|
1.
|
X-ray irradiation studies on the Monopix DMAPS in 150 nm and 180 nm
/ Bespin, Christian (Bonn U.) ; Barbero, Marlon (Marseille, CPPM) ; Barrillon, Pierre (Marseille, CPPM) ; Breugnon, Patrick (Marseille, CPPM) ; Caicedo, Ivan (Bonn U.) ; Degerli, Yavuz (IRFU, Saclay) ; Dingfelder, Jochen (Bonn U.) ; Hemperek, Tomasz (Bonn U. ; Unlisted, CH) ; Hirono, Toko (Bonn U. ; Unlisted, CH) ; Krüger, Hans (Bonn U.) et al.
Monolithic active pixel sensors with depleted substrates present a promising option for pixel detectors in high-radiation environments. High-resistivity silicon substrates and high bias voltage capabilities in commercial CMOS technologies facilitate depletion of the charge sensitive volume. [...]
arXiv:2506.04776.-
2025-06-13 - 4 p.
- Published in : Nucl. Instrum. Methods Phys. Res., A 1080 (2025) 170704
Fulltext: 2506.04776 - PDF; publication - PDF; document - PDF;
In : 17th Vienna Conference on Instrumentation (VCI2025), Vienna, Austria, 17 - 21 Feb 2025, pp.170704
|
|
|
2.
|
Passive CMOS Strip Sensors – Characterisation, Simulation and Test Beam Results
/ Zatocilova, Iveta (Freiburg U.) ; Arling, Jan-Hendrik (DESY) ; Baselga, Marta (Dortmund U.) ; Davis, Naomi (DESY) ; Diehl, Leena (Freiburg U. ; CERN) ; Dingfelder, Jochen (Bonn U.) ; Gregor, Ingrid-Maria (DESY) ; Hauser, Marc (Freiburg U.) ; Hemperek, Tomasz (Bonn U.) ; Hügging, Fabian (Bonn U.) et al.
In the passive CMOS Strips Project, strip sensors were designed by a collaboration of German institutes and produced at LFoundry in 150 nm technology. Up to five individual reticles were connected by stitching at the foundry in order to obtain the typical strip lengths required for the LHC Phase-II upgrade of ATLAS or CMS trackers. [...]
2024 - 6 p.
- Published in : PoS ICHEP2024 (2025) 1073
Fulltext: PDF;
In : 42nd International Conference on High Energy Physics (ICHEP 2024), Prague, Czech Republic, 18 - 24 Jul 2024, pp.1073
|
|
|
3.
|
Improvement in the Design and Performance of the Monopix2 Reticle-Scale DMAPS
/ Caicedo, Ivan (Bonn U.) ; Barbero, Marlon (Marseille, CPPM) ; Barrillon, Pierre (Marseille, CPPM) ; Bespin, Christian (Bonn U.) ; Berdalovic, Ivan (CERN) ; Breugnon, Patrick (Marseille, CPPM) ; Cardella, Roberto (CERN) ; Degerli, Yavuz (IRFU, Saclay) ; Dingfelder, Jochen (Bonn U.) ; de Acedo, Leyre Flores Sanz (CERN) et al.
“LF-Monopix2” and “TJ-Monopix2” are the second generation of “Monopix” Depleted Monolithic Active Pixel Sensor prototypes fabricated in 150 nm and 180 nm CMOS processes, respectively. Both devices implement a fully functional column-drain read-out architecture at a reticle-size scale, but differ on the concept used for pixel design. [...]
2024 - 13 p.
- Published in : JPS Conf. Proc. 42 (2024) 011021
Fulltext: PDF;
In : The International Workshop on Vertex Detectors (VERTEX 2022), Tateyama, Japan, 24 - 28 Oct 2022, pp.011021
|
|
|
4.
|
Recent results and perspectives of the Monopix Depleted Monolithic Active Pixel Sensors (DMAPS)
/ Hügging, Fabian (Bonn U.) ; Barbero, Marlon (Marseille, CPPM) ; Barrilon, Pierre (Marseille, CPPM) ; Bespin, Christian (Bonn U.) ; Breugnon, Patrick (Marseille, CPPM) ; Caicedo, Ivan (Bonn U.) ; Degerli, Yavuz (IRFU, Saclay) ; Dingfelder, Jochen (Bonn U.) ; Hemperek, Tomasz (Bonn U.) ; Hirono, Toko (Bonn U.) et al.
