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1.
Reusable Verification Components for High-Energy Physics readout ASICs / Lupi, M. (CERN) ; Esposito, S. (CERN) ; Llopart-Cudie, X. (CERN) ; Pulli, A. (CERN) ; Scarfí, S. (CERN) ; Kharwadkar, N. (Fermilab)
Verification is a critical aspect of designing front-end (FE) readout ASICs for High-Energy Physics (HEP) experiments. [...]
FERMILAB-PUB-24-0828 ; arXiv:2411.03478.
- 5.
Fermilab Library Server - Fulltext - Fulltext
2.
RD53 pixel chips for the ATLAS and CMS Phase-2 upgrades at HL-LHC / Loddo, F (INFN, Bari) ; Andreazza, A (Milan U. ; INFN, Milan) ; Arteche, F (Sao Paulo, Inst. Tech. Aeronautics) ; Barbero, M B (Marseille, CPPM) ; Barillon, P (Marseille, CPPM) ; Beccherle, R (INFN, Pisa) ; Bilei, G M (INFN, Perugia ; Perugia U.) ; Bjalas, W (CERN) ; Bonaldo, S (INFN, Padua ; Padua U.) ; Bortoletto, D (Oxford U.) et al.
The Phase-2 upgrades at the High-Luminosity LHC of ATLAS and CMS experiments at CERN will require a new tracker with readout electronics operating in extremely harsh radiation environment (1 Grad), high hit rate (3.5 GHz/cm2) and high data rate readout (5 Gb/s). The RD53 collaboration is a joint effort between the ATLAS and CMS to qualify the chosen 65 nm CMOS technology in high radiation environment and develop the pixel readout chips of both experiments. [...]
FERMILAB-PUB-24-0469-PPD.- 2024 - 5 p. - Published in : Nucl. Instrum. Methods Phys. Res., A 1067 (2024) 169682
In : PSD13: The 13th International Conference on Position Sensitive Detectors, Oxford, United Kingdom, 3 - 9 Sep 2023, pp.169682
3.
High-rate, high-resolution single photon X-ray imaging: Medipix4, a large 4-side buttable pixel readout chip with high granularity and spectroscopic capabilities / Sriskaran, Viros (CERN) ; Alozy, Jerome (CERN) ; Ballabriga, Rafael (CERN) ; Campbell, Michael (CERN) ; Christodoulou, Pinelopi (CERN ; CTU, Prague) ; Heijne, Erik (CTU, Prague) ; Koukab, Adil (Ecole Polytechnique, Lausanne) ; Kugathasan, Thanushan (CERN) ; Llopart, Xavier (CERN) ; Piller, Markus (CERN ; Graz, Tech. U.) et al.
The Medipix4 chip is the latest member in the Medipix/Timepix family of hybrid pixel detector chips aimed at high-rate spectroscopic X-ray imaging using high-Z materials. It can be tiled on all 4 sides making it ideal for constructing large-area detectors with minimal dead area. [...]
arXiv:2310.10188.- 2024-02-16 - 15 p. - Published in : JINST 19 (2024) P02024 Fulltext: 2310.10188 - PDF; Publication - PDF;
4.
Total ionizing dose effects on ring-oscillators and SRAMs in a commercial 28 nm CMOS technology / Borghello, G (CERN) ; Bergamin, G (CERN) ; Ceresa, D (CERN) ; Pejašinović, R (CERN) ; Diaz, F P (CERN) ; Kloukinas, K (CERN) ; Pulli, A (CERN) ; Ripamonti, G (CERN) ; Caratelli, A (CERN) ; Andorno, M (CERN)
A test chip with 368 ring-oscillators and 4 different SRAMs has been designed to study the effect of total ionizing dose on a commercial 28 nm CMOS technology. The chip has been exposed to 1 Grad(SiO$_{2}$), followed by a week of annealing at T = 100 °C. [...]
2023 - 8 p. - Published in : JINST

In : Topical Workshop on Electronics for Particle Physics 2022 (TWEPP 2022), Bergen, Norway, 19 - 23 Sep 2022, pp.C02003
5.
SEU injection framework for radiation-tolerant ASICs, a formal verification approach / Lupi, M (CERN) ; Pulli, A (CERN)
Single Event Upsets (SEUs) represent a major challenge for digital electronics operated in a radiation environment. Triple Modular Redundancy (TMR) is one of the most popular approaches to increase digital electronics resilience to SEUs. [...]
2023 - 7 p. - Published in : JINST 18 (2023) C02023
In : Topical Workshop on Electronics for Particle Physics 2022 (TWEPP 2022), Bergen, Norway, 19 - 23 Sep 2022, pp.C02023
6.
A simulation methodology for verification of transient fault tolerance of ASICs designed for high-energy physics experiments / Pulli, A (CERN) ; Lupi, M (CERN)
Transient fault tolerance verification is a crucial step in the design of radiation-tolerant ASICs for high-energy physics experiments. In this paper, we discuss a methodical approach toward the verification of transient fault tolerance of ASICs using industry-standard methodologies and tools. [...]
2023 - 7 p. - Published in : JINST 18 (2023) C01038
In : Topical Workshop on Electronics for Particle Physics 2022 (TWEPP 2022), Bergen, Norway, 19 - 23 Sep 2022, pp.C01038
7.
Development of a Stitched Monolithic Pixel Sensor prototype (MOSS chip) towards the ITS3 upgrade of the ALICE Inner Tracking system / Vicente Leitao, P (CERN) ; Aglieri Rinella, G (CERN) ; Bugiel, S (Strasbourg, IPHC) ; Cecconi, L (CERN) ; de Melo, J L A (CERN) ; De Robertis, G (INFN, Bari ; Bari U.) ; Deng, W (CERN ; Hua-Zhong Normal U.) ; Dorda Martin, A (CERN ; KIT, Karlsruhe) ; Dorosz, P (CERN) ; Fang, X (Strasbourg, IPHC) et al.
The MOnolithic Stitched Sensor (MOSS) is a development prototype chip towards the ITS3 vertexing detector for the ALICE experiment at the LHC. Designed using a 65 nm CMOS Imaging technology, it aims at profiting from the stitching technique to construct a single-die monolithic pixel detector of 1.4 cm × 26 cm. [...]
2023 - 8 p. - Published in : JINST 18 (2023) C01044
In : Topical Workshop on Electronics for Particle Physics 2022 (TWEPP 2022), Bergen, Norway, 19 - 23 Sep 2022, pp.C01044
8.
Book cover lpGBT documentation : release
12 Aug 2024. - 359 p.

9.
Verification methodology of a multi-mode radiation-hard high-speed transceiver ASIC / Pulli, A (CERN) ; Kremastiotis, I (CERN) ; Kulis, S (CERN)
The second version of Low Power Giga Bit Transceiver (lpGBTv1) addresses the functional and radiation-related issues discovered during the testing of lpGBTv0 prototype. Considerable changes to the chip configuration architecture and flow were required. [...]
2022 - 6 p. - Published in : JINST 17 (2022) C03008

In : TWEPP 2021 Topical Workshop on Electronics for Particle Physics, Online, Online, 20 - 24 Sep 2021, pp.C03008

See also: similar author names
6 Pulli, A
3 Pulli, Adithya
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