CERN Accelerating science

CERN Document Server Намерени са 1 записа  Търсенето отне 1.33 секунди. 
1.
Transient current technique for charged traps detection in silicon bonded interfaces / Bronuzzi, J (CERN ; Ecole Polytechnique, Lausanne) ; Bouvet, D. (Ecole Polytechnique, Lausanne) ; Charrier, C. (CEA-DTA-LETI, Grenoble) ; Fournel, F. (CEA-DTA-LETI, Grenoble) ; García, M.F. (CERN ; Cantabria Inst. of Phys.) ; Mapelli, A. (CERN) ; Moll, M. (CERN) ; Rouchouze, E. (CEA-DTA-LETI, Grenoble) ; Sallese, J.M. (Ecole Polytechnique, Lausanne)
Wafer bonding is an established technology for the manufacturing of silicon-on-insulator (SOI) substrates, micro-electromechanical systems (MEMS) and microfluidic devices. Low temperature direct bonding techniques can be of particular interest for the fabrication of monolithic radiation sensors. [...]
2019 - Published in : AIP Adv. 9 (2019) 025307 Fulltext: PDF;

Интересувате ли се от уведомяване за нови резултати по тази заявка?
Set up a personal email alert or subscribe to the RSS feed.
Не намерихте, каквото търсите? Опитайте търсене в други сървъри:
Fournel, F. в Amazon
Fournel, F. в CERN EDMS
Fournel, F. в CERN Intranet
Fournel, F. в CiteSeer
Fournel, F. в Google Books
Fournel, F. в Google Scholar
Fournel, F. в Google Web
Fournel, F. в IEC
Fournel, F. в IHS
Fournel, F. в INSPIRE
Fournel, F. в ISO
Fournel, F. в KISS Books/Journals
Fournel, F. в KISS Preprints
Fournel, F. в NEBIS
Fournel, F. в SLAC Library Catalog
Fournel, F. в Scirus