Cardarelli, P. - Resultados de la búsqueda

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Timing resolution performance of Timepix4 bump-bonded assemblies / Bolzonella, R. (INFN, Ferrara) ; Alozy, J. (CERN) ; Ballabriga, R. (CERN) ; van Beuzekom, M. (NIKHEF, Amsterdam) ; Biesuz, N.V. (INFN, Ferrara) ; Campbell, M. (CERN) ; Cardarelli, P. (INFN, Ferrara) ; Cavallini, V. (INFN, Ferrara) ; Coco, V. (CERN) ; Cotta Ramusino, A. (INFN, Ferrara) et al.
The timing performance of the Timepix4 application-specific integrated circuit (ASIC) bump-bonded to a $100\;\mu\textrm{m}$ thick n-on-p silicon sensor is presented. A picosecond pulsed infrared laser was used to generate electron-hole pairs in the silicon bulk in a repeatable fashion, controlling the amount, position and time of the stimulated charge signal. [...]
arXiv:2404.15499.- 2024-07-22 - 24 p. - Published in : JINST 19 (2024) P07021 Fulltext: document - PDF; 2404.15499 - PDF;

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MariX, an advanced MHz-class repetition rate X-ray source for linear regime time-resolved spectroscopy and photon scattering / Serafini, L (INFN, Milan ; LASA, Segrate) ; Bacci, A (INFN, Milan ; LASA, Segrate) ; Bellandi, A (DESY) ; Bertucci, M (INFN, Milan ; LASA, Segrate) ; Bolognesi, M (Milan U.) ; Bosotti, A (INFN, Milan ; LASA, Segrate) ; Broggi, F (INFN, Milan ; LASA, Segrate) ; Calandrino, R (Milan U., Inst. San Raffaele) ; Camera, F (Milan U. ; INFN, Milan ; LASA, Segrate) ; Canella, F (Milan U.) et al.
The need of a fs-scale pulsed, high repetition rate, X-ray source for time-resolved fine analysis of matter (spectroscopy and photon scattering) in the linear response regime is addressed by the conceptual design of a facility called MariX (Multi-disciplinary Advanced Research Infrastructure for the generation and application of X-rays) outperforming current X-ray sources for the declared scope. MariX is based on the original design of a two-pass two-way superconducting linear electron accelerator, equipped with an arc compressor, to be operated in CW mode (1 MHz). [...]
2019 - 6 p. - Published in : Nucl. Instrum. Methods Phys. Res., A 930 (2019) 167-172

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