The integration of readout electronics and sensors into a single entity of silicon in monolithic pixel detectors lowers the material budget while simplifying the production procedure compared to the conventional hybrid pixel detector concept. The increasing availability of high-resistivity substrates and high-voltage capabilities in commercial CMOS processes facilitates the application of depleted monolithic active pixel sensors (DMAPS) in modern particle physics experiments. [...]
2024 - 3 p.
- Published in : Nucl. Instrum. Methods Phys. Res., A 1070 (2025) 170007
Fulltext: PDF;
In : 16th Pisa Meeting on Advanced Detectors (Pisameet 2024), La Biodola, Isola D'elba, Italy, 26 May - 1 Jun 2024, pp.170007
|
|
|
5.
|
RD53 pixel chips for the ATLAS and CMS Phase-2 upgrades at HL-LHC
/ Loddo, F (INFN, Bari) ; Andreazza, A (Milan U. ; INFN, Milan) ; Arteche, F (Sao Paulo, Inst. Tech. Aeronautics) ; Barbero, M B (Marseille, CPPM) ; Barillon, P (Marseille, CPPM) ; Beccherle, R (INFN, Pisa) ; Bilei, G M (INFN, Perugia ; Perugia U.) ; Bjalas, W (CERN) ; Bonaldo, S (INFN, Padua ; Padua U.) ; Bortoletto, D (Oxford U.) et al.
The Phase-2 upgrades at the High-Luminosity LHC of ATLAS and CMS experiments at CERN will require a new tracker with readout electronics operating in extremely harsh radiation environment (1 Grad), high hit rate (3.5 GHz/cm2) and high data rate readout (5 Gb/s). The RD53 collaboration is a joint effort between the ATLAS and CMS to qualify the chosen 65 nm CMOS technology in high radiation environment and develop the pixel readout chips of both experiments. [...]
FERMILAB-PUB-24-0469-PPD.-
2024 - 5 p.
- Published in : Nucl. Instrum. Methods Phys. Res., A 1067 (2024) 169682
In : PSD13: The 13th International Conference on Position Sensitive Detectors, Oxford, United Kingdom, 3 - 9 Sep 2023, pp.169682
|
|
|
6.
|
Cross-talk of a large-scale depleted monolithic active pixel sensor (DMAPS) in 180nm CMOS technology
/ Schall, Lars (Bonn U.) ; Bespin, Christian (Bonn U.) ; Caicedo, Ivan (Bonn U.) ; Dingfelder, Jochen (Bonn U.) ; Hemperek, Tomasz (Bonn U.) ; Hirono, Toko (Bonn U.) ; Hügging, Fabian (Bonn U.) ; Krüger, Hans (Bonn U.) ; Moustakas, Konstantinos (Bonn U.) ; Pernegger, Heinz (CERN) et al.
Monolithic pixel detectors combine readout electronics and sensor in a single entity of silicon, which simplifies the production procedure and lowers the material budget compared to conventional hybrid pixel detector concepts. Benefiting from the advances in commercial CMOS processes towards large biasing voltage capabilities and the increasing availability of high-resistivity substrates, depleted monolithic active pixel sensors (DMAPS) are able to cope with the high-rate and high-radiation environments faced in modern high-energy physics experiments. [...]
arXiv:2402.12153.-
2024-04-19 - 7 p.
- Published in : Nucl. Instrum. Methods Phys. Res., A 1064 (2024) 169381
Fulltext: Publication - PDF; 2402.12153 - PDF;
In : 13th International "Hiroshima" Symposium on the Development and Application of Semiconductor Tracking Detectors, Vancouver, Canada, 3 - 8 Dec 2023, pp.169381
|
|
|
7.
|
RD53 Pixel Readout Integrated Circuits for ATLAS and CMS HL-LHC Upgrades
/ RD53 Collaboration
The RD53 collaboration has since 2013 developed new hybrid pixel detector chips with 50x50um$^2$ pixels for the HL-LHC upgrades of the ATLAS and CMS experiments at CERN. A common architecture, design and verification framework has been developed to enable final pixel chips with different chip sizes to be designed, verified and tested to handle extreme hit rates of 3GHz/cm$^2$ (12GHz per chip) together with significantly increased trigger rate of 1MHz and efficient readout of up to 5.12Gbits/s per pixel chip. [...]
