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Physics > Instrumentation and Detectors

arXiv:1110.6924 (physics)
[Submitted on 31 Oct 2011 (v1), last revised 21 Nov 2011 (this version, v2)]

Title:Development of Readout Interconnections for the Si-W Calorimeter of SiD

Authors:M. Woods, R. G. Fields, B. Holbrook, R. L. Lander, A. Moskaleva, C. Neher, J. Pasner, M. Tripathi, J. E. Brau, R. E. Frey, D. Strom, M. Breidenbach, D. Freytag, G. Haller, R. Herbst, T. Nelson, S. Schier, B. Schumm
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Abstract:The SiD collaboration is developing a Si-W sampling electromagnetic calorimeter, with anticipated application for the International Linear Collider. Assembling the modules for such a detector will involve special bonding technologies for the interconnections, especially for attaching a silicon detector wafer to a flex cable readout bus. We review the interconnect technologies involved, including oxidation removal processes, pad surface preparation, solder ball selection and placement, and bond quality assurance. Our results show that solder ball bonding is a promising technique for the Si-W ECAL, and unresolved issues are being addressed.
Comments: 8 pages + title, 6 figures
Subjects: Instrumentation and Detectors (physics.ins-det); High Energy Physics - Experiment (hep-ex)
Cite as: arXiv:1110.6924 [physics.ins-det]
  (or arXiv:1110.6924v2 [physics.ins-det] for this version)
  https://doi.org/10.48550/arXiv.1110.6924
Related DOI: https://doi.org/10.1088/1748-0221/6/12/C12050

Submission history

From: Michael Woods [view email]
[v1] Mon, 31 Oct 2011 19:55:11 UTC (1,125 KB)
[v2] Mon, 21 Nov 2011 06:16:32 UTC (1,869 KB)
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