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CERN Document Server 15 records found  1 - 10next  jump to record: Search took 0.60 seconds. 
1.
Simulations and performance studies of a MAPS in 65 nm CMOS imaging technology / Simancas, Adriana (DESY ; Bonn U.) ; Braach, Justus (CERN ; Hamburg U., Dept. Math.) ; Buschmann, Eric (CERN) ; Chauhan, Ankur (DESY) ; Dannheim, Dominik (CERN) ; Viera, Manuel Del Rio (DESY ; Bonn U.) ; Dort, Katharina (CERN ; Giessen U.) ; Eckstein, Doris (DESY) ; Feindt, Finn (DESY) ; Gregor, Ingrid-Maria (DESY) et al.
Monolithic active pixel sensors (MAPS) produced in a 65 nm CMOS imaging technology are being investigated for applications in particle physics. The MAPS design has a small collection electrode characterized by an input capacitance of ~fF, granting a high signal-to-noise ratio and low power consumption. [...]
arXiv:2402.14524.- 2024-05-03 - 5 p. - Published in : Nucl. Instrum. Methods Phys. Res., A 1064 (2024) 169414 Fulltext: 2402.14524 - PDF; Publication - PDF;
In : 13th International "Hiroshima" Symposium on the Development and Application of Semiconductor Tracking Detectors, Vancouver, Canada, 3 - 8 Dec 2023, pp.169414
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2.
Pixel detector hybridisation and integration with anisotropic conductive adhesives / Volker, Alexander (CERN) ; Schmidt, Janis Viktor (CERN) ; Dannheim, Dominik (CERN) ; Svihra, Peter (CERN) ; Pinto, Mateus Vicente Barreto (Geneva U.) ; de Oliveira, Rui (CERN) ; Braach, Justus (CERN) ; Yang, Xiao (CERN) ; Ruat, Marie (ESRF, Grenoble) ; Magalhaes, Débora (ESRF, Grenoble ; DESY) et al.
A reliable and cost-effective interconnect technology is required for the development of hybrid pixel detectors. The interconnect technology needs to be adapted for the pitch and die sizes of the respective applications. [...]
arXiv:2312.09883.- 2024-05-13 - 13 p. - Published in : JINST 19 (2024) C05024 Fulltext: 2312.09883 - PDF; Publication - PDF;
In : 16th Topical Seminar on Innovative Particle and Radiation Detectors, Siena, Italy, 25 - 29 Sep 2023, pp.C05024
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3.
Annual Report 2023 and Phase-I Closeout / Aglieri Rinella, Gianluca
This report summarises the activities of the CERN strategic R&D programme on technologies for future experiments during the year 2023, and highlights the achievements of the programme during its first phase 2020-2023..
CERN-EP-RDET-2024-001 - 208.

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4.
Test-beam Performance Results of the FASTPIX Sub-Nanosecond CMOS Pixel Sensor Demonstrator / Braach, Justus (CERN ; Hamburg U.) ; Buschmann, Eric (CERN) ; Dannheim, Dominik (CERN) ; Dort, Katharina (CERN ; Giessen U., Inst. Kernphys.) ; Kugathasan, Thanushan (Geneva U.) ; Munker, Magdalena (Geneva U.) ; Snoeys, Walter (CERN) ; Švihra, Peter (CERN) ; Vicente, Mateus (CERN ; Geneva U.)
Within the ATTRACT FASTPIX project, a monolithic pixel sensor demonstrator chip has been developed in a modified 180 nm CMOS imaging process technology, targeting sub-nanosecond timing precision for single ionising particles. It features a small collection electrode design on a 25 micrometers-thick epitaxial layer and contains 32 mini matrices of 68 hexagonal pixels each, with pixel pitches ranging from 8.66 to 20 micrometers. [...]
arXiv:2306.05938.- 2023-09-09 - 15 p. - Published in : Nucl. Instrum. Methods Phys. Res., A 1056 (2023) 168641 Fulltext: PDF;
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5.
Developing a Monolithic Silicon Sensor in a 65nm CMOS Imaging Technology for Future Lepton Collider Vertex Detectors / Simancas, Adriana (DESY, Zeuthen ; Bonn U.) ; Braach, Justus (CERN ; Hamburg U.) ; Buschmann, Eric (CERN) ; Chauhan, Ankur (DESY, Zeuthen) ; Dannheim, Dominik (CERN) ; Viera, Manuel Del Rio (DESY, Zeuthen ; Bonn U.) ; Dort, Katharina (CERN ; Giessen U.) ; Eckstein, Doris (DESY, Zeuthen) ; Feindt, Finn (DESY, Zeuthen) ; Gregor, Ingrid-Maria (DESY, Zeuthen) et al.
Monolithic CMOS sensors in a 65 nm imaging technology are being investigated by the CERN EP Strategic R&D; Programme on Technologies for Future Experiments for an application in particle physics. The appeal of monolithic detectors lies in the fact that both sensor volume and readout electronics are integrated in the same silicon wafer, providing a reduction in production effort, costs and scattering material. [...]
arXiv:2303.18153.- 2022-11-05 - 7 p. - Published in : 10.1109/NSS/MIC44845.2022.10398964 Fulltext: PDF;
In : 2022 IEEE Nuclear Science Symposium (NSS), Medical Imaging Conference (MIC) and Room Temperature Semiconductor Detector (RTSD) Conference (NSS/MIC 2022), Milan, Italy, 5 - 12 Nov 2022
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6.
Annual Report 2022 / Aglieri, Gianluca
This report summarises the activities and main achievements of the CERN strategic R&D programme on technologies for future experiments during the year 2022
CERN-EP-RDET-2023-002 - 100.