CERN-RD53-PUB-24-002.-
Geneva : CERN, 2025 - 70.
- Published in : JINST 20 (2025) P03024
Latex source folder zipped: ZIP; Publication: PDF;
|
|
|
8.
|
Characterisation and simulation of stitched CMOS strip sensors
/ Davis, Naomi (DESY) ; Arling, Jan-Hendrik (DESY) ; Baselga, Marta (Dortmund U.) ; Diehl, Leena (Freiburg U. ; CERN) ; Dingfelder, Jochen (Bonn U.) ; Gregor, Ingrid-Maria (DESY) ; Hauser, Marc (Freiburg U.) ; Hügging, Fabian (Bonn U.) ; Hemperek, Tomasz (Bonn U. ; Unlisted, CH) ; Jakobs, Karl (Freiburg U.) et al.
In high-energy physics, there is a need to investigate alternative silicon sensor concepts that offer cost-efficient, large-area coverage. Sensors based on CMOS imaging technology present such a silicon sensor concept for tracking detectors. [...]
arXiv:2405.08667.-
2024-04-29 - 4 p.
Fulltext: 2405.08667 - PDF; Publication - PDF;
In : 13th International "Hiroshima" Symposium on the Development and Application of Semiconductor Tracking Detectors, Vancouver, Canada, 3 - 8 Dec 2023, pp.169407
|
|
|
9.
|
Charge collection and efficiency measurements of the TJ-Monopix2 DMAPS in 180 nm CMOS technology
/ Bespin, Christian (Bonn U.) ; Caicedo, Ivan (Bonn U.) ; Dingfelder, Jochen Christian (Bonn U.) ; Hemperek, Tomasz (Bonn U. ; DECTRIS Baden) ; Hirono, Toko (Bonn U. ; DESY) ; Hügging, Fabian (Bonn U.) ; Krüger, Hans (Bonn U.) ; Moustakas, Konstantinos (Bonn U. ; PSI, Villigen) ; Pernegger, Heinz (CERN) ; Riedler, Petra (CERN) et al.
Monolithic CMOS pixel detectors have emerged as competitive contenders in the field of high-energy particle physics detectors. By utilizing commercial processes they offer high-volume production of such detectors. [...]
arXiv:2301.13638.-
2023 - 8 p.
- Published in : PoS: Pixel2022 (2023) , pp. 080
Fulltext: document - PDF; 2301.13638 - PDF;
In : International Workshop on Semiconductor Pixel Detectors for Tracking and Imaging (PIXEL 2022), Santa Fe, USA, 11 - 16 Dec 2022, pp.080
|
|
|
10.
|
Single event effects testing of the RD53B chip
/ Menouni, Mohsine (Marseille, CPPM) ; Barrillon, Pierre (Marseille, CPPM) ; Flores, Leyre (CERN) ; Fougeron, Denis (Marseille, CPPM) ; Hemperek, Tomasz (Bonn U.) ; Joly, Eva (Marseille, CPPM) ; Lalic, Jelena (CERN) ; Strebler, Thomas (Marseille, CPPM)
The RD53 collaboration has been working since 2014 on the development of pixel chips for the CMS and ATLAS Phase 2 tracker upgrade. This work has recently led to the development of the RD53B full-scale readout chip which is using the 65nm CMOS process and containing 153600 pixels of 50 × 50 μm
$^{2}$ The RD53B chip is designed to be robust against the Single Event Effects (SEE), allowing such a complex chip to operate reliably in the hostile environment of the HL-LHC. [...]
2022 - 5 p.
- Published in : J. Phys. : Conf. Ser. 2374 (2022) 012084
Fulltext: PDF;
In : International Conference on Technology and Instrumentation in Particle Physics (TIPP 2021), Online, Canada, 24 - 29 May 2021, pp.012084
|
|
email alert
or subscribe to the 
RSS feed.