| Article | |
| Report number | arXiv:1606.08747 |
| Title | Simulations of 3D-Si sensors for the innermost layer of the ATLAS pixel upgrade |
| Author(s) | Baselga, Marta (Barcelona, Inst. Microelectron.) ; Pellegrini, Giulio (Barcelona, Inst. Microelectron.) ; Quirion, David (Barcelona, Inst. Microelectron.) |
| Publication | 2017-03-01 |
| Imprint | 28 Jun 2016 |
| Number of pages | 10 |
| Note | Comments: 13 pages, 22 figures 13 pages, 22 figures |
| In: | Nucl. Instrum. Methods Phys. Res., A 847 (2017) 67-76 |
| DOI | 10.1016/j.nima.2016.11.033 |
| Subject category | Detectors and Experimental Techniques |
| Accelerator/Facility, Experiment | CERN LHC ; ATLAS |
| Abstract | The LHC is expected to reach luminosities up to 3000fb-1 and the innermost layer of the ATLAS upgrade plans to cope with higher occupancy and to decrease the pixel size. 3D-Si sensors are a good candidate for the innermost layer of the ATLAS pixel upgrade since they exhibit good performance under high fluences and the new designs will have smaller pixel size to fulfill the electronics expectations. This paper reports TCAD simulations of the 3D-Si sensors designed at IMB-CNM with non passing-through columns that are being fabricated for the next innermost layer of the ATLAS pixel upgrade, shows the charge collection response before and after irradiation, and the response of 3D-Si sensors located at large $\eta$ angles. |
| Copyright/License | Elsevier B.V. (License: arXiv nonexclusive-distrib. 1.0) |
Corresponding record in: Inspire
Record created 2016-06-29, last modified 2023-06-29
PDF