Elsevier B.V. : The MAPS foil

Beolé, S.; Contin, G.; de Oliveira, R.; Mehl, B.; Sanna, I.; Ferry, S.; Junique, A.; di Mauro, A.; Carnesecchi, F.; Hillemanns, H.; Mager, M.; Rebane, K.; Reidt, F.; Lautner, L.; Šuljić, M.; Kluge, A.; Yüncü, A.

doi:10.1016/j.nima.2022.167673

Article
Report number	arXiv:2205.12669
Title	The MAPS foil
Author(s)	Beolé, S. (INFN, Turin ; Turin U.) ; Carnesecchi, F. (CERN) ; Contin, G. (INFN, Turin ; Turin U.) ; de Oliveira, R. (CERN) ; di Mauro, A. (CERN) ; Ferry, S. (CERN) ; Hillemanns, H. (CERN) ; Junique, A. (CERN) ; Kluge, A. (CERN) ; Lautner, L. (CERN ; Munich, Tech. U.) ; Mager, M. (CERN) ; Mehl, B. (CERN) ; Rebane, K. (CERN ; Tallinn U. Tech.) ; Reidt, F. (CERN) ; Sanna, I. (CERN ; Tech. U., Munich (main)) ; Šuljić, M. (CERN) ; Yüncü, A. (U. Heidelberg (main))
Publication	2022-10-27
Imprint	2022-05-25
Number of pages	4
In:	Nucl. Instrum. Methods Phys. Res., A 1046 (2023) 167673
DOI	10.1016/j.nima.2022.167673 (publication)
Subject category	physics.ins-det ; Detectors and Experimental Techniques
Abstract	We present a method of embedding a Monolithic Active Pixel Sensor (MAPS) into a flexible printed circuit board (FPC) and its interconnection by means of through-hole copper plating. The resulting assembly, baptised "MAPS foil", is a flexible, light, protected, and fully integrated detector module. By using widely available printed circuit board manufacturing techniques, the production of these devices can be scaled easily in size and volume, making it a compelling candidate for future large-scale applications. A first series of prototypes that embed the ALPIDE chip has been produced, functionally tested, and shown to be working.
Copyright/License	publication: © 2022-2025 The Authors (License: CC-BY-4.0) preprint: (License: CC BY 4.0)