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Timepix4, a large area pixel detector readout chip which can be tiled on 4 sides providing sub-200 ps timestamp binning
/ Llopart, X (CERN) ; Alozy, J (CERN) ; Ballabriga, R (CERN) ; Campbell, M (CERN) ; Casanova, R (Barcelona, IFAE) ; Gromov, V (Nikhef, Amsterdam) ; Heijne, E H M (CERN ; IEAP CTU, Prague) ; Poikela, T (CERN) ; Santin, E (CERN) ; Sriskaran, V (CERN) et al.
Timepix4 is a 24.7 × 30.0 mm$^{2}$ hybrid pixel detector readout ASIC which has been designed to permit detector tiling on 4 sides. It consists of 448 × 512 pixels which can be bump bonded to a sensor with square pixels at a pitch of 55 µm. [...]
2022 - 15 p.
- Published in : JINST 17 (2022) C01044
Fulltext: PDF;
In : 22nd International Workshop on Radiation Imaging Detectors, Online, 27 Jun - 1 Jul 2021, pp.C01044
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ATLASpix3 : A high voltage CMOS sensor chip designed for ATLAS Inner Tracker
/ Prathapan, Mridula (KIT, Karlsruhe) ; Schimassek, Rudolf (KIT, Karlsruhe) ; Benoit, Mathieu (Geneva U.) ; Casanova, Raimon (Barcelona, IFAE) ; Ehrler, Felix (KIT, Karlsruhe) ; Meneses, Annie (Heidelberg U.) ; Pangaud, Patrick (Marseille, CPPM ; Aix-Marseille U.) ; Sultan, D M S (Geneva U.) ; Vilella, Eva (U. Liverpool (main)) ; Weber, Alena Larissa (Heidelberg U. ; KIT, Karlsruhe) et al.
ATLASpix3 is a 2×2 cm$^2$ high voltage CMOS sensor chip designed to meet the specifications of outer layers of ATLAS inner tracker. It is compatible with the hybrid pixel sensor ASIC RD53A in terms of electronic interface and geometry. [...]
SISSA, 2020 - 5 p.
- Published in : PoS TWEPP2019 (2020) 010
Fulltext: PDF;
In : TWEPP 2019 Topical Workshop on Electronics for Particle Physics, Santiago De Compostela, Spain, 2 - 6 Sep 2019, pp.010
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Towards the large area HVCMOS demonstrator for ATLAS ITk
/ Prathapan, M (KIT, Karlsruhe) ; Benoit, M (Geneva U.) ; Casanova, R (Barcelona, IFAE) ; Dannheim, D (CERN) ; Ehrler, F (KIT, Karlsruhe) ; Kiehn, M (Geneva U.) ; Nürnberg, A (KIT, Karlsruhe) ; Pangaud, P (Marseille, CPPM) ; Schimassek, R (KIT, Karlsruhe) ; Vilella, E (U. Liverpool (main)) et al.
High Voltage CMOS (HVCMOS) sensor is a proposed cost effective alternative to the existing hybrid sensors in ATLAS ITk pixel barrel for outer layers. To prove the feasibility of HVCMOS sensors in ATLAS experiment, a large area demonstrator chip is being designed. [...]
Elsevier , 2019 - 3 p.
- Published in : Nucl. Instrum. Methods Phys. Res., A 936 (2019) 389-391
In : Frontier Detectors for Frontier Physics: XIV Pisa Meeting on Advanced Detectors, La Biodola, Isola D'elba, Italy, 27 May - 2 Jun 2018, pp.389-391
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Radiation hard Depleted Monolithic Active Pixel Sensors with high-resistivity substrates
/ Terzo, Stefano (Barcelona, IFAE) ; Benoit, Mathieu (CERN) ; Cavallaro, Emanuele (Barcelona, IFAE) ; Casanova, Raimon (Barcelona, IFAE) ; Foerster, Fabian (Barcelona, IFAE) ; Grinstein, Sebastian (Barcelona, IFAE) ; Iacobucci, Giuseppe (Barcelona, IFAE) ; Peric, Ivan (KIT, Karlsruhe) ; Puigdengoles, Carles (Barcelona, IFAE) ; Vilella, Eva (Liverpool U.)
High Voltage/High resistivity Depleted Monolithic Active Pixel Sensors (HV/HR-DMAPS) is a technology which is becoming of great interest for high energy physics applications.With respect to hybrid pixel detectors the monolithic approach offers the main advantages of reduced material budget and production costs due to the absence of the bump bonding process. This aspect is important especially when large areas need to be covered as in the tracking detectors of the LHC experiments. [...]
SISSA, 2019 - 5 p.
