Hem > CERN Departments > Physics (PH) > EP-R&D Programme on Technologies for Future Experiments > EP-R&D Programme on Technologies for Future Experiments (EP RDET) > Development of novel low-mass module concepts based on MALTA monolithic pixel sensors |
Article | |
Report number | arXiv:2303.05792 |
Title | Development of novel low-mass module concepts based on MALTA monolithic pixel sensors |
Author(s) | Weick, J. (CERN ; Darmstadt, Tech. Hochsch.) ; Dachs, F. (CERN) ; Riedler, P. (CERN) ; Pinto, M. Vicente Barreto (Geneva U.) ; Zoubir, A.M. (Darmstadt, Tech. Hochsch.) ; de Acedo, L. Flores Sanz (CERN) ; Asensi Tortajada, I. (CERN) ; Dao, V. (CERN) ; Dobrijevic, D. (CERN ; Zagreb U.) ; Pernegger, H. (CERN) ; Van Rijnbach, M. (CERN ; Oslo U.) ; Sharma, A. (CERN) ; Solans Sanchez, C. (CERN) ; de Oliveira, R. (CERN) ; Dannheim, D. (CERN) ; Schmidt, J.V. (CERN ; KIT, Karlsruhe) |
Publication | 2023-04-03 |
Imprint | 2023-03-10 |
Number of pages | 5 |
Note | 5 pages + 1 page references,8 figures |
In: | JINST 18 (2023) C04003 |
DOI | 10.1088/1748-0221/18/04/C04003 |
Subject category | hep-ex ; Particle Physics - Experiment ; physics.ins-det ; Detectors and Experimental Techniques |
Project | CERN-EP-RDET |
Abstract | The MALTA CMOS monolithic silicon pixel sensors has been developed in the Tower 180 nm CMOS imaging process. It includes an asynchronous readout scheme and complies with the ATLAS inner tracker requirements for the HL-LHC. Several 4-chip MALTA modules have been built using Al wedge wire bonding to demonstrate the direct transfer of data from chip-to-chip and to read out the data of the entire module via one chip only. Novel technologies such as Anisotropic Conductive Films (ACF) and nanowires have been investigated to build a compact module. A lightweight flex with 17 μm trace spacing has been designed, allowing compact packaging with a direct attachment of the chip connection pads to the flex using these interconnection technologies. This contribution shows the current state of our work towards a flexible, low material, dense and reliable packaging and modularization of pixel detectors. |
Copyright/License | publication: © 2023-2025 IOP Publishing Ltd and Sissa Medialab preprint: (License: CC BY 4.0) |