Home > Development of novel fabrication techniques for a silicon microvertex detector unit using the flip-chip bonding method |
Article | |
Report number | KEK-93-165 |
Title | Development of novel fabrication techniques for a silicon microvertex detector unit using the flip-chip bonding method |
Author(s) | Saitô, Y ; Takeuchi, H ; Mandai, M ; Koseki, O ; Yoshino, T ; Kanazawa, H ; Yamanaka, J ; Miyahara, S ; Kamiya, M ; Fujita, Y ; Higashi, Y ; Ikeda, H ; Ikeda, M ; Koike, S ; Matsuda, T ; Ozaki, H ; Tanaka, M ; Tsuboyama, T ; Avrillon, S ; Okuno, S ; Haba, J ; Hanai, H ; Tatsumi, D ; Adachi, K ; Kawasaki, S ; Nagashima, Y ; Mori, S ; Yusa, K ; Fukunaga, C ; Matsushita, T ; Miyata, H ; Miyano, K |
Publication | 1993 |
Imprint | Dec 1993 |
Number of pages | 7 |
In: | IEEE Trans. Nucl. Sci. 41, 4 (1994) pp.1192-1196 |
In: | 40th IEEE Nuclear Science Symposium and Medical Imaging Conference, San Francisco, CA, USA, 30 Oct - 6 Nov 1993, pp.526-529 |
Subject category | Detectors and Experimental Techniques |