| Article | |
| Title | Forming limit diagram of annealed copper OFE thick sheets for optimized hydroforming of superconducting RF cavities |
| Author(s) | Gallifa-Terricabras, Adrià (CERN) ; Swieszek, Joanna Sylwia (CERN) ; Smakulska, Dorota (CERN) ; Ruiz-Palenzuela, Berta (CERN) ; Garlaschè, Marco (CERN) |
| Publication | 2024 |
| Number of pages | 14 |
| In: | Mater. Des. 244 (2024) 113191 |
| DOI | 10.1016/j.matdes.2024.113191 |
| Subject category | Accelerators and Storage Rings |
| Study | CERN FCC |
| Abstract | Coated superconducting radio-frequency (SRF) cavities are planned to be implemented in the Future Circular Collider (FCC) at the European Organization for Nuclear Research (CERN). The interest in industrialized and high-performance processes for fabrication of the corresponding copper substrates has thus risen. Tubular hydroforming is a well-known industrial process, but has not been thoroughly applied for ultra-pure oxygenfree electronic copper (Cu-OFE) thick products. To provide a feasibility analysis for the optimized fabrication process of copper substrate seamless cavities, a Forming Limit Diagram (FLD) of the material of interest was studied. In this paper, the methodology, test results and initial benchmark of the material model is presented, for 4 mm and 2 mm thick sheets. |
| Copyright/License | publication: © 2024 The Authors (License: CC-BY-4.0) |
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Записът е създаден на 2024-08-08, последна промяна на 2024-09-10
