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1.
New read-out electronics for ICARUS-T600 liquid Argon TPC. Description, simulation and tests of the new front-end and ADC system / ICARUS/NP01 Collaboration
The ICARUS T600, a liquid argon time projection chamber (LAr-TPC) detector mainly devoted to neutrino physics, underwent a major overhauling at CERN in 2016-2017, which included also a new design of the read-out electronics, in view of its operation in Fermilab on the Short Baseline Neutrino (SBN) beam from 2019. The new more compact electronics showed capability of handling more efficiently the signals also in the intermediate Induction 2 wire plane with a significant increase of signal to noise (S/N), allowing for charge measurement also in this view. [...]
arXiv:1805.03931; FERMILAB-PUB-18-211-ND.- 2018-12-04 - 16 p. - Published in : JINST 13 (2018) P12007 Fulltext: fulltext1672528 - PDF; fulltext1697671 - PDF; Fulltext from Publisher: PDF;
2.
The CMS experiment at the CERN LHC / CMS Collaboration
2008 - 361 p. - Published in : JINST 3 (2008) S08004 SISSA/IOP Open Access article: PDF;
In : The CERN Large Hadron Collider - Please contact the library if you need to access this document.
3.
Bonding of the Inner Tracker Silicon Microstrip Modules / Bosi, Filippo (INFN, Pisa) ; Brasolin, S (INFN, Turin) ; Brianzi, Mirko (INFN, Firenze) ; Cariola, P (INFN, Bari) ; Costa, Salvatore (INFN, Catania ; Catania U.) ; Demaria, Natale (INFN, Turin) ; Dumitrache, Floarea (INFN, Turin) ; Farano, R (INFN, Turin) ; Fiore, Luigi (INFN, Bari) ; Galet, G (INFN, Padova ; Padova U.) et al.
Microbonding of the CMS Tracker Inner Barrel (TIB) and Tracker Inner Disks (TID) modules was shared among six different Italian Institutes. The organization devised and the infrastructure deployed to handle this task is illustrated. [...]
CMS-NOTE-2008-024.- Geneva : CERN, 2008 - 27 p. Fulltext: PDF;
4.
Probing and irradiation tests of ALICE pixel chip wafers and sensors / Cinausero, M ; Fioretto, E ; Antinori, F ; Chochula, P ; Dinapoli, R ; Dima, R ; Fabris, D ; Galet, G ; Lunardon, M ; Manea, C et al.
In the framework of the ALICE Silicon Pixel Detector (SPD) project a system dedicated to the tests of the ALICE1LHCb chip wafers has been assembled and is now in use for the selection of pixel chips to be bump-bonded to sensor ladders. In parallel, radiation hardness tests of the SPD silicon sensors have been carried out using the 27 MeV proton beam delivered by the XTU TANDEM accelerator at the SIRAD facility in LNL. [...]
2004
In : 21st IEEE Instrumentation and Measurement Technology Conference, Como, Italy, 18 - 20 May 2004, pp.1823-7 (Vol.3)

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