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7.
Extension of the R&D Programme on Technologies for Future Experiments / Joram, Christian
we have conceived an extension of the R&D programme covering the period 2024 to 2028, i.e [...]
CERN-EP-RDET-2023-001 -

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8.
Digital Pixel Test Structures implemented in a 65 nm CMOS process / Rinella, Gianluca Aglieri (CERN) ; Andronic, Anton (Munster U.) ; Antonelli, Matias (INFN, Trieste ; Trieste U.) ; Aresti, Mauro (Cagliari U. ; INFN, Cagliari) ; Baccomi, Roberto (INFN, Trieste ; Trieste U.) ; Becht, Pascal (U. Heidelberg (main)) ; Beole, Stefania (Turin U. ; INFN, Turin) ; Braach, Justus (CERN ; Hamburg U.) ; Buckland, Matthew Daniel (INFN, Trieste ; Trieste U.) ; Buschmann, Eric (CERN) et al.
The ALICE ITS3 (Inner Tracking System 3) upgrade project and the CERN EP R&D; on monolithic pixel sensors are investigating the feasibility of the Tower Partners Semiconductor Co. 65 nm process for use in the next generation of vertex detectors. [...]
arXiv:2212.08621.- 2023-08-04 - 13 p. - Published in : Nucl. Instrum. Methods Phys. Res., A 1056 (2023) 168589 Fulltext: 2212.08621 - PDF; Publication - PDF;
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9.
Pixel detector hybridisation with anisotropic conductive films / Schmidt, J.V. (CERN ; KIT, Karlsruhe) ; Braach, Justus (Hamburg University (DE)) ; Dannheim, Dominik (CERN) ; De Oliveira, Rui (CERN) ; Svihra, Peter (CERN) ; Vicente Barreto Pinto, Mateus (Universite de Geneve (CH))
Hybrid pixel detectors require a reliable and cost-effective interconnect technology adapted to the pitch and die sizes of the respective applications. During the ASIC and sensor R&D; phase, and in general for small-scale applications, such interconnect technologies need to be suitable for the assembly of single-dies, typically available from Multi-Project-Wafer submissions. [...]
arXiv:2210.13046; CLICdp-Conf-2022-002.- Geneva : CERN, 2023-01-17 - 8 p. - Published in : JINST 18 (2023) C01040 Fulltext: 2210.13046 - PDF; CLICdp-Conf-2022-002 - PDF; Publication - PDF;
In : Topical Workshop on Electronics for Particle Physics 2022 (TWEPP 2022), Bergen, Norway, 19 - 23 Sep 2022, pp.C01040
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10.
Development of novel single-die hybridisation processes for small-pitch pixel detectors / Svihra, Peter (CERN) ; Braach, Justus (Hamburg University (DE)) ; Buschmann, Eric (CERN) ; Dannheim, Dominik (CERN) ; Dort, Katharina (Justus-Liebig-Universitaet Giessen (DE)) ; Fritzsch, Thomas (Fraunhofer IZM) ; Kristiansen, H (Conpart) ; Rothermund, M (Fraunhofer IZM) ; Schmidt, Janis Viktor (KIT - Karlsruhe Institute of Technology (DE)) ; Vicente Barreto Pinto, Mateus (Universite de Geneve (CH)) et al.
Hybrid pixel detectors require a reliable and cost-effective interconnect technology adapted to the pitch and die sizes of the respective applications. During the ASIC and sensor R&D; phase, especially for small-scale applications, such interconnect technologies need to be suitable for the assembly of single dies, typically available from Multi-Project-Wafer submissions. [...]
arXiv:2210.02132; CLICdp-Conf-2022-001.- Geneva : CERN, 2023-03-15 - 12 p.
- Published in : JINST Fulltext: CLICdp-Conf-2022-001 - PDF; 2210.02132 - PDF;
In : 23rd International Workshop for Radiation Imaging Detectors, Riva Del Garda, It, 26 - 30 Jun 2022, pp.C03008
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CERN Document Server : 15 records found   1 - 10next  jump to record:
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4 Braach, J
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