CERN Accelerating science

Article
Report number KEK-93-165
Title Development of novel fabrication techniques for a silicon microvertex detector unit using the flip-chip bonding method
Author(s) Saitô, Y ; Takeuchi, H ; Mandai, M ; Koseki, O ; Yoshino, T ; Kanazawa, H ; Yamanaka, J ; Miyahara, S ; Kamiya, M ; Fujita, Y ; Higashi, Y ; Ikeda, H ; Ikeda, M ; Koike, S ; Matsuda, T ; Ozaki, H ; Tanaka, M ; Tsuboyama, T ; Avrillon, S ; Okuno, S ; Haba, J ; Hanai, H ; Tatsumi, D ; Adachi, K ; Kawasaki, S ; Nagashima, Y ; Mori, S ; Yusa, K ; Fukunaga, C ; Matsushita, T ; Miyata, H ; Miyano, K
Publication 1993
Imprint Dec 1993
Number of pages 7
In: IEEE Trans. Nucl. Sci. 41, 4 (1994) pp.1192-1196
In: 40th IEEE Nuclear Science Symposium and Medical Imaging Conference, San Francisco, CA, USA, 30 Oct - 6 Nov 1993, pp.526-529
Subject category Detectors and Experimental Techniques

Corresponding record in: Inspire


 Record created 1994-02-21, last modified 2018-05-11


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