and Characterisation of SLID Interconnected n-in-p Pixel Modules with 75 Micrometer Thin Silicon Sensors
/ Andricek, L. (Munich, Max Planck Inst. HLL) ; Beimforde, M. (Munich, Max Planck Inst.) ; Macchiolo, A. (Munich, Max Planck Inst.) ; Moser, H.-G. (Munich, Max Planck Inst.) ; Nisius, R. (Munich, Max Planck Inst.) ; Richter, R.H. (Munich, Max Planck Inst. HLL) ; Terzo, S. (Munich, Max Planck Inst.) ; Weigell, P. (Munich, Max Planck Inst.)
The performance of pixel modules built from 75 micrometer thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer EMFT, is a possible alternative to the standard bump-bonding. [...]
arXiv:1310.5854.-
Geneva : CERN, 2014 - 14 p.
- Published in : Nucl. Instrum. Methods Phys. Res., A 758 (2014) 30-43
Fulltext: AIDA-PUB-2014-005 - PDF; arXiv:1310.5854 - PDF; External link: Preprint
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Thin n-in-p pixel sensors and the SLID-ICV vertical integration technology for the ATLAS upgrade at the HL-LHC
/ Macchiolo,A (MPI) ; Andricek,L (MPI) ; Ellenburg,M (MPI) ; Nisius,R (MPI) ; Richter,R.H (MPI) ; Terzo,S (MPI) ; Weigell,P (MPI)
The R&D; activity presented is focused on the development of new modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The performance after irradiation of n-in-p pixel sensors of different active thicknesses is studied, together with an investigation of a novel interconnection technique offered by the Fraunhofer Institute EMFT in Munich, the Solid-Liquid-InterDiffusion (SLID), which is an alternative to the standard solder bump-bonding. [...]
AIDA-PUB-2013-008.-
Geneva : CERN, 2013
- Published in : Nucl. Instrum. Methods Phys. Res., A 731 (2013) 210-215
Fulltext: PDF;
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7.
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Novel Silicon n-in-p Pixel Sensors for the future ATLAS Upgrades
/ La Rosa, A. (Geneva U.) ; Gallrapp, C. (CERN) ; Macchiolo, A. (Munich, Max Planck Inst.) ; Nisius, R. (Munich, Max Planck Inst.) ; Pernegger, H. (CERN) ; Richter, R.H. (Munich, Max Planck Inst.) ; Weigell, P. (Munich, Max Planck Inst.)
In view of the LHC upgrade phases towards HL-LHC the ATLAS experiment plans to upgrade the Inner Detector with an all silicon system. The n-in-p silicon technology is a promising candidate for the pixel upgrade thanks to its radiation hardness and cost effectiveness, that allow for enlarging the area instrumented with pixel detectors. [...]
arXiv:1205.5305; AIDA-PUB-2013-005.-
Geneva : CERN, 2013 - 2 p.
- Published in : Nucl. Instrum. Methods Phys. Res., A 718 (2013) 329-330
Fulltext: PDF; Preprint: PDF; External link: Preprint
In : 12th Pisa Meeting on Advanced Detectors: Frontier Detector for Frontier Physics, La Biodola, Isola d'Elba, Italy, 20 - 26 May 2012, pp.329-330
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8.
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Heavily Irradiated N-in-p Thin Planar Pixel Sensors with and without Active Edges
/ Terzo, Stefano (Munich, Max Planck Inst.) ; Andricek, L. (Munich, Max Planck Inst. HLL) ; Macchiolo, A. (Munich, Max Planck Inst.) ; Moser, H.G. (Munich, Max Planck Inst. ; Munich, Max Planck Inst. HLL) ; Nisius, R. (Munich, Max Planck Inst.) ; Richter, R.H. (Munich, Max Planck Inst. HLL) ; Weigell, P. (Munich, Max Planck Inst.)
We present the results of the characterization of silicon pixel modules employing n-in-p planar sensors with an active thickness of 150 μm, produced at MPP/HLL, and 100-200 μm thin active edge sensor devices, produced at VTT in Finland. These thin sensors are designed as candidates for the ATLAS pixel detector upgrade to be operated at the HL-LHC, as they ensure radiation hardness at high fluences. [...]
arXiv:1401.2887.-
2014-05-15 - 10 p.
- Published in : JINST 9 (2014) C05023
Preprint: PDF; External link: Preprint
In : 15th International Workshop on Radiation Imaging Detectors, Paris, France, 23 - 27 Jun 2013, pp.C05023
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9.
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Development of active edge pixel sensors and four-side buttable modules using vertical integration technologies
/ Macchiolo, A. (Munich, Max Planck Inst.) ; Andricek, L. (Munich, Max Planck Inst. HLL) ; Moser, H.-G. (Munich, Max Planck Inst.) ; Nisius, R. (Munich, Max Planck Inst.) ; Richter, R.H. (Munich, Max Planck Inst. HLL) ; Terzo, S. (Munich, Max Planck Inst.) ; Weigell, P. (Munich, Max Planck Inst.)
We present an R&D; activity focused on the development of novel modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The modules consist of n-in-p pixel sensors, 100 or 200 μm thick, produced at VTT (Finland) with an active edge technology, which considerably reduces the dead area at the periphery of the device. [...]
arXiv:1310.4984; AIDA-CONF-2015-042.-
2014-11-21 - 6 p.
- Published in : Nucl. Instrum. Methods Phys. Res., A 765 (2014) 53-58
Fulltext: PDF; Preprint: PDF; External link: Preprint
In : 9th International "Hiroshima" Symposium on the Development and Application of Semiconductor Tracking Detectors, Hiroshima, Japan, 2 - 6 Sep 2013, pp.53-58
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10.
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Thin n-in-p pixel sensors and the SLID-ICV vertical integration technology for the ATLAS upgrade at the HL-LHC
/ Macchiolo, A. (Munich, Max Planck Inst.) ; Andricek, L. (Munich, Max Planck Inst. ; Munich, Max Planck Inst. HLL) ; Ellenburg, M. (Munich, Max Planck Inst.) ; Moser, H.G. (Munich, Max Planck Inst. ; Munich, Max Planck Inst. HLL) ; Nisius, R. (Munich, Max Planck Inst.) ; Richter, R.H. (Munich, Max Planck Inst. ; Munich, Max Planck Inst. HLL) ; Terzo, S. (Munich, Max Planck Inst.) ; Weigell, P. (Munich, Max Planck Inst.)
The R&D; activity presented is focused on the development of new modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The performance after irradiation of n-in-p pixel sensors of different active thicknesses is studied, together with an investigation of a novel interconnection technique offered by the Fraunhofer Institute EMFT in Munich, the Solid-Liquid-InterDiffusion (SLID), which is an alternative to the standard solder bump-bonding. [...]
arXiv:1210.7933.-
2013 - 6 p.
- Published in : Nucl. Instrum. Methods Phys. Res., A 731 (2013) 210-215
External link: Preprint
In : 6th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging, Inawashiro, Japan, 3 - 7 Sep 2012, pp.210-215
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