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Development of active edge pixel sensors and four-side buttable modules using vertical integration technologies / Macchiolo, A. (Munich, Max Planck Inst.) ; Andricek, L. (Munich, Max Planck Inst. HLL) ; Moser, H.-G. (Munich, Max Planck Inst.) ; Nisius, R. (Munich, Max Planck Inst.) ; Richter, R.H. (Munich, Max Planck Inst. HLL) ; Terzo, S. (Munich, Max Planck Inst.) ; Weigell, P. (Munich, Max Planck Inst.)
We present an R&D; activity focused on the development of novel modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The modules consist of n-in-p pixel sensors, 100 or 200 $\mu$m thick, produced at VTT (Finland) with an active edge technology, which considerably reduces the dead area at the periphery of the device. [...]
arXiv:1310.4984; AIDA-CONF-2015-042.- 2014-11-21 - 6 p. - Published in : Nucl. Instrum. Methods Phys. Res., A 765 (2014) 53-58 Fulltext: PDF; Preprint: PDF; External link: Preprint
In : 9th International "Hiroshima" Symposium on the Development and Application of Semiconductor Tracking Detectors, Hiroshima, Japan, 2 - 6 Sep 2013, pp.53-58

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