| Article | |
| Title | 3D electronics for hybrid pixel detectors – TWEPP-09 |
| Author(s) | Godiot, S (Marseille, CPPM) ; Barbero, (Bonn U.) ; Chantepie, B (Marseille, CPPM) ; Clémens, J C (Marseille, CPPM) ; Fei, R (Marseille, CPPM) ; Fleury, J (LBL, Berkeley) ; Fougeron, D (Marseille, CPPM) ; Garcia-Sciveres, M (LBL, Berkeley) ; Hemperek, T (Bonn U.) ; Karagounis, M (Bonn U.) ; Krueger, H (Bonn U.) ; Mekkaoui, A (LBL, Berkeley) ; Pangaud, P (Marseille, CPPM) ; Rozanov, A (Marseille, CPPM) ; Wermes, N (Bonn U.) |
| Publication | CERN, 2009 |
| In: | Proceedings of the Topical Workshop on Electronics for Particle Physics, pp.220 |
| DOI | 10.5170/CERN-2009-006.220 |
| Subject category | Detectors and Experimental Techniques |
| Abstract | Future hybrid pixel detectors are asking for smaller pixels in order to improve spatial resolution and to deal with an increasing counting rate. Facing these requirements is foreseen to be done by microelectronics technology shrinking. However, this straightforward approach presents some disadvantages in term of performances and cost. New 3D technologies offer an alternative way with the advantage of technology mixing. For the upgrade of ATLAS pixel detector, a 3D conception of the read-out chip appeared as an interesting solution. Splitting the pixel functionalities into two separate levels will reduce pixel size and open the opportunity to take benefit of technology's mixing. Based on a previous prototype of the read-out chip FE-I4 (IBM 130nm), this paper presents the design of a hybrid pixel read-out chip using threedimensional Tezzaron-Chartered technology. In order to disentangle effects due to Chartered 130nm technology from effects involved by 3D architecture, a first translation of FEI4 prototype had been designed at the beginning of this year in Chartered 2D technology, and first test results will be presented in the last part of this paper. |
Corresponding record in: Inspire
Δημιουργία εγγραφής 2010-01-22, τελευταία τροποποίηση 2018-02-09
