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Study of CMOS strip sensor for future silicon tracker
/ Han, Y (Beijing, Inst. High Energy Phys. ; Beijing, GUCAS) ; Zhu, H (Beijing, Inst. High Energy Phys. ; Beijing U. of Tech.) ; Affolder, A (UC, Santa Cruz) ; Arndt, K (Oxford U.) ; Bates, R (Glasgow U.) ; Benoit, M (Geneva U.) ; Di Bello, F (Geneva U.) ; Blue, A (Glasgow U.) ; Bortoletto, D (Oxford U.) ; Buckland, M (U. Liverpool (main) ; CERN) et al.
Monolithic silicon sensors developed with High-Voltage CMOS (HV-CMOS) processes have become highly attractive for charged particle tracking. Compared with the standard CMOS sensors, HV-CMOS sensors can provide larger and deeper depletion regions that lead to larger signals and faster charge collection. [...]
2020 - 6 p.
- Published in : Nucl. Instrum. Methods Phys. Res., A 981 (2020) 164520
In : 12th international "Hiroshima" Symposium on the Development and Application of Semiconductor Tracking Detectors (HSTD), Hiroshima, Japan, 14 - 18 Dec 2019, pp.164520
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2.
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Charge collection in irradiated HV-CMOS detectors
/ Hiti, B (Stefan Inst., Ljubljana) ; Affolder, A (UC, Santa Cruz) ; Arndt, K (Oxford U.) ; Bates, R (Glasgow U.) ; Benoit, M (Geneva U.) ; Di Bello, F (Geneva U.) ; Blue, A (Glasgow U.) ; Bortoletto, D (Oxford U.) ; Buckland, M (U. Liverpool (main) ; CERN) ; Buttar, C (Glasgow U.) et al.
Active silicon detectors built on p-type substrate are a promising technological solution for large area silicon trackers such as those at the High Luminosity LHC, but the radiation hardness of this novel approach has to be evaluated. Active n-in-p strip detector prototypes CHESS2 for ATLAS with different substrate resistivities in the range of 20–1000 Ωcm were irradiated with neutrons and protons up to a fluence of 2×1015neq cm−2 and 3.6×1015neq cm−2 . [...]
Elsevier, 2019 - 5 p.
- Published in : Nucl. Instrum. Methods Phys. Res., A 924 (2019) 214-218
In : 11th International "Hiroshima" Symposium on the Development and Application of Semiconductor Tracking Detectors (HSTD11) in conjunction with 2nd Workshop on SOI Pixel Detectors (SOIPIX2017) at OIST, Okinawa, Japan, Okinawa, Japan, 10 - 15 Dec 2017, pp.214-218
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3.
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Charge collection studies in irradiated HV-CMOS particle detectors
/ Affolder, A (Liverpool U.) ; Andelković, M (Nis U.) ; Arndt, K (Oxford U.) ; Bates, R (Glasgow U.) ; Blue, A (Glasgow U.) ; Bortoletto, D (Oxford U.) ; Buttar, C (Glasgow U.) ; Caragiulo, P (SLAC) ; Cindro, V (Stefan Inst., Ljubljana) ; Das, D (Rutherford) et al.
Charge collection properties of particle detectors made in HV-CMOS technology were investigated before and after irradiation with reactor neutrons. Two different sensor types were designed and processed in 180 and 350 nm technology by AMS. [...]
IOP, 2016 - 18 p.
- Published in : JINST 11 (2016) P04007
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4.
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ebook
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5.
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Production and Integration of the ATLAS Insertable B-Layer
/ ATLAS IBL Collaboration
During the shutdown of the CERN Large Hadron Collider in 2013-2014, an additional pixel layer was installed between the existing Pixel detector of the ATLAS experiment and a new, smaller radius beam pipe. The motivation for this new pixel layer, the Insertable B-Layer (IBL), was to maintain or improve the robustness and performance of the ATLAS tracking system, given the higher instantaneous and integrated luminosities realised following the shutdown. [...]
arXiv:1803.00844; FERMILAB-PUB-18-826-V.-
2018-05-16 - 90 p.
- Published in : JINST 13 (2018) T05008
Fulltext: 1803.00844 - PDF; pdf - PDF; 915f919fb4ff01d19bc67dd5a6b9cd70 - PDF; Fulltext from Publisher: PDF; External link: Fermilab Library Server
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6.
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Investigation of HV/HR-CMOS technology for the ATLAS Phase-II Strip Tracker Upgrade
/ Fadeyev, V (UC, Santa Cruz) ; Galloway, Z (UC, Santa Cruz) ; Grabas, H (UC, Santa Cruz) ; Grillo, A A (UC, Santa Cruz) ; Liang, Z (UC, Santa Cruz) ; Martinez-Mckinney, F (UC, Santa Cruz) ; Seiden, A (UC, Santa Cruz) ; Volk, J (UC, Santa Cruz) ; Affolder, A (Liverpool U.) ; Buckland, M (Liverpool U.) et al.
ATLAS has formed strip CMOS project to study the use of CMOS MAPS devices as silicon strip sensors for the Phase-II Strip Tracker Upgrade. This choice of sensors promises several advantages over the conventional baseline design, such as better resolution, less material in the tracking volume, and faster construction speed. [...]
2016 - 8 p.
