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Sensor response and radiation damage effects for 3D pixels in the ATLAS IBL Detector
/ ATLAS Collaboration
Pixel sensors in 3D technology equip the outer ends of the staves of the Insertable B Layer (IBL), the innermost layer of the ATLAS Pixel Detector, which was installed before the start of LHC Run 2 in 2015. 3D pixel sensors are expected to exhibit more tolerance to radiation damage and are the technology of choice for the innermost layer in the ATLAS tracker upgrade for the HL-LHC programme. [...]
arXiv:2407.05716; CERN-EP-2024-156.-
Geneva : CERN, 2024-10-04 - 42 p.
- Published in : JINST 19 (2024) P10008
Fulltext: ANA-PIXE-2023-02-PAPER - PDF; 2407.05716 - PDF; document - PDF; External link: Previous draft version
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Serial Powering Scheme and Performance Analysis for Innermost Layer (L0) for ATLAS ITk modules
/ Samy, Md Arif Abdulla (Universita degli Studi di Trento and INFN (IT)) ; Pianori, Elisabetta (Lawrence Berkeley National Lab. (US)) ; Heim, Timon (Lawrence Berkeley National Lab. (US)) ; Thompson, Emily Anne (Lawrence Berkeley National Lab. (US)) ; Dalla Betta, Gian-Franco
/ATLAS Collaboration
After ten years of massive success, the Large Hadron Collider (LHC) at CERN is going for an upgrade to the next phase, the High Luminosity Large Hadron Collider (HL-LHC) which is planned to start its operation in 2029. This is expected to have a fine boost to its performance, with an instantaneous luminosity of 5.0×1034 cm-2s -1 (ultimate value 7.5×1034 cm-2s -1) with 200 average interactions per bunch crossing which will increase the fluences up to more than 1016 neq/cm2, resulting in high radiation damage in ATLAS detector [1]. [...]
ATL-ITK-SLIDE-2023-435.-
Geneva : CERN, 2023 - 1 p.
Fulltext: PDF; External link: Original Communication (restricted to ATLAS)
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Test of ITk 3D sensor pre-production modules with ITkPixv1.1 chip
/ Lapertosa, Alessandro (INFN e Universita Genova (IT)) ; Gemme, Claudia (INFN e Universita Genova (IT)) ; Ravera, Simone (INFN e Universita Genova (IT)) ; D M S, Sultan ; Dalla Betta, Gian Franco (Universita degli Studi di Trento and INFN (IT)) ; Gariano, Giuseppe (INFN e Universita Genova (IT)) ; Vannoli, Leonardo (INFN e Universita Genova (IT)) ; Samy, Md Arif Abdulla (Universita degli Studi di Trento and INFN (IT))
/ATLAS Collaboration
ITk detector, the new ATLAS tracking system at High Luminosity LHC, will be equipped with 3D pixel sensor modules in the innermost layer (L0). The pixel cell dimensions will be either 25x100 µm2 (barrel) or 50x50 µm2 (endcap), with one read-out electrode at the centre of a pixel and four bias electrodes at the corners. [...]
ATL-ITK-SLIDE-2022-278.-
Geneva : CERN, 2022 - 19 p.
Fulltext: PDF; External link: Original Communication (restricted to ATLAS)
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Characterization of planar and 3D Silicon pixel sensors for the high luminosity phase of the CMS experiment at LHC
/ Ceccarelli, Rudy (INFN, Florence ; Florence U.) ; Zuolo, Davide (INFN, Milan Bicocca ; Milan Bicocca U.) ; Meschini, Marco (INFN, Florence) ; Viliani, Lorenzo (Florence U. ; INFN, Florence) ; Dinardo, Mauro (INFN, Milan Bicocca ; Milan Bicocca U.) ; Gennai, Simone (CERN ; INFN, Pisa) ; Menasce, Dario (INFN, Milan Bicocca) ; Moroni, Luigi (INFN, Milan Bicocca ; Milan Bicocca U.) ; Demaria, Lino (INFN, Turin) ; Monteil, Ennio (INFN, Turin ; Turin U.) et al.