- Published in : PoS TWEPP2018 (2019) 125
In : Topical Workshop on Electronics for Particle Physics, Antwerp, Belgique, 17 - 21 Sep 2018, pp.125
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Design of a HVCMOS pixel sensor ASIC with on-chip readout electronics for ATLAS ITk Upgrade
/ Prathapan, Mridula (KIT, Karlsruhe) ; Barrillon, Pierre (Marseille, CPPM) ; Benoit, Mathieu (CERN) ; Casanova, Raimon (Barcelona, IFAE) ; Ehrler, Felix (KIT, Karlsruhe) ; Pangaud, Patrick (Marseille, CPPM) ; Pusti, Sourav (IIT Research Inst., Annapolis) ; Schimassek, Rudolf (KIT, Karlsruhe) ; Vilella, Eva (Liverpool U.) ; Weber, Alena Larissa (Heidelberg U.) et al.
ATLASpix is a series of monolithic High Voltage CMOS (HVCMOS) sensor chips that are engineered to meet the requirements of outer layers of ATLAS ITk pixel tracker for HL-LHC upgrade. They are large collection electrode designs on high resistive wafers to ensure high detection efficiency and radiation tolerance. [...]
SISSA, 2019 - 5 p.
- Published in : PoS TWEPP2018 (2019) 074
In : Topical Workshop on Electronics for Particle Physics, Antwerp, Belgique, 17 - 21 Sep 2018, pp.074
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CEPC Conceptual Design Report: Volume 2 - Physics & Detector
/ CEPC Study Group Collaboration
The Circular Electron Positron Collider (CEPC) is a large international scientific facility proposed by the Chinese particle physics community to explore the Higgs boson and provide critical tests of the underlying fundamental physics principles of the Standard Model that might reveal new physics. [...]
arXiv:1811.10545 ; IHEP-CEPC-DR-2018-02 ; IHEP-EP-2018-01 ; IHEP-TH-2018-01.
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2018 - 424.
Fulltext
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A Monolithic HV/HR-MAPS Detector with a Small Pixel Size of 50 µm x 50 µm for the ATLAS Inner Tracker Upgrade
/ Casanova Mohr, Raimon (IFAE) ; Casse, Gianluigi (UNILIV) ; Grinstein, Sebastian (ICREA, IFAE) ; Vilella, Eva (UNILIV) ; Voosebeld, Joost (UNILIV)
This paper presents a HV/HR-MAPS detector developed in the framework of the HV-CMOS collaboration for the ATLAS Inner Tracker update of the HL-LHC era. It was fabricated with a 150 nm HV-CMOS process which includes a layer to isolate the bulk of the PMOS transistors from the collecting node of the sensor. [...]
AIDA-2020-CONF-2019-002.-
Geneva : CERN, 2019
- Published in :
- Published in : PoS: TWEPP-17 (2018) , pp. 039
Fulltext: PDF;
In : Topical Workshop on Electronics for Particle Physics, Santa Cruz, Ca, United States Of America, 11 - 15 Sep 2017, pp.039
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Design and characterization of the monolithic matrices of the H35DEMO chip
/ Casanova Mohr, R. (IFAE) ; Cavallaro, E. (IFAE) ; Föster, F. (ICREA, IFAE) ; Grinstein, S. (ICREA, IFAE) ; Peric, I. (KIT) ; Puigdengoles, C. (IFAE) ; Terzo, S. (IFAE) ; Vilella, E. (UNILIV)
The H35DEMO chip is a HV/HR-MAPS demonstrator of 18.49 mm x 24.4 mm, fabricated with a 0.35 µm HVCMOS process from AMS in four different substrate resistivities. The chip is divided into four independent matrices with a pixel size of 50 µm x 250 µm. [...]
AIDA-2020-CONF-2019-001.-
Geneva : CERN, 2019
- Published in :
Fulltext: PDF;
In : Topical Workshop on Electronics for Particle Physics, Santa Cruz, Ca, United States Of America, 11 - 15 Sep 2017
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Characterisation of AMS H35 HV-CMOS monolithic active pixel sensor prototypes for HEP applications
/ Terzo, S. (Barcelona, IFAE) ; Benoit, M. (Geneva U.) ; Cavallaro, E. (Barcelona, IFAE) ; Casanova, R. (Barcelona, IFAE) ; Di Bello, F.A. (Geneva U.) ; Förster, F. (Barcelona, IFAE) ; Grinstein, S. (Barcelona, IFAE ; ICREA, Barcelona) ; Iacobucci, G. (Geneva U.) ; Perić, I. (KIT, Karlsruhe) ; Puigdengoles, C. (Barcelona, IFAE) et al.
Monolithic active pixel sensors produced in High Voltage CMOS (HV-CMOS) technology are being considered for High Energy Physics applications due to the ease of production and the reduced costs. Such technology is especially appealing when large areas to be covered and material budget are concerned. [...]
arXiv:1811.07817.-
2019-02-13 - 21 p.
- Published in : JINST 14 (2019) P02016
Fulltext: PDF;
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