| Article | |
| Title | Heat transfer at dielectric - metallic interfaces in the ultra-low temperature range |
| Author(s) | Liberadzka, J (CERN ; Twente U., Enschede) ; Golm, J (CERN) ; Koettig, T (CERN) ; Bremer, J (CERN) ; ter Brake, H J M (Twente U., Enschede) |
| Publication | 2019 |
| Number of pages | 5 |
| In: | IOP Conf. Ser. Mater. Sci. Eng. 502 (2019) 012133 |
| In: | 27th International Cryogenic Engineering Conference - International Cryogenic Materials Conference 2018, Oxford, United Kingdom, 3 - 7 Sep 2018, pp.012133 |
| DOI | 10.1088/1757-899x/502/1/012133 |
| Subject category | Accelerators and Storage Rings |
| Accelerator/Facility, Experiment | CERN AEgIS |
| Abstract | In the framework of the AEgIS project a series of steady state and dynamic heat transfer measurements at ultra-low temperatures was conducted in the Central Cryogenic Laboratory at CERN. Two sandwich setups, simulating the behaviour of ultra-cold AEgIS electrodes, were investigated and compared, namely: a sapphire − indium − copper and a sapphire − titanium − gold − indium − copper sandwich. The total thermal resistivity of both sandwich setups was evaluated as a function of the influence of normal and superconducting thin layers and multiple dielectric − metallic interfaces in terms of Kapitza resistance. The resulting limitations of the electrode’s design are presented. |
| Copyright/License | CC-BY-3.0 |
Corresponding record in: Inspire
Записът е създаден на 2022-07-26, последна промяна на 2022-07-26