- Published in : Nucl. Instrum. Methods Phys. Res., A 831 (2016) 189-196
In : 10th International "Hiroshima" Symposium on the Development and Application of Semiconductor Tracking Detectors, Xi'an, China, 25 - 29 Sep 2015, pp.189-196
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7.
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Radiation hardness studies of AMS HV-CMOS 350 nm prototype chip HVStripV1
/ Kanisauskas, K (Oxford U. ; Glasgow U.) ; Affolder, A (Liverpool U.) ; Arndt, K (Oxford U.) ; Bates, R (Glasgow U.) ; Benoit, M (Geneva U.) ; Bello, F Di (Geneva U.) ; Blue, A (Glasgow U.) ; Bortoletto, D (Oxford U.) ; Buckland, M (CERN ; MIT) ; Buttar, C (Glasgow U.) et al.
CMOS active pixel sensors are being investigated for their potential use in the ATLAS inner tracker upgrade at the HL-LHC. The new inner tracker will have to handle a significant increase in luminosity while maintaining a sufficient signal-to-noise ratio and pulse shaping times. [...]
2017 - 18 p.
- Published in : JINST 12 (2017) P02010
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8.
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Study of built-in amplifier performance on HV-CMOS sensor for the ATLAS phase-II strip tracker upgrade
/ Liang, Z (UC, Santa Cruz, Inst. Part. Phys. ; Beijing, Inst. High Energy Phys.) ; Affolder, A (Liverpool U.) ; Arndt, K (Oxford U.) ; Bates, R (Glasgow U.) ; Benoit, M (Geneva U.) ; Di Bello, F (Geneva U.) ; Blue, A (Glasgow U.) ; Bortoletto, D (Oxford U.) ; Buckland, M (Liverpool U. ; CERN) ; Buttar, C (Glasgow U.) et al.
This paper focuses on the performance of analog readout electronics (built-in amplifier) integrated on the high-voltage (HV) CMOS silicon sensor chip, as well as its radiation hardness. Since the total collected charge from minimum ionizing particle (MIP) for the CMOS sensor is 10 times lower than for a conventional planar sensor, it is crucial to integrate a low noise built-in amplifier on the sensor chip to improve the signal to noise ratio of the system. [...]
2016 - 5 p.
- Published in : Nucl. Instrum. Methods Phys. Res., A 831 (2016) 156-160
In : 10th International "Hiroshima" Symposium on the Development and Application of Semiconductor Tracking Detectors, Xi'an, China, 25 - 29 Sep 2015, pp.156-160
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9.
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Radiation hardness of two CMOS prototypes for the ATLAS HL-LHC upgrade project
/ Huffman, B T (U. Oxford (main)) ; Affolder, A (U. Liverpool (main)) ; Arndt, K (U. Oxford (main)) ; Bates, R (Glasgow U.) ; Benoit, M (U. Geneva (main)) ; Di Bello, F (U. Geneva (main)) ; Blue, A (Glasgow U.) ; Bortoletto, D (U. Oxford (main)) ; Buckland, M (U. Liverpool (main) ; CERN) ; Buttar, C (Glasgow U.) et al.
The LHC luminosity upgrade, known as the High Luminosity LHC (HL-LHC), will require the replacement of the existing silicon strip tracker and the transistion radiation tracker. Although a baseline design for this tracker exists the ATLAS collaboration and other non-ATLAS groups are exploring the feasibility of using CMOS Monolithic Active Pixel Sensors (MAPS) which would be arranged in a strip-like fashion and would take advantage of the service and support structure already being developed for the upgrade. [...]
AIDA-2020-PUB-2016-011.-
Geneva : CERN, 2016 - 14 p.
- Published in : JINST 11 (2016) C02005
IOP Open Access article: PDF;
In : Topical Workshop on Electronics for Particle Physics, Lisbon, Portugal, 28 Sep - 2 Oct 2015, pp.C02005
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10.
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3D active edge silicon sensors: Device processing, yield and QA for the ATLAS-IBL production
/ Da Via, Cinzia (Manchester U.) ; Boscardil, Maurizio (Fond. Bruno Kessler, Povo) ; Dalla Betta, GianFranco (INFN, Trento ; Trento U.) ; Fleta, Celeste (Barcelona, Inst. Microelectron.) ; Giacomini, Gabriele (Fond. Bruno Kessler, Povo) ; Hansen, Thor-Erik (SINTEF, Oslo) ; Hasi, Jasmine (SLAC) ; Kok, Angela (SINTEF, Oslo) ; Micelli, Andrea (INFN, Udine ; Udine U.) ; Povoli, Marco (INFN, Trento ; Trento U.) et al.
3D silicon sensors, where plasma micromachining is used to etch deep narrow apertures in the silicon substrate to form electrodes of PIN junctions, were successfully manufactured in facilities in Europe and USA. In 2011 the technology underwent a qualification process to establish its maturity for a medium scale production for the construction of a pixel layer for vertex detection, the Insertable B-Layer (IBL) at the CERN-LHC ATLAS experiment. [...]
SLAC-REPRINT-2013-039.-
2013 - 4 p.
- Published in : Nucl. Instrum. Methods Phys. Res., A 699 (2013) 18-21
In : The 8th international "Hiroshima" Symposium on the Development and Application of Semiconductor Tracking Detectors, Taipei, Taiwan, 5 - 8 Dec 2011, pp.18-21
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