The High Luminosity upgrade of the CERN LHC collider (HL-LHC) demands for a new, high-radiation tolerant solid-state pixel sensor capable of surviving fluencies up to a few $10^{16}~ \rm{n_{eq}/cm^2}$ at $\sim 3 \, \rm{cm} $ from the interaction point.
To this extent the INFN ATLAS-CMS joint research activity, in collaboration with Fondazione Bruno Kessler (FBK), is aiming at the development of thin n-in-p type pixel sensors for the HL-LHC [...]
CMS-CR-2019-169.-
Geneva : SISSA, 2020 - 6 p.
- Published in : PoS EPS-HEP2019 (2020) 117
Fulltext: CR2019_169 - PDF; EPS-HEP2019_117 - PDF;
In : European Physical Society Conference on High Energy Physics (EPS-HEP) 2019, Ghent, Belgium, 10 - 17 Jul 2019, pp.117
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First Production of New Thin 3D Sensors for HL-LHC at FBK
/ Sultan, D.M.S. (U. Trento (main) ; TIFPA-INFN, Trento) ; Dalla Betta, Gian-Franco (U. Trento (main) ; TIFPA-INFN, Trento) ; Mendicino, Roberto (U. Trento (main) ; TIFPA-INFN, Trento) ; Boscardin, Maurizio (Fond. Bruno Kessler, Trento ; TIFPA-INFN, Trento) ; Ronchin, Sabina (Fond. Bruno Kessler, Trento ; TIFPA-INFN, Trento) ; Zorzi, Nicola (Fond. Bruno Kessler, Trento ; TIFPA-INFN, Trento)
Owing to their intrinsic (geometry dependent) radiation hardness, 3D pixel sensors are promising candidates for the innermost tracking layers of the forthcoming experiment upgrades at the Phase 2 High-Luminosity LHC (HL-LHC). To this purpose, extreme radiation hardness up to the expected maximum fluence of 2e16 neq.cm-2 must come along with several technological improvements in a new generation of 3D pixels, i.e., increased pixel granularity (50x50 or 25x100 um2 cell size), thinner active region (~100 um), narrower columnar electrodes (~5 um diameter) with reduced inter-electrode spacing (~30 um), and very slim edges (~100 um). [...]
arXiv:1612.00638.-
Geneva : CERN, 2017-01-09 - 8 p.
- Published in : JINST 12 (12) C01022
Fulltext: PDF; Preprint: PDF;
In : 18th International Workshop on Radiation Imaging Detectors, Barcelona, Spain, 03 - 07 Jul 2016, pp.C01022
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Thin and edgeless sensors for ATLAS pixel detector upgrade
/ Ducourthial, Audrey (Paris U., VI-VII) ; Bomben, Marco (Paris U., VI-VII) ; Calderini, Giovanni (Paris U., VI-VII) ; D'Eramo, Louis (Paris U., VI-VII) ; Marchiori, Giovanni (Paris U., VI-VII) ; Luise, Ilaria (Paris U., VI-VII) ; Bagolini, Alvise (Fond. Bruno Kessler, Povo) ; Boscardin, Maurizio (Fond. Bruno Kessler, Trento) ; Bosisio, Luciano (INFN, Trieste ; Trieste U.) ; Darbo, Giovanni (INFN, Genoa) et al.
To cope with the harsh environment foreseen at the high luminosity conditions of HL- LHC, the ATLAS pixel detector has to be upgraded to be fully efficient with a good granularity, a maximized geometrical acceptance and an high read out rate. LPNHE, FBK and INFN are involved in the development of thin and edgeless planar pixel sensors in which the insensitive area at the border of the sensor is minimized thanks to the active edge technology. [...]
arXiv:1710.03557.-
2017-12-19 - 10 p.
- Published in : JINST 12 (2017) C12038
In : The 11th International conference in Position Sensitive Detectors, Milton Keynes, United Kingdom, 3 - 8 Sep 2017, pp.C12038
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