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1.
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RD53 pixel chips for the ATLAS and CMS Phase-2 upgrades at HL-LHC
/ Loddo, F (INFN, Bari) ; Andreazza, A (Milan U. ; INFN, Milan) ; Arteche, F (Sao Paulo, Inst. Tech. Aeronautics) ; Barbero, M B (Marseille, CPPM) ; Barillon, P (Marseille, CPPM) ; Beccherle, R (INFN, Pisa) ; Bilei, G M (INFN, Perugia ; Perugia U.) ; Bjalas, W (CERN) ; Bonaldo, S (INFN, Padua ; Padua U.) ; Bortoletto, D (Oxford U.) et al.
The Phase-2 upgrades at the High-Luminosity LHC of ATLAS and CMS experiments at CERN will require a new tracker with readout electronics operating in extremely harsh radiation environment (1 Grad), high hit rate (3.5 GHz/cm2) and high data rate readout (5 Gb/s). The RD53 collaboration is a joint effort between the ATLAS and CMS to qualify the chosen 65 nm CMOS technology in high radiation environment and develop the pixel readout chips of both experiments. [...]
FERMILAB-PUB-24-0469-PPD.-
2024 - 5 p.
- Published in : Nucl. Instrum. Methods Phys. Res., A 1067 (2024) 169682
In : PSD13: The 13th International Conference on Position Sensitive Detectors, Oxford, United Kingdom, 3 - 9 Sep 2023, pp.169682
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2.
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3.
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4.
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Design implementation and test results of the RD53A, a 65 nm large scale chip for next generation pixel detectors at the HL-LHC
/ Marconi, S (Marseille, CPPM) ; Barbero, M B (Marseille, CPPM) ; Fougeron, D (Marseille, CPPM) ; Godiot, S (Marseille, CPPM) ; Menouni, M (Marseille, CPPM) ; Pangaud, P (Marseille, CPPM) ; Rozanov, A (Marseille, CPPM) ; Breugnon, P (Marseille, CPPM) ; Bomben, M (Paris U., VI-VII) ; Calderini, G (Paris U., VI-VII) et al.
The RD53A large scale pixel demonstrator chip has been developed in 65 nm CMOS technology by the RD53 collaboration, in order to face the unprecedented design requirements of the pixel 2 phase upgrades of the CMS and ATLAS experiments at CERN. This prototype chip is designed to demonstrate that a set of challenging specifications can be met, such as: high granularity (small pixels of 50×50 or 25× 100 µm2) and large pixel chip size (~2x2 cm2), high hit rate (3 GHz/cm2), high readout speed, very high radiation levels (500 Mrad - 1 Grad) and operation with serial powering. [...]
2019 - 4 p.
- Published in : 10.1109/NSSMIC.2018.8824486
In : 2018 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC 2018), Sydney, Australia, 10 - 17 Nov 2018, pp.8824486
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5.
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Development of a large pixel chip demonstrator in RD53 for ATLAS and CMS upgrades
/ Conti, Elia (CERN) ; Barbero, Marlon (Marseille, CPPM) ; Fougeron, Denis (Marseille, CPPM) ; Godiot, Stephanie (Marseille, CPPM) ; Menouni, Mohsine (Marseille, CPPM) ; Pangaud, Patrick (Marseille, CPPM) ; Rozanov, Alexandre (Marseille, CPPM) ; Breugnon, Patrick (Marseille, CPPM) ; Bomben, Marco (Paris U., VI-VII) ; Calderini, Giovanni (Paris U., VI-VII) et al.
/RD53
RD53A is a large scale 65 nm CMOS pixel demonstrator chip that has been developed by the RD53 collaboration for very high rate (3 GHz/cm$^2$) and very high radiation levels (500 Mrad, possibly 1 Grad) for ATLAS and CMS phase 2 upgrades. It features serial powering operation and design variations in the analog and digital pixel matrix for different testing purposes. [...]
SISSA, 2017 - 5 p.
- Published in : PoS TWEPP-17 (2017) 005
Fulltext: PDF; External link: PoS server
In : Topical Workshop on Electronics for Particle Physics, Santa Cruz, Ca, United States Of America, 11 - 15 Sep 2017, pp.005
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6.
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A 65 nm CMOS analog processor with zero dead time for future pixel detectors
/ Gaioni, L (INFN, Pavia ; Bergamo U.) ; Braga, D (Fermilab) ; Christian, D C (Fermilab) ; Deptuch, G (Fermilab) ; Fahim, F (Fermilab) ; Nodari, B (Bergamo U. ; APC, Paris ; INFN, Pavia) ; Ratti, L (INFN, Pavia ; Pavia U.) ; Re, V (INFN, Pavia ; Bergamo U.) ; Zimmerman, T (Fermilab)
Next generation pixel chips at the High-Luminosity (HL) LHC will be exposed to extremely high levels of radiation and particle rates. In the so-called Phase II upgrade, ATLAS and CMS will need a completely new tracker detector, complying with the very demanding operating conditions and the delivered luminosity (up to 5×10 34 cm −2 s −1 in the next decade). [...]
2017 - 4 p.
- Published in : Nucl. Instrum. Methods Phys. Res., A 845 (2017) 595-598
In : 14th Vienna Conference on Instrumentation, Vienna, Austria, 15 - 19 Feb 2016, pp.595-598
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7.
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Design of analog front-ends for the RD53 demonstrator chip
/ Gaioni, L (Bergamo U. ; INFN, Pavia) ; De Canio, F (Bergamo U. ; INFN, Pavia) ; Nodari, B (Bergamo U. ; INFN, Pavia) ; Manghisoni, M (Bergamo U. ; INFN, Pavia) ; Re, V (Bergamo U. ; INFN, Pavia) ; Traversi, G (Bergamo U. ; INFN, Pavia) ; Barbero, M B (Marseille, CPPM) ; Fougeron, D (Marseille, CPPM) ; Gensolen, F (Marseille, CPPM) ; Godiot, S (Marseille, CPPM) et al.
The RD53 collaboration is developing a large scale pixel front-end chip, which will be a tool to evaluate the performance of 65 nm CMOS technology in view of its application to the readout of the innermost detector layers of ATLAS and CMS at the HL-LHC. Experimental results of the characterization of small prototypes will be discussed in the frame of the design work that is currently leading to the development of the large scale demonstrator chip RD53A to be submitted in early 2017. [...]
SISSA, 2017 - 14 p.
- Published in : PoS Vertex 2016 (2017) 036
Fulltext: PDF; External link: PoS server
In : VERTEX 2016, La Biodola, Italy, 25 - 30 Sep 2016, pp.036
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8.
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Recent progress of RD53 Collaboration towards next generation Pixel Read-Out Chip for HL-LHC
/ Demaria, N (INFN, Turin) ; Barbero, M B (Marseille, CPPM) ; Fougeron, D (Marseille, CPPM) ; Gensolen, F (Marseille, CPPM) ; Godiot, S (Marseille, CPPM) ; Menouni, M (Marseille, CPPM) ; Pangaud, P (Marseille, CPPM) ; Rozanov, A (Marseille, CPPM) ; Wang, A (Marseille, CPPM) ; Bomben, M (Paris U., VI-VII) et al.
/RD53
This paper is a review of recent progress of RD53 Collaboration. Results obtained on the study of the radiation effects on 65 nm CMOS have matured enough to define first strategies to adopt in the design of analog and digital circuits. [...]
FERMILAB-CONF-16-622-PPD.-
2016
- Published in : JINST 11 (2016) C12058
IOP Open Access article: PDF;
In : International Workshop on Semiconductor Pixel Detectors for Particles and Imaging (PIXEL2016), Sestri Levante, Italy, 5 - 9 Sep 2016, pp.C12058
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9.
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SiD Letter of Intent
/ Aihara, H. (ed.) ; Burrows, P. (ed.) ; Oreglia, M. (ed.) ; Berger, E.L. (ed.) (Argonne) ; Guarino, V. (ed.) (Argonne) ; Repond, J. (ed.) (Argonne) ; Weerts, H. (ed.) (Argonne) ; Xia, L. (ed.) (Argonne) ; Zhang, J. (ed.) (Argonne) ; Zhang, Q. (ed.) (Argonne ; Beijing, Inst. High Energy Phys.) et al.
Letter of intent describing SiD (Silicon Detector) for consideration by the International Linear Collider IDAG panel. [...]
arXiv:0911.0006 ; SLAC-R-989 ; FERMILAB-LOI-2009-01 ; FERMILAB-PUB-09-681-E.
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2009. - 156 p.
Fermilab Library Server - SLAC Document Server - Full text
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10.
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Pixel Multichip Module Development at Fermilab
/ Turqueti, Marcos ; Andresen, J ; Appel, J A ; Cardoso, G ; Christian, D C ; Kwan, S W ; Prosser, A ; Uplegger, L
CERN, 2005
Published version from CERN: PDF; External link: Fulltext
In : 11th Workshop on Electronics for LHC and Future Experiments, Heidelberg, Germany, 12 - 16 Sep 2005, pp.205-208 (CERN-2005-011